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EPC16QC100N

Intel

EPC16QC100N by Intel

Intel's EPC16QC100N is a 16MX1 EEPROM memory IC with 3.3V supply, operating at up to 66.7 MHz clock frequency in synchronous mode. With 100 terminals and 16777216-bit density, it offers 100000 write/erase cycles for parallel applications like data storage systems.

Median Price

$50.917

Lifecycle Status

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Nova Conductors

Japan . 200 parts In-Stock

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Vyrian

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Digiode

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Touchstone Systems

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One Stop Electronics

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MARBEL Systems

Belgium . 39 parts In-Stock

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Texas Native Microelectronics

USA . 3,588 parts In-Stock

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$2.436

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$2.339

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$2.265

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$2.144

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Kenton Components

USA . 3,146 parts In-Stock

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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Corohmni

South Africa . 96 parts In-Stock

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Modulus Dynamics

Lithuania . 358 parts In-Stock

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Qasali Group International

UK . 1,915 parts In-Stock

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Semicontronic

India . 1,120 parts In-Stock

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$8.000

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$7.800

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$7.760

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AZTECH Wire

Italy . 780 parts In-Stock

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Ampacity Inc.

Singapore . 787 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Component Stockers USA

USA . 4,366 parts In-Stock

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Microchip USA

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Authorized Procurement Solutions

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Lixinc

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Glotronic Ltd.

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Overview

Unlock the power of cutting-edge technology with the Intel EPC16QC100N Flash Memory. Manufactured by industry leader Intel, this versatile component offers unparalleled quality and reliability. Ideal for a wide range of applications, from consumer electronics to industrial automation, this flash memory boasts a 100,000 write/erase cycle endurance, ensuring long-lasting performance. With a nominal supply voltage of 3.3V and a maximum clock frequency of 66.7 MHz, the EPC16QC100N delivers exceptional value, efficiency, and speed. Upgrade your projects today with Intel's top-of-the-line flash memory solution.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material is durable and lightweight, making the product easy to handle and resistant to damage.

Surface Mount:

YES - This feature allows for easy installation and integration into various systems.

Package Shape:

RECTANGULAR - The rectangular shape makes it easy to stack and store multiple units efficiently.

Operating Mode:

SYNCHRONOUS - The synchronous operation allows for high-speed data transfer and processing.

Nominal Supply Voltage / Vsup (V):

3.3 - The 3.3V supply voltage ensures compatibility with a wide range of devices and systems.

Power Supplies (V):

3.3 - Consistent power supply at 3.3V ensures stable performance.

No. of Terminals:

100 - The high number of terminals allows for efficient connectivity and data transfer.

Package Style (Meter):

FLATPACK - The flatpack style saves space and allows for compact integration into systems.

Maximum Operating Temperature:

70 °C - With a maximum operating temperature of 70°C, this product can withstand heat and function effectively in various environments.

Organization:

16MX1 - The 16MX1 organization offers ample storage capacity for data and files.

Output Characteristics:

3-STATE - The 3-state output allows for flexible communication and signal processing options.

Minimum Operating Temperature:

0 °C - With a minimum operating temperature of 0°C, this product can function reliably in cold conditions.

Terminal Finish:

MATTE TIN - The matte tin finish provides corrosion resistance and ensures long-term reliability.

Terminal Position:

QUAD - The quad terminal position allows for secure connections and stable data transfer.

Maximum Seated Height:

2.15 mm - The low seated height allows for slim and compact design options.

Maximum Clock Frequency (fCLK):

66.7 MHz - The high clock frequency enables fast data processing and response times.

Width:

14 mm - The 14mm width offers a compact form factor for space-constrained applications.

Minimum Supply Voltage (Vsup):

3 V - The minimum supply voltage of 3V ensures efficient power consumption and performance.

Length:

20 mm - The 20mm length provides a balance between compact design and functional space for components.

Temperature Grade:

COMMERCIAL - This commercial-grade product is suitable for a wide range of commercial applications.

Technology:

CMOS - The CMOS technology delivers low power consumption and high performance.

Parallel or Serial:

PARALLEL - The parallel operation allows for efficient data transfer and processing in parallel.

Terminal Form:

GULL WING - The gull-wing terminal form provides secure mounting and reliable connectivity.

Maximum Supply Current:

90 mA - The maximum supply current of 90mA allows for efficient power usage.

No. of Words:

16777216 words - With 16,777,216 words, this product offers ample storage capacity for data and files.

Terminal Pitch:

0.65 mm - The 0.65mm terminal pitch enables compact design and secure connections.

No. of Words Code:

16M - The 16M words code provides a clear indication of the product's storage capacity.

Moisture Sensitivity Level (MSL):

3 - With a moisture sensitivity level of 3, this product is suitable for various environmental conditions.

Maximum Supply Voltage (Vsup):

3.6 V - The maximum supply voltage of 3.6V ensures compatibility with standard power sources.

Endurance:

100000 Write/Erase Cycles - With 100,000 write/erase cycles, this product offers long-lasting durability and reliability.

Memory Density:

16777216 bit - The high memory density of 16,777,216 bits provides ample storage capacity for data and files.

Memory IC Type:

EEPROM - The EEPROM memory IC type offers non-volatile, electrically erasable memory.

Maximum Standby Current:

0.00015 Amp - The low standby current consumption of 0.00015 Amp ensures efficient power usage in standby mode.

Technical Specifications

Flash Memory EPC16QC100N attributes and parameters. Explore more Flash Memory devices from Intel

Specs

Maximum Clock Frequency (fCLK):

66.7 MHz

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e3

Length:

20 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

16MX1

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Parallel or Serial:

PARALLEL

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.15 mm

Maximum Standby Current:

.00015 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

90 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

EPC16QC100N Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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