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10CL080ZF484I8G

Intel

10CL080ZF484I8G by Intel

Intel's 10CL080ZF484I8G FPGA features 81264 logic cells, 5079 CLBs, and 423 inputs/outputs. With a package style of grid array and programmable IC type, it is ideal for industrial applications requiring high performance in a compact form factor. Operating temperature ranges from -40 to 100 °C with a low supply voltage of 0.97 V.

Median Price

$134.210

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DigiKey

USA . 50 parts In-Stock

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$127.501

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Digiode

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Nova Conductors

Japan . 500 parts In-Stock

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VNN

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AZTECH Wire

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Aztec Data Supply Inc.

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Vigor

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Semicontronic

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Corphita

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Continental Prestige Electronics

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Microchip USA

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Corohmni

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Argo Parts USA

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Qasali Group International

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Netroflash

USA . 50 parts In-Stock

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Overview

Unlock endless possibilities with the Intel 10CL080ZF484I8G Field Programmable Gate Array. Crafted by industry giant Intel, this FPGA boasts 81264 logic cells and 5079 CLBs, making it a powerhouse for your digital designs. With 423 inputs and outputs, this versatile component is perfect for a wide range of applications. Whether you're designing cutting-edge electronics or optimizing industrial processes, this FPGA offers unmatched performance and reliability. Elevate your projects and unleash your creativity with the Intel 10CL080ZF484I8G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy for the package body material ensures durability and lightweight design for easy handling and installation.

No. of Logic Cells: 81264

Having a large number of logic cells allows for complex programming and customization, making the FPGA versatile for various applications.

Surface Mount: YES

Being surface mountable enables easy integration onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.03 V

Operating within a low maximum supply voltage range can help minimize power consumption and reduce heat generation.

No. of CLBs: 5079

Having a high number of Configurable Logic Blocks (CLBs) allows for flexibility and scalability in designing and implementing logic functions.

No. of Inputs: 423

The abundance of input pins provides ample connectivity options, allowing for diverse input configurations and data processing capabilities.

Package Shape: SQUARE

The square shape of the package offers efficient use of space on a circuit board, optimizing layout and design.

Form Of Terminal: BALL

The ball terminal design ensures secure connections and reliable performance, especially in high-vibration environments.

No. of Terminals: 484

The high number of terminals allows for extensive connectivity options and versatility in interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a FPGA, this product offers reconfigurability and adaptability to changing requirements, making it suitable for prototyping and development.

Package Style (Meter): GRID ARRAY

The grid array package style provides a dense and organized arrangement of terminals, facilitating easy assembly and soldering for manufacturing.

Minimum Supply Voltage: 0.97 V

Operating at a low minimum supply voltage ensures compatibility with a wide range of power sources and voltage levels.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand demanding thermal conditions and operating environments.

Pitch Of Terminal: 1 mm

The small pitch of terminals allows for close placement on a PCB, enabling compact designs and efficient use of space.

Organization: 5079 CLBS

The organized layout and structure of 5079 Configurable Logic Blocks (CLBs) promote efficient logic design and implementation.

Minimum Operating Temperature: -40 °C

Capable of functioning at low temperatures, this FPGA is suitable for outdoor or industrial applications where temperature fluctuations may occur.

Position Of Terminal: BOTTOM

Having terminals at the bottom of the package offers easy access for soldering and assembly, ensuring a secure and stable connection.

Maximum Seated Height: 2.4 mm

With a low maximum seated height, this FPGA can fit into slim and compact electronic devices without compromising on performance.

Width: 23 mm

The compact width dimension allows for space-efficient placement on a PCB, enabling versatile integration into various electronic systems.

No. of Outputs: 423

The high number of output pins allows for extensive data transmission and output options, enhancing the FPGA's processing capabilities.

Length: 23 mm

The short length dimension of the package provides a compact form factor, ideal for applications where space constraints are a concern.

Grading Of Temperature: INDUSTRIAL

Being designed for industrial-grade temperature ranges ensures reliable operation in challenging environmental conditions, making it suitable for rugged applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CL080ZF484I8G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

81264

No. of Inputs:

423

No. of Outputs:

423

No. of CLBs:

5079

Organization:

5079 CLBS

Additional Features:

-40 to 125 °C range is available as extended industrial

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.4 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

10CL080ZF484I8G Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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