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LCMXO2-1200ZE-2TG144C

Lattice Semiconductor

LCMXO2-1200ZE-2TG144C by Lattice Semiconductor

LCMXO2-1200ZE-2TG144C by Lattice Semiconductor is a 1280 logic cell FPGA with max clock freq of 133 MHz. It operates at 1.2V, has 107 inputs/outputs, and can withstand temp range of 0-85°C. Ideal for applications requiring high-speed processing in compact designs.

Median Price

$16.250

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 1 parts In-Stock

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$16.250

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$15.020

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$14.940

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Flip Electronics (Authorized)

USA . 205 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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$12.660

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Vyrian

USA . 3,031 parts In-Stock

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Chip Stock

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Flip Electronics

USA . 205 parts In-Stock

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Distributors (Availability)

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Aranea Global

USA . 100 parts In-Stock

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$12.407

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$11.911

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Corohmni

South Africa . 108 parts In-Stock

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$12.470

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Continental Prestige Electronics

USA . 4,408 parts In-Stock

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$12.660

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$12.407

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Microchip USA

USA . 1,976 parts In-Stock

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$13.350

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$12.350

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$11.850

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$11.350

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Ampacity Inc.

Singapore . 121 parts In-Stock

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$13.810

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Semicontronic

India . 121 parts In-Stock

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$13.810

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$13.465

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$13.396

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$14.465

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$13.308

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$12.470

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AZTECH Wire

Italy . 271 parts In-Stock

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$14.777

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Aztec Data Supply Inc.

USA . 3,900 parts In-Stock

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$26.740

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Argo Parts USA

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Overview

Looking to take your projects to the next level? The LCMXO2-1200ZE-2TG144C by Lattice Semiconductor is a top-of-the-line Field Programmable Gate Array that delivers unmatched performance and reliability. With 1280 logic cells and 107 inputs/outputs, this FPGA is perfect for a wide range of applications. Whether you're working on IoT devices, robotics, or industrial automation, this powerhouse will exceed your expectations. Trust Lattice Semiconductor's reputation for quality and innovation, and unlock endless possibilities with the LCMXO2-1200ZE-2TG144C.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and cost-effective packaging solution.

No. of Logic Cells: 1280

Offers a good balance between logic capacity and flexibility for various applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 1.26 V

Supports a wide range of supply voltages for compatibility with different systems.

No. of Inputs: 107

Provides ample input channels for data and signals.

Package Shape: SQUARE

Facilitates compact and efficient PCB design.

Form Of Terminal: GULL WING

Enables reliable and secure soldering connections.

Nominal Supply Voltage (V): 1.2

Standard voltage level for stable operation.

Packing Method: TRAY

Ensures safe handling and storage during shipping and assembly.

Power Supplies (V): 1.2

Consistent power delivery for reliable performance.

No. of Terminals: 144

Offers sufficient connectivity options for interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Provides flexibility for customization and optimization of logic functions.

Package Style (Meter): FLATPACK

Streamlined package design for space-saving integration.

Minimum Supply Voltage: 1.14 V

Supports low-power operation for energy-efficient applications.

Maximum Operating Temperature: 85 °C

Suitable for extended operating conditions and environments.

Pitch Of Terminal: 0.5 mm

Fine terminal pitch for high-density PCB layouts.

Minimum Operating Temperature: 0 °C

Wide temperature range for versatility in different operating environments.

Finishing Of Terminal Used: Matte Tin (Sn)

Provides reliable and corrosion-resistant terminal finish.

Position Of Terminal: QUAD

Enhances solder joint strength and overall reliability.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate moisture exposure during handling and storage.

Maximum Seated Height: 1.6 mm

Low-profile package for compact system design.

Width: 20 mm

Optimal width for easy PCB layout and integration.

Maximum Clock Frequency: 133 MHz

Supports high-speed operation for real-time processing applications.

No. of Outputs: 107

Sufficient output channels for routing processed data and signals.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures safe and efficient solder reflow process during assembly.

Peak Reflow Temperature °C: 260

Compatible with standard reflow soldering processes.

Length: 20 mm

Compact length for reduced footprint on the PCB.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LCMXO2-1200ZE-2TG144C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

1280

No. of Inputs:

107

No. of Outputs:

107

Maximum Clock Frequency:

133 MHz

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Flatpack

Package Code:

QFP

Package Shape:

Length:

20 mm

Width:

20 mm

Maximum Seated Height:

1.6 mm

Packing Method:

Tray

Package Equivalence Code:

QFP144,.87SQ,20

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Finish:

Matte Tin

Terminal Pitch:

.5 mm

No. of Terminals:

144

Standards

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Qualified:

No

Trade Compliance

LCMXO2-1200ZE-2TG144C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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