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IS34ML01G084-BLI

Integrated Silicon Solution

IS34ML01G084-BLI by Integrated Silicon Solution

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;

Median Price

$3.945

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 193 parts In-Stock

1+ parts

$3.880

100+ parts

$3.070

1k+ parts

$2.950

10k+ parts

$2.670

193

$3.880

$3.070

$2.950

$2.670

DigiKey

USA . 96 parts In-Stock

1+ parts

$4.010

100+ parts

$3.537

1k+ parts

$3.045

10k+ parts

$2.895

96

$4.010

$3.537

$3.045

$2.895

EBV Elektronik

Germany . 220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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220

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-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TME

Poland . 220 parts In-Stock

1+ parts

$3.550

100+ parts

-

1k+ parts

$3.200

10k+ parts

-

220

$3.550

-

$3.200

-

Sensible Micro Corp

USA . 48 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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48

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Cyclops Electronics Ltd

UK . 24 parts In-Stock

1+ parts

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24

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ComSIT Distribution GmbH

Germany . 18 parts In-Stock

1+ parts

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10k+ parts

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18

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Authorized Procurement Solutions

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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12,000

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Technical Specifications

Flash Memory IS34ML01G084-BLI attributes and parameters. Explore more Flash Memory devices from Integrated Silicon Solution

Specs

JESD-30 Code:

R-PBGA-B63

JESD-609 Code:

e1

Length:

11 mm

Memory Density:

1073741824 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

63

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Programming Voltage (V):

3.3

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Type:

SLC NAND TYPE

Width:

9 mm

Trade Compliance

IS34ML01G084-BLI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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