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EP1S25F780I6N

Intel

EP1S25F780I6N by Intel

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

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Digiode

USA . 1,283 parts In-Stock

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Semicontronic

India . 1,550 parts In-Stock

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$12.675

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$12.610

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Ampacity Inc.

Singapore . 317 parts In-Stock

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Modulus Dynamics

Lithuania . 409 parts In-Stock

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MARBEL Systems

Belgium . 1,012 parts In-Stock

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One Stop Electronics

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Kenton Components

USA . 290 parts In-Stock

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Qasali Group International

UK . 1,605 parts In-Stock

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Advanced Electronics

New Zealand . 1,824 parts In-Stock

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Texas Native Microelectronics

USA . 5,357 parts In-Stock

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Microchip USA

USA . 131 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,554 parts In-Stock

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Alle Elektronik GmbH

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Glotronic Ltd.

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Supply Digital

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Authorized Procurement Solutions

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Corphita

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Northwest PG Solutions

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Corohmni

South Africa . 234 parts In-Stock

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Kepictronics

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Perfect Parts

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Technical Specifications

Field Programmable Gate Arrays (FPGA) EP1S25F780I6N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

25660

No. of Inputs:

706

No. of Outputs:

706

No. of CLBs:

2852

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

2566 CLBS

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Power Supplies:

1.5,1.5/3.3 V

Temperature and Environmental Ratings

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3.5 mm

Package Equivalence Code:

BGA780,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP1S25F780I6N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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