Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Intel's AT80571PH0723M/SLB9Y is a 64-bit microprocessor with 775 terminals in a rectangular package. It operates at a speed of 2800 rpm and consumes up to 75000 mA. Ideal for high-performance computing applications requiring advanced processing power.
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This material provides durability and protection for the microprocessor, ensuring a longer lifespan.
Allows for easy installation on circuit boards, saving time and effort during assembly.
Rectangular shape allows for efficient use of space on the circuit board.
64-bit architecture provides high processing power and performance for demanding applications.
Higher number of terminals allow for more connections and functionality in the microprocessor.
Grid array package style provides better thermal performance and electrical connectivity.
Bottom terminal position allows for easier and more secure soldering during installation.
RISC architecture allows for faster data processing and execution of instructions.
CMOS technology provides low power consumption and high speed performance for the microprocessor.
No lead terminals contribute to environmental sustainability and ease of recycling.
High maximum supply current ensures stable and reliable operation of the microprocessor under heavy loads.
Small terminal pitch allows for closer connections and integration on the circuit board.
High speed of 2800 rpm enables quick data processing and response times for efficient performance.
Microprocessors AT80571PH0723M/SLB9Y attributes and parameters. Explore more Microprocessors devices from Intel
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AT80571PH0723M/SLB9Y Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
M39029/56351
Esterline Technologies
CONNECTOR ACCESSORY; IEC Conformity: NO; Contact Gender: FEMALE; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT; Tool Settings: M22520/2-10;
SS14
Vishay Intertechnology
Vishay Intertechnology's SS14 is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 1A. Operating at up to 125°C, it has a repetitive peak reverse voltage of 40V. Ideal for surface mount applications, it suits various electronic circuits requiring efficient rectification and low forward voltage drop.
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Microsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Comset Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Good-ark Electronics
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V; No. of Phases: 1;
2N7002,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 30; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
MBR0530T1G
Onsemi
MBR0530T1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.375V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring high-speed switching in compact electronic devices like smartphones and tablets. The package style is small outline with gull wing terminals for surface mount assembly.
BSS123LT1G
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
1N4148WT
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
World Products
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CM
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BSS138
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (ID): .22 A; Package Shape: RECTANGULAR;
LM358M
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
CRGCQ0805F10K
TE Connectivity
TE Connectivity's CRGCQ0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in automotive electronics due to AEC-Q200 standard compliance.
ECS-.327-12.5-17X-TR
Ecs International
ECS-0.327-12.5-17X-TR by Ecs International is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing in temperature ranges from -40 to 85 °C, such as telecommunications and industrial automation.
M85049/85-08W02
Amphenol
CIRCULAR CONN ACCESSORY; Shell Sizes: 8; 9; IEC Conformity: NO; MIL-Connector Accessory Name: BAND LOCK ADAPTER; MIL Conformity: YES; DIN Conformity: NO;
Weitron Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Form: GULL WING; Terminal Position: DUAL;
BAV99
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
C0603C104K5RACTU
KEMET Corporation
KEMET C0603C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
MCIMX6S6AVM08AC
Freescale Semiconductor
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE;
T2080NXE8TTB
NXP Semiconductors
The NXP Semiconductors T2080NXE8TTB microprocessor features a 64-bit architecture, integrated cache, and operates at speeds up to 1800 rpm. Ideal for industrial applications, this CMOS technology-based processor has a temperature range of -40 to 105°C and comes in a square package with 896 terminals for surface mount assembly.
DM388AAAR11F
Texas Instruments
Texas Instruments DM388AAAR11F microprocessor features 32-bit architecture, 609 terminals, and 655360 RAM words. With a clock frequency of 30 MHz, it is suitable for applications requiring high-speed processing such as embedded systems and IoT devices. The processor's low power mode and integrated cache make it ideal for energy-efficient designs in various industries.
P1011NSN2HFB
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 689; Package Code: HBGA; Package Shape: SQUARE;
CS80C286-25
Renesas Electronics
CS80C286-25 by Renesas Electronics is a 16-bit microprocessor with 24-bit address bus width and external data bus width. Operating at 20 rpm, it features low power mode and CMOS technology. Ideal for commercial applications requiring high-speed processing in a compact chip carrier package.
MPC860DEZQ50D4
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
P1021NSE2HFB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
R7S721020VLFP#AA1
Renesas Electronics R7S721020VLFP#AA1 microprocessor features 32-bit external data bus, 8KB integrated cache, and 26-bit address bus width. Ideal for low power applications with a max clock frequency of 13.33 MHz. Suitable for use in embedded systems requiring high-speed processing and low power consumption.
AM3352BZCZ60
AM3352BZCZ60 by Texas Instruments is a 32-bit microprocessor with integrated cache, 131072 RAM words, and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz and is suitable for applications requiring low power mode and boundary scan capabilities.
AM3357BZCZA30
AM3357BZCZA30 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. With a terminal pitch of 0.8 mm and package style of grid array, it offers high performance in compact designs.
MCF5485CZP200
The NXP Semiconductors MCF5485CZP200 microprocessor features a 32-bit architecture, integrated cache, and operates at a max clock frequency of 66.67 MHz. Ideal for industrial applications requiring low power consumption, it has a terminal pitch of 1 mm and supports boundary scan technology.
STM32MP157CAB3
STMicroelectronics
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
MIMXRT1062DVN6B
MICROPROCESSOR; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
MC9S08PT8VLC
MC9S08PT8VLC by NXP Semiconductors is an 8-bit microprocessor with 32 terminals, 2048 bytes of RAM, and 8192 ROM words. It operates at a speed of 20 rpm and has a power supply range of 3/5 V. Ideal for industrial applications requiring a robust CPU like HCS08 family.
ATSAMA5D34A-CU
Atmel
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;
MC9S08PT16VLD
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE;
STM32MP153AAD3
P1010NXE5FFA
MICROPROCESSOR, RISC; No. of Terminals: 425; Maximum Time At Peak Reflow Temperature (s): 40; Package Body Material: PLASTIC/EPOXY; Peak Reflow Temperature (C): 260; Qualification: Not Qualified;
MCIMX6X3EVN10AB
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Technology: CMOS;
AM5706BCBDJA
AM5706BCBDJA by Texas Instruments is a microprocessor with 32-bit external data bus width, 16-bit address bus width, and integrated cache. It is suitable for industrial applications requiring low power mode, operating at a max clock frequency of 38.4 MHz. The package style is grid array with 538 terminals in a square shape measuring 17mm x 17mm.
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AT80612002931ABSLBWG
Intel
MICROPROCESSOR; Terminal Form: NO LEAD; No. of Terminals: 1366; Package Code: LGA; Package Shape: RECTANGULAR; Bit Size: 64;
AT80574JH046NT/SLBBT
MICROPROCESSOR, RISC; Terminal Form: NO LEAD; No. of Terminals: 771; Package Code: LGA; Package Shape: RECTANGULAR; Speed: 2130 rpm;
AT80574KJ073N/SLBBJ
MICROPROCESSOR, RISC; Terminal Form: NO LEAD; No. of Terminals: 771; Package Code: LGA; Package Shape: RECTANGULAR; Package Equivalence Code: LGA771,30X33,46/43;
AT80614005154AB/SLBVA
MICROPROCESSOR, RISC; Terminal Form: NO LEAD; No. of Terminals: 1366; Package Code: LGA; Package Shape: RECTANGULAR; Terminal Pitch: 1 mm;
AT80614003597ACSLBWZ
MICROPROCESSOR; Terminal Form: NO LEAD; No. of Terminals: 1366; Package Code: LGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
AT80571PH0722ML/SLGU9
MICROPROCESSOR, RISC; Terminal Form: NO LEAD; No. of Terminals: 775; Package Code: LGA; Package Shape: RECTANGULAR; Surface Mount: YES;
AT80571PH0773M
MICROPROCESSOR; Terminal Form: NO LEAD; No. of Terminals: 775; Package Code: LGA; Package Shape: SQUARE; Bit Size: 64;
AT80571PH0673M
MICROPROCESSOR, RISC; Terminal Form: NO LEAD; No. of Terminals: 775; Package Code: LGA; Package Shape: RECTANGULAR; Package Equivalence Code: LGA775,30X33,46/43;
AT80571PH0723M
MICROPROCESSOR, RISC; Terminal Form: NO LEAD; No. of Terminals: 775; Package Code: LGA; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): NOT SPECIFIED;
AT80571PH0772ML/SLGUH
MICROPROCESSOR, RISC; Terminal Form: NO LEAD; No. of Terminals: 775; Package Code: LGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
AT80571PH0773M/SLB9Z
MICROPROCESSOR, RISC; Terminal Form: NO LEAD; No. of Terminals: 775; Package Code: LGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
AT80571PH0832ML/SLGUG
MICROPROCESSOR, RISC; Terminal Form: NO LEAD; No. of Terminals: 775; Package Code: LGA; Package Shape: RECTANGULAR; Bit Size: 64;
AT80571PH0882ML/SLGUF
MICROPROCESSOR, RISC; Terminal Form: NO LEAD; No. of Terminals: 775; Package Code: LGA; Package Shape: RECTANGULAR; Terminal Pitch: 1.1 mm;
AT80571PH0932ML/SLGUE
MICROPROCESSOR, RISC; Terminal Form: NO LEAD; No. of Terminals: 775; Package Code: LGA; Package Shape: RECTANGULAR; Power Supplies (V): 0.85/1.36;
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