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24FC512-I/ST14

Microchip Technology

24FC512-I/ST14 by Microchip Technology

24FC512-I/ST14 by Microchip Technology is a 64KX8 EEPROM with I2C control byte 1010DDDR. Operating at 1 MHz, it has a memory density of 524288 bit and can endure 1000000 write/erase cycles. Ideal for industrial applications, it offers hardware write protection and operates in the -40 to 85 °C temperature range.

Median Price

$2.000

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 768 parts In-Stock

1+ parts

$2.000

100+ parts

$1.850

1k+ parts

$1.750

10k+ parts

$1.650

768

$2.000

$1.850

$1.750

$1.650

DigiKey

USA . 92 parts In-Stock

1+ parts

$2.000

100+ parts

$1.960

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-

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92

$2.000

$1.960

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Mouser Electronics

USA . 26 parts In-Stock

1+ parts

$2.130

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26

$2.130

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Distributors (In-Stock)

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$2.019

100+ parts

-

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200

$2.019

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NAC Semi

USA . 576 parts In-Stock

1+ parts

$2.150

100+ parts

$1.940

1k+ parts

$1.750

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576

$2.150

$1.940

$1.750

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Vyrian

USA . 3,602 parts In-Stock

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3,602

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VNN

France . 1,364 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 69 parts In-Stock

1+ parts

$1.550

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69

$1.550

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Semicontronic

India . 296 parts In-Stock

1+ parts

$1.670

100+ parts

$1.628

1k+ parts

$1.620

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296

$1.670

$1.628

$1.620

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Continental Prestige Electronics

USA . 6,292 parts In-Stock

1+ parts

$2.019

100+ parts

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$1.978

6,292

$2.019

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$1.978

Argo Parts USA

USA . 2,294 parts In-Stock

1+ parts

$2.019

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2,294

$2.019

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Corohmni

South Africa . 152 parts In-Stock

1+ parts

$3.095

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152

$3.095

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Aztec Data Supply Inc.

USA . 4,977 parts In-Stock

1+ parts

$5.230

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4,977

$5.230

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$6.298

100+ parts

$5.731

1k+ parts

$5.164

10k+ parts

-

3,000

$6.298

$5.731

$5.164

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Microchip USA

USA . 2,383 parts In-Stock

1+ parts

$12.870

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2,383

$12.870

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Marpe Global Electronics

Taiwan . 870 parts In-Stock

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870

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QualityLine Systems

Poland . 870 parts In-Stock

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870

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XL Components Corporation

Australia . 870 parts In-Stock

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870

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Discover the reliability and innovation of the 24FC512-I/ST14 by Microchip Technology. This EEPROM offers unparalleled quality and performance, making it ideal for a wide range of applications. With a focus on durability and efficiency, this product provides exceptional value to customers seeking dependable memory solutions. Trust in Microchip Technology to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the 24FC512-I/ST14 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the EEPROM, ensuring longevity and reliability.

Operating Mode: SYNCHRONOUS

Allows for efficient and synchronized data transfer, enhancing overall performance of the EEPROM.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a common and stable voltage level, making it compatible with various systems and applications.

Memory Density: 524288 bit

Offers a high memory density, allowing for storage of a large amount of data in a compact space.

Endurance: 1000000 Write/Erase Cycles

Provides durability and longevity, ensuring reliable performance over a long period of time.

Technical Specifications

EEPROM 24FC512-I/ST14 attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

5 mm

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

14

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Programming Voltage (V):

2.5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24FC512-I/ST14 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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