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EPC16UC88N

Intel

EPC16UC88N by Intel

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 88; Package Code: LFBGA; Package Shape: RECTANGULAR; Terminal Finish: TIN SILVER COPPER;

Median Price

$175.000

Lifecycle Status

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6

In-Stock Inventory

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Vyrian

USA . 907 parts In-Stock

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$175.000

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Digiode

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Touchstone Systems

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Bristol Electronics

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Cyclops Electronics Ltd

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Atlantic Semiconductor

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MARBEL Systems

Belgium . 24,580 parts In-Stock

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$2.771

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Modulus Dynamics

Lithuania . 5,121 parts In-Stock

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$3.759

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$3.759

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$3.759

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Kenton Components

USA . 6,178 parts In-Stock

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$3.822

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$3.363

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Texas Native Microelectronics

USA . 3,812 parts In-Stock

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$5.531

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$5.310

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$5.144

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$4.867

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$4.867

Qasali Group International

UK . 5,283 parts In-Stock

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$14.934

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$13.888

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$13.142

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Semicontronic

India . 761 parts In-Stock

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$18.000

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$17.550

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$17.460

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One Stop Electronics

USA . 462 parts In-Stock

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$30.000

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Microchip USA

USA . 313 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 5,433 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,622 parts In-Stock

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Glotronic Ltd.

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Supply Digital

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Perfect Parts

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Corphita

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Vigor

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Futuretech Components

Singapore . 520 parts In-Stock

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Native Components

USA . 479 parts In-Stock

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Northwest PG Solutions

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Corohmni

South Africa . 257 parts In-Stock

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Kepictronics

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GreenTree Electronics

Israel . 50 parts In-Stock

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Technical Specifications

Flash Memory EPC16UC88N attributes and parameters. Explore more Flash Memory devices from Intel

Specs

Maximum Clock Frequency (fCLK):

66.7 MHz

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B88

JESD-609 Code:

e1

Length:

11 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

88

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

16MX1

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA88,8X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Maximum Standby Current:

.00015 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

90 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

EPC16UC88N Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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