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BD136-6

Jiangsu Changjiang Electronics Technology

BD136-6 by Jiangsu Changjiang Electronics Technology

PNP; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1.25 W; Maximum Collector Current (IC): 1.5 A; No. of Elements: 1;

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3

In-Stock Inventory

1k+

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Digiode

USA . 7,711 parts In-Stock

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Anansix

USA . 3,863 parts In-Stock

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Vyrian

USA . 233 parts In-Stock

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Modulus Dynamics

Lithuania . 11,504 parts In-Stock

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$0.874

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$0.839

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$0.804

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Northwest PG Solutions

USA . 5,060 parts In-Stock

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$1.397

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IDEA Electronic Components Group

UK . 1,347 parts In-Stock

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$1.460

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MKK Technologies

India . 1,274 parts In-Stock

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DigiPath Technology Company

USA . 1,274 parts In-Stock

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One Stop Electronics

USA . 684 parts In-Stock

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$23.050

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UNI Independent Distributors

Spain . 6,233 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,217 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,478 parts In-Stock

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Corphita

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Native Components

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Parana Technologies

USA . 899 parts In-Stock

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Supply Digital

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Assy Fe

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Technical Specifications

Power Bipolar Junction Transistors (BJT) BD136-6 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Jiangsu Changjiang Electronics Technology

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

45 V

Configuration:

Minimum DC Current Gain (hFE):

40

JEDEC-95 Code:

TO-126

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

PNP

Maximum Power Dissipation Ambient:

1.25 W

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Maximum VCEsat:

.5 V

Trade Compliance

BD136-6 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Jiangsu Changjiang Electronics Technology

JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.

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