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EP1C4F324I7

Intel

EP1C4F324I7 by Intel

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Median Price

$90.945

Lifecycle Status

Suppliers In-Stock

9

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1k+

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Arrow

USA . 3,052 parts In-Stock

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$33.910

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Verical

USA . 2,075 parts In-Stock

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$147.980

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$35.240

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$30.910

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Vyrian

USA . 522 parts In-Stock

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$14.600

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Digiode

USA . 848 parts In-Stock

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$140.581

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Touchstone Systems

USA . 1,000 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 36 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 11 parts In-Stock

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Cyclops Electronics Ltd

UK . 3 parts In-Stock

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R&J Components

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MARBEL Systems

Belgium . 1,720 parts In-Stock

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$26.024

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Texas Native Microelectronics

USA . 3,298 parts In-Stock

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$29.913

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$26.323

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Kenton Components

USA . 2,201 parts In-Stock

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$35.896

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$31.588

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Qasali Group International

UK . 1,767 parts In-Stock

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$80.765

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$71.073

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Modulus Dynamics

Lithuania . 118 parts In-Stock

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$122.616

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$122.616

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Corphita

USA . 275 parts In-Stock

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$133.182

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Corohmni

South Africa . 453 parts In-Stock

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$147.980

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One Stop Electronics

USA . 1,963 parts In-Stock

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Semicontronic

India . 1,635 parts In-Stock

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$273.760

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$266.916

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$265.547

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Microchip USA

USA . 348 parts In-Stock

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Perfect Parts

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A-Z Elektronik GmbH

Germany . 4,949 parts In-Stock

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Glotronic Ltd.

UK . 3,300 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,299 parts In-Stock

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Authorized Procurement Solutions

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Supply Digital

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Native Components

USA . 739 parts In-Stock

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Vigor

Singapore . 660 parts In-Stock

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Northwest PG Solutions

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Kepictronics

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GreenTree Electronics

Israel . 500 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 36 parts In-Stock

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Technical Specifications

Field Programmable Gate Arrays (FPGA) EP1C4F324I7 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

4000

No. of Inputs:

249

No. of Outputs:

249

No. of CLBs:

400

Maximum Clock Frequency:

320 MHz

Sub-Category:

Field Programmable Gate Arrays

Organization:

400 CLBS

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Power Supplies:

1.5,1.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

220 °C (428 °F)

Peak Reflow Time:

20 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

19 mm

Width:

19 mm

Maximum Seated Height:

2.2 mm

Package Equivalence Code:

BGA324,18X18,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Lead (Sn63Pb37)

Terminal Pitch:

1 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

EP1C4F324I7 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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