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JS28F256P30T95

Intel

JS28F256P30T95 by Intel

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Power Supplies (V): 1.8,1.8/3.3;

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,840 parts In-Stock

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Vyrian

USA . 2,387 parts In-Stock

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ABC Electronics Ltd.

UK . 3 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2 parts In-Stock

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MARBEL Systems

Belgium . 4,319 parts In-Stock

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$4.009

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$4.009

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Texas Native Microelectronics

USA . 68 parts In-Stock

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$4.608

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$4.424

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$4.285

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$4.055

68

$4.608

$4.424

$4.285

$4.055

Kenton Components

USA . 1,379 parts In-Stock

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$5.530

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$4.866

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Qasali Group International

UK . 270 parts In-Stock

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$12.442

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$11.571

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$10.949

270

$12.442

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$10.949

Andel Nordic

Denmark . 50 parts In-Stock

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$50.370

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$35.262

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$35.262

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$35.262

A-Z Elektronik GmbH

Germany . 6,968 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,645 parts In-Stock

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Kepictronics

USA . 3,700 parts In-Stock

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Corphita

USA . 1,090 parts In-Stock

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Perfect Parts

USA . 7 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2 parts In-Stock

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Technical Specifications

Flash Memory JS28F256P30T95 attributes and parameters. Explore more Flash Memory devices from Intel

Specs

Maximum Access Time:

88 ns

Additional Features:

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

Boot Block:

TOP

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e3

Length:

18.4 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Sectors/Size:

4,255

No. of Terminals:

56

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Page Size (words):

4

Parallel or Serial:

PARALLEL

Power Supplies (V):

1.8,1.8/3.3

Programming Voltage (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sector Size (Words):

16K,64K

Maximum Standby Current:

.000005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

51 mA

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Toggle Bit:

NO

Type:

NOR TYPE

Width:

14 mm

Trade Compliance

JS28F256P30T95 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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