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93LC66C-I/MS

Microchip Technology

93LC66C-I/MS by Microchip Technology

93LC66C-I/MS by Microchip Tech is a 256x16 EEPROM with 3MHz clock freq. Ideal for industrial temp applications, it offers 1M write/erase cycles, MICROWIRE serial bus, and software write protection. Operating at 3V, it has a standby current of 0.000001A and can withstand -40 to 85°C temps.

Median Price

$0.410

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 8,912 parts In-Stock

1+ parts

$0.410

100+ parts

$0.370

1k+ parts

$0.350

10k+ parts

$0.340

8,912

$0.410

$0.370

$0.350

$0.340

DigiKey

USA . 993 parts In-Stock

1+ parts

$0.410

100+ parts

$0.378

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-

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993

$0.410

$0.378

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Mouser Electronics

USA . 653 parts In-Stock

1+ parts

$0.410

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$0.378

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-

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653

$0.410

$0.378

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Distributors (In-Stock)

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Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$0.390

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650

$0.390

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NAC Semi

USA . 7,200 parts In-Stock

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$0.420

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$0.380

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$0.340

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7,200

$0.420

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$0.340

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Vyrian

USA . 3,569 parts In-Stock

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3,569

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Semi Source

USA . 2,500 parts In-Stock

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2,500

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VNN

France . 438 parts In-Stock

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438

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Distributors (Availability)

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Ampacity Inc.

Singapore . 166 parts In-Stock

1+ parts

$0.348

100+ parts

-

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166

$0.348

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Argo Parts USA

USA . 2,771 parts In-Stock

1+ parts

$0.390

100+ parts

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$0.378

2,771

$0.390

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-

$0.378

Netroflash

USA . 500 parts In-Stock

1+ parts

$0.390

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-

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500

$0.390

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Continental Prestige Electronics

USA . 86 parts In-Stock

1+ parts

$0.390

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$0.382

86

$0.390

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$0.382

West Coast Incorporated

USA . 761 parts In-Stock

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761

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Perfect Parts

USA . 143 parts In-Stock

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143

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Overview

Experience the exceptional quality and reliability of the 93LC66C-I/MS EEPROM by Microchip Technology. With a focus on TS 16949 screening for superior performance, this small outline memory device offers 256x16 organization and 1000000 write/erase cycles for long-lasting use in industrial applications. Benefit from its low power consumption, software write protection, and fast operation at up to 3 MHz clock frequency. Trust Microchip Technology to deliver cutting-edge technology and value with every product, making the 93LC66C-I/MS an essential component for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material makes the package durable and resistant to external elements, ensuring the longevity of the product.

Surface Mount: YES

Surface mount feature allows for easy installation on PCBs, saving space and making the integration process more efficient.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes the EEPROM energy-efficient and suitable for low-power applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the EEPROM reliable and efficient.

Memory IC Type: EEPROM

Being an EEPROM type, this product offers non-volatile memory storage, allowing data retention even when power is removed.

Technical Specifications

EEPROM 93LC66C-I/MS attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Additional Features:

ALSO CONFIGURABLE AS 512 X 8

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

3 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X16

Output Characteristics:

TOTEM POLE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Ready or Busy:

YES

Reverse Pinout:

NO

Screening Level:

TS 16949

Maximum Seated Height:

1.1 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Toggle Bit:

YES

Width:

3 mm

Maximum Write Cycle Time (tWC):

6 ms

Write Protection:

SOFTWARE

Trade Compliance

93LC66C-I/MS Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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