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IS63LV1024L-12JL

Integrated Silicon Solution

IS63LV1024L-12JL by Integrated Silicon Solution

IS63LV1024L-12JL by Integrated Silicon Solution is a 128Kx8 SRAM with 12ns access time, operating at 3.3V. It features asynchronous mode, 3-STATE output, and common I/O type. Ideal for commercial applications requiring fast memory access in a small outline package.

Median Price

$1.915

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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DigiKey

USA . 1,925 parts In-Stock

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$1.790

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$1.583

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$1.390

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$1.239

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$1.790

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$1.239

Rochester

USA . 1,782 parts In-Stock

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$2.040

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$1.830

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$1.720

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Chip Stock

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Vyrian

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EMSNET

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Halfin

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Sensible Micro Corp

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$13.484

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$12.447

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Corel Iberica Componentes, S.L.

Spain . 22 parts In-Stock

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J & M Industries LLC

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ComSIT Distribution GmbH

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Nova Conductors

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AZTECH Wire

Italy . 293 parts In-Stock

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Lixinc

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Perfect Parts

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Epart123

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iodParts Technologies Inc.

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Aranea Global

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Cyclops Electronics Ltd (Excess)

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Overview

Unlock the power of reliable data storage with the IS63LV1024L-12JL by Integrated Silicon Solution. As a leading manufacturer in the industry, ISS offers high-quality SRAM solutions that deliver exceptional performance and durability. Whether you're in need of fast access times for computing systems or reliable memory storage for industrial applications, this product provides unmatched value and efficiency. Trust ISS to provide the cutting-edge technology you need to stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and helps protect the internal components of the SRAM, ensuring reliability and longevity.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexibility in data transfer timing, making the SRAM suitable for various applications.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V ensures compatibility with standard power supply configurations, making integration easier.

No. of Terminals: 32

With a sufficient number of terminals, the SRAM can easily connect to other components in the system, facilitating seamless communication.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows the SRAM to function reliably in various environmental conditions.

Organization: 128KX8

The organization of 128KX8 provides a balance between storage capacity and data retrieval speed, making the SRAM suitable for a wide range of applications.

Technology: CMOS

The CMOS technology used in the SRAM ensures low power consumption and high performance, making it an efficient choice for electronic devices.

Memory IC Type: STANDARD SRAM

Being a standard SRAM, this memory IC type is widely compatible and commonly used, ensuring ease of integration in a variety of systems.

Technical Specifications

SRAM IS63LV1024L-12JL attributes and parameters. Explore more SRAM devices from Integrated Silicon Solution

Specs

Maximum Access Time:

12 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-J32

JESD-609 Code:

e3

Length:

20.955 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOJ

Package Equivalence Code:

SOJ32,.34

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Maximum Standby Current:

.0015 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

90 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

10

Width:

7.62 mm

Trade Compliance

IS63LV1024L-12JL Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.B

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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