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IS34ML02G084-TLI

Integrated Silicon Solution

IS34ML02G084-TLI by Integrated Silicon Solution

IS34ML02G084-TLI by Integrated Silicon Solution is a 256MX8 SLC NAND flash memory with 2147483648 bit density. Operating at 3.3V, it has an industrial temperature grade and supports parallel interface. With a compact size of 18.4mm x 12mm x 1.2mm, it is ideal for high-performance embedded systems requiring reliable non-volatile storage solutions.

Median Price

$8.320

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 84 parts In-Stock

1+ parts

$8.320

100+ parts

$7.120

1k+ parts

-

10k+ parts

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84

$8.320

$7.120

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DigiKey

USA . 121 parts In-Stock

1+ parts

$8.780

100+ parts

$7.552

1k+ parts

$7.077

10k+ parts

$6.920

121

$8.780

$7.552

$7.077

$6.920

Verical

USA . 864 parts In-Stock

1+ parts

-

100+ parts

$3.095

1k+ parts

-

10k+ parts

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864

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$3.095

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$4.780

100+ parts

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10

$4.780

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Vyrian

USA . 17,784 parts In-Stock

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17,784

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 679 parts In-Stock

1+ parts

$2.137

100+ parts

-

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679

$2.137

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Bastille Electronics

Australia . 40 parts In-Stock

1+ parts

$4.780

100+ parts

$4.541

1k+ parts

$4.314

10k+ parts

$4.254

40

$4.780

$4.541

$4.314

$4.254

Continental Prestige Electronics

USA . 6,177 parts In-Stock

1+ parts

$4.780

100+ parts

-

1k+ parts

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10k+ parts

$4.684

6,177

$4.780

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$4.684

Aztec Data Supply Inc.

USA . 1,271 parts In-Stock

1+ parts

$5.010

100+ parts

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1,271

$5.010

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Glotronic Ltd.

UK . 1,075 parts In-Stock

1+ parts

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1,075

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Argo Parts USA

USA . 563 parts In-Stock

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563

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Overview

Unlock the power of reliable and efficient data storage with the IS34ML02G084-TLI by Integrated Silicon Solution. With a reputation for superior quality and cutting-edge technology, ISS is a leader in flash memory solutions. This versatile product is perfect for a wide range of applications, offering high performance and durability. Experience the value and benefits of this SLC NAND type memory with a small outline, thin profile package that delivers exceptional reliability and speed. Trust ISS to provide the perfect solution for your memory needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable devices.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on electronic circuit boards.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact and space-saving design for integration into various electronics.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode offers fast and efficient data transfer, enhancing the overall performance of the flash memory.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V ensures compatibility with a wide range of devices and power sources.

No. of Terminals: 48

With 48 terminals, this flash memory offers versatile connectivity options for seamless integration into different systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile design of the package make it suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability and stability in challenging environmental conditions.

Organization: 256MX8

The 256MX8 organization provides a high memory capacity and data storage capability for demanding applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for reliable performance in extreme cold environments.

Terminal Finish: Matte Tin (Sn)

The matte tin terminal finish enhances solderability and ensures secure connections for long-lasting durability.

Terminal Position: DUAL

The dual terminal position offers flexibility for installation and enables efficient heat dissipation for improved reliability.

Maximum Seated Height: 1.2 mm

The maximum seated height of 1.2mm allows for easy installation in compact electronic devices with limited space.

Width: 12 mm

The 12mm width of the flash memory provides a slim and compact form factor for seamless integration into various designs.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage of 2.7V ensures compatibility with low-power systems and energy-efficient operation.

Maximum Time At Peak Reflow Temperature (s): 10

The maximum time at peak reflow temperature of 10 seconds ensures reliable soldering and thermal performance during manufacturing.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient and secure soldering of the flash memory onto circuit boards.

Type: SLC NAND TYPE

The SLC NAND type offers high reliability and durability, making it suitable for mission-critical applications requiring robust data storage.

Length: 18.4 mm

The 18.4mm length of the flash memory provides a compact and space-saving design for easy integration into electronic systems.

Programming Voltage (V): 3.3

The programming voltage of 3.3V ensures fast and reliable data programming for efficient data storage and retrieval.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh operating conditions, making it suitable for industrial applications.

Technology: CMOS

The CMOS technology enables low power consumption and high-speed data processing, enhancing the efficiency of the flash memory.

Parallel or Serial: PARALLEL

The parallel data transfer mode offers fast and efficient data access, ideal for applications requiring high-speed performance.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, ensuring stable operation in various environments.

No. of Words: 268435456 words

The high number of words allows for extensive data storage capacity, making it suitable for applications requiring large memory storage.

Memory Width: 8

The memory width of 8 bits enables efficient data processing and organization, enhancing the performance of the flash memory.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5mm provides compact spacing for easy installation and integration into electronic devices with limited space.

No. of Words Code: 256M

The 256M words code allows for easy identification and organization of data, enhancing the efficiency of data storage and retrieval.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 ensures resistance to moisture exposure, making the flash memory suitable for a variety of operating environments.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V provides flexibility in power input options for compatibility with different voltage sources.

Memory Density: 2147483648 bit

The high memory density of 2147483648 bits offers ample storage capacity for handling large volumes of data in diverse applications.

Memory IC Type: FLASH

The flash memory IC type provides fast and reliable data storage and retrieval capabilities, making it ideal for a wide range of electronic devices.

Technical Specifications

Flash Memory IS34ML02G084-TLI attributes and parameters. Explore more Flash Memory devices from Integrated Silicon Solution

Specs

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e3

Length:

18.4 mm

Memory Density:

2147483648 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

268435456 words

No. of Words Code:

256M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Programming Voltage (V):

3.3

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

10

Type:

SLC NAND TYPE

Width:

12 mm

Trade Compliance

IS34ML02G084-TLI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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