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25LC256T-I/MF

Microchip Technology

25LC256T-I/MF by Microchip Technology

25LC256T-I/MF by Microchip Technology is a 32KX8 EEPROM with SPI interface. Operating at 4.5V, it offers 1000000 Write/Erase Cycles and -40 to 85 °C temperature range. Ideal for industrial applications requiring reliable non-volatile memory storage.

Median Price

$1.820

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,100 parts In-Stock

1+ parts

$1.820

100+ parts

$1.680

1k+ parts

$1.600

10k+ parts

$1.500

1,100

$1.820

$1.680

$1.600

$1.500

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 1,100 parts In-Stock

1+ parts

$2.110

100+ parts

$1.900

1k+ parts

$1.710

10k+ parts

-

1,100

$2.110

$1.900

$1.710

-

Nova Conductors

Japan . 37 parts In-Stock

1+ parts

$2.170

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-

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37

$2.170

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Vyrian

USA . 7,061 parts In-Stock

1+ parts

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7,061

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VNN

France . 2,639 parts In-Stock

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2,639

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 649 parts In-Stock

1+ parts

$1.550

100+ parts

-

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649

$1.550

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$2.170

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2,000

$2.170

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AZTECH Wire

Italy . 399 parts In-Stock

1+ parts

$19.830

100+ parts

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399

$19.830

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QUARKTWIN TECHNOLOGY LTD

USA . 15,099 parts In-Stock

1+ parts

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15,099

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Microchip USA

USA . 4,774 parts In-Stock

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4,774

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Marpe Global Electronics

Taiwan . 3,386 parts In-Stock

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3,386

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XL Components Corporation

Australia . 3,061 parts In-Stock

1+ parts

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3,061

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QualityLine Systems

Poland . 1,497 parts In-Stock

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1,497

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Overview

Discover the cutting-edge 25LC256T-I/MF EEPROM by Microchip Technology, a leading manufacturer known for top-quality components. This versatile memory device offers endless possibilities in various applications, ensuring high performance and reliability. With advanced features like hardware/software write protection and impressive endurance of 1,000,000 write/erase cycles, this EEPROM provides exceptional value to customers seeking dependable memory solutions. Trust Microchip Technology to deliver superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the EEPROM chip, making it reliable for long-term use.

Surface Mount: YES

Allows for easy and convenient installation on a circuit board.

Operating Mode: SYNCHRONOUS

Enables efficient communication and data transfer between the EEPROM and other components in the system.

Nominal Supply Voltage / Vsup (V): 4.5

Optimal voltage supply for stable performance of the EEPROM chip.

Write Protection: HARDWARE/SOFTWARE

Ensures data integrity by allowing the EEPROM to be protected from unauthorized write operations.

Maximum Operating Temperature: 85 °C

Can operate in environments with higher temperatures without compromising performance.

Memory Density: 262144 bit

Offers a large memory capacity for storing data and programming code efficiently.

Endurance: 1000000 Write/Erase Cycles

High endurance rating ensures longevity and reliability of the EEPROM chip.

Serial Bus Type: SPI

Utilizes the Serial Peripheral Interface for enhanced data transmission speed and efficiency.

Technical Specifications

EEPROM 25LC256T-I/MF attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

10 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

6 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Programming Voltage (V):

2.5

Qualification:

Not Qualified

Reverse Pinout:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

6 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

25LC256T-I/MF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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