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P1103-1

Intel

P1103-1 by Intel

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 18; Package Code: DIP; Refresh Cycles: 32; Package Shape: RECTANGULAR;

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In-Stock Inventory

< 1k

P1103-1 by Intel
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Digiode

USA . 369 parts In-Stock

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369

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Vyrian

USA . 297 parts In-Stock

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297

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 102 parts In-Stock

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102

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MARBEL Systems

Belgium . 2,394 parts In-Stock

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$4.468

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2,394

$4.468

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Texas Native Microelectronics

USA . 100 parts In-Stock

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$5.136

100+ parts

$4.931

1k+ parts

$4.776

10k+ parts

$4.520

100

$5.136

$4.931

$4.776

$4.520

Kenton Components

USA . 2,907 parts In-Stock

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$6.163

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$5.424

2,907

$6.163

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$5.424

Qasali Group International

UK . 900 parts In-Stock

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$13.867

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$12.896

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$12.203

900

$13.867

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$12.896

$12.203

Andel Nordic

Denmark . 1,519 parts In-Stock

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$36.160

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$25.311

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$25.311

1,519

$36.160

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$25.311

$25.311

Corphita

USA . 475 parts In-Stock

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Technical Specifications

Other Function Memory ICs P1103-1 attributes and parameters. Explore more Other Function Memory ICs devices from Intel

Specs

Maximum Access Time:

150 ns

Input/Output Type:

SEPARATE

JESD-30 Code:

R-PDIP-T18

JESD-609 Code:

e0

Memory Density:

1024 bit

Memory Width:

1

No. of Terminals:

18

No. of Words:

1024 words

No. of Words Code:

1K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Refresh Cycles:

32

Sub-Category:

Other Memory ICs

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

P1103-1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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