Loading...

IS34ML01G081-BLI

Integrated Silicon Solution

IS34ML01G081-BLI by Integrated Silicon Solution

IS34ML01G081-BLI by Integrated Silicon Solution is a 128MX8 SLC NAND flash memory with 1073741824 bit density. Operating at 3.3V, it has a temperature range of -40 to 85 °C and uses parallel interface for industrial applications. Measuring 11mm x 9mm x 1mm, this memory IC features a grid array package with very thin profile and fine pitch terminals.

Median Price

$6.182

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 85 parts In-Stock

1+ parts

$6.590

100+ parts

$5.520

1k+ parts

-

10k+ parts

-

85

$6.590

$5.520

-

-

Verical

USA . 220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.774

10k+ parts

-

220

-

-

$5.774

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 83 parts In-Stock

1+ parts

$3.750

100+ parts

-

1k+ parts

-

10k+ parts

-

83

$3.750

-

-

-

TME

Poland . 109 parts In-Stock

1+ parts

$5.120

100+ parts

$3.840

1k+ parts

-

10k+ parts

-

109

$5.120

$3.840

-

-

Vyrian

USA . 7,399 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,399

-

-

-

-

Sensible Micro Corp

USA . 16 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16

-

-

-

-

GLYN GmbH & Co. KG

Germany . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,000 parts In-Stock

1+ parts

$2.083

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$2.083

-

-

-

Continental Prestige Electronics

USA . 4,800 parts In-Stock

1+ parts

$3.750

100+ parts

-

1k+ parts

-

10k+ parts

$3.675

4,800

$3.750

-

-

$3.675

Argo Parts USA

USA . 4,225 parts In-Stock

1+ parts

$3.750

100+ parts

-

1k+ parts

-

10k+ parts

-

4,225

$3.750

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$3.750

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$3.750

-

-

-

Corohmni

South Africa . 288 parts In-Stock

1+ parts

$4.170

100+ parts

-

1k+ parts

-

10k+ parts

-

288

$4.170

-

-

-

AZTECH Wire

Italy . 357 parts In-Stock

1+ parts

$12.167

100+ parts

-

1k+ parts

-

10k+ parts

-

357

$12.167

-

-

-

Overview

Discover the cutting-edge IS34ML01G081-BLI by Integrated Silicon Solution, a top-tier manufacturer known for excellence in the Flash Memory category. This advanced product offers unparalleled value and benefits to customers, with its high-quality construction and versatile applications. Experience seamless performance and reliability with this innovative solution that delivers superior results in various industrial settings. Unlock the potential of your projects with the IS34ML01G081-BLI and elevate your work to new heights.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and reliability to the product.

Surface Mount:

YES - Allows for easy and efficient installation on circuit boards.

Package Shape:

RECTANGULAR - Provides a compact and space-saving design for efficient use of PCB space.

Operating Mode:

ASYNCHRONOUS - Enables fast and efficient data transfer operations.

Nominal Supply Voltage / Vsup (V):

3.3 - Ensures compatibility with standard voltage requirements.

No. of Terminals:

63 - Provides ample connectivity options for various applications.

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH - Offers high performance and reliability in a compact form factor.

Maximum Operating Temperature:

85 °C - Suitable for use in a wide range of operating environments.

Organization:

128MX8 - Provides a high-capacity storage solution for data-intensive applications.

Minimum Operating Temperature:

40 °C - Ideal for use in extreme temperature conditions.

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu) - Ensures a reliable and durable terminal finish for long-term use.

Terminal Position:

BOTTOM - Facilitates easy connection and installation on PCBs.

Maximum Seated Height:

1 mm - Allows for compact and low-profile design in electronic devices.

Width:

9 mm - Offers a slim and compact form factor for space-constrained applications.

Minimum Supply Voltage (Vsup):

2.7 V - Provides flexibility in power supply requirements.

Maximum Time At Peak Reflow Temperature (s):

10 - Ensures reliable soldering during the manufacturing process.

Peak Reflow Temperature °C:

260 - Allows for high-temperature reflow soldering without compromising performance.

Type:

SLC NAND TYPE - Offers high reliability and durability in data storage applications.

Length:

11 mm - Provides a compact form factor for efficient PCB layout.

Programming Voltage (V):

3.3 - Provides compatibility with standard programming requirements.

Temperature Grade:

INDUSTRIAL - Suitable for use in harsh industrial environments.

Technology:

CMOS - Offers low power consumption and high performance.

Parallel or Serial:

PARALLEL - Enables fast data transfer speeds for high-performance applications.

Terminal Form:

BALL - Provides a reliable connection for long-term use.

No. of Words:

134217728 words - Offers a large storage capacity for data-intensive applications.

Memory Width:

8 - Provides a high data transfer rate for efficient data processing.

Terminal Pitch:

0.8 mm - Allows for precise and compact PCB design.

No. of Words Code:

128M - Indicates a high memory capacity for storing large amounts of data.

Moisture Sensitivity Level (MSL):

3 - Ensures the product can withstand exposure to moisture during handling and storage.

Maximum Supply Voltage (Vsup):

3.6 V - Provides flexibility in power supply options for various applications.

Memory Density:

1073741824 bit - Offers a high-density memory solution for storing large amounts of data.

Memory IC Type:

FLASH - Suitable for fast and efficient data storage and retrieval operations.

Technical Specifications

Flash Memory IS34ML01G081-BLI attributes and parameters. Explore more Flash Memory devices from Integrated Silicon Solution

Specs

JESD-30 Code:

R-PBGA-B63

JESD-609 Code:

e1

Length:

11 mm

Memory Density:

1073741824 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

63

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Programming Voltage (V):

3.3

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

10

Type:

SLC NAND TYPE

Width:

9 mm

Trade Compliance

IS34ML01G081-BLI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 12