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93LC56BT-I/SN15KVAO

Microchip Technology

93LC56BT-I/SN15KVAO by Microchip Technology

93LC56BT-I/SN15KVAO by Microchip Technology is a 128x16 EEPROM with 2048-bit memory density. Operating at 3V, it offers a max clock frequency of 2MHz and endurance of 1M cycles. Ideal for industrial applications requiring reliable non-volatile memory in small outline packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,129 parts In-Stock

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VNN

France . 1,464 parts In-Stock

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1,464

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,522 parts In-Stock

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$1.000

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1,522

$1.000

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$5.123

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$4.867

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$4.867

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600

$5.123

$4.867

$4.867

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Corohmni

South Africa . 58 parts In-Stock

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$5.289

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58

$5.289

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Aztec Data Supply Inc.

USA . 3,256 parts In-Stock

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$5.520

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$5.520

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AZTECH Wire

Italy . 881 parts In-Stock

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$19.330

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881

$19.330

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Semicontronic

India . 830 parts In-Stock

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$29.000

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$28.275

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$28.130

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830

$29.000

$28.275

$28.130

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QUARKTWIN TECHNOLOGY LTD

USA . 15,991 parts In-Stock

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Argo Parts USA

USA . 3,048 parts In-Stock

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Continental Prestige Electronics

USA . 2,501 parts In-Stock

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Microchip USA

USA . 2,482 parts In-Stock

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Marpe Global Electronics

Taiwan . 2,264 parts In-Stock

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QualityLine Systems

Poland . 2,264 parts In-Stock

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XL Components Corporation

Australia . 2,264 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Unlock endless possibilities with the 93LC56BT-I/SN15KVAO by Microchip Technology, a top-of-the-line EEPROM designed to exceed expectations. This innovative product offers unparalleled quality and reliability, crafted by a manufacturer known for cutting-edge technology. Perfect for a wide range of applications, this EEPROM provides seamless operation and exceptional performance. Experience the value and advantages it brings, from enhanced functionality to increased efficiency. Elevate your projects with the 93LC56BT-I/SN15KVAO and discover a world of limitless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the EEPROM, making it suitable for various environmental conditions.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures efficient communication and reliable data transmission within the system.

Nominal Supply Voltage / Vsup (V): 3

The nominal supply voltage of 3V is common and compatible with many electronic systems, making integration straightforward.

Write Protection: HARDWARE/SOFTWARE

The availability of both hardware and software write protection options adds an extra layer of security to prevent accidental data modification.

Parallel or Serial: SERIAL

Serial communication allows for simplified data transfer and integration with a wide range of devices.

Endurance: 1000000 Write/Erase Cycles

With a high endurance rating, this EEPROM can withstand frequent read/write operations, ensuring longevity and reliability.

Technical Specifications

EEPROM 93LC56BT-I/SN15KVAO attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.75 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000001 Amp

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

6 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

93LC56BT-I/SN15KVAO Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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