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IS34ML04G081-TLI

Integrated Silicon Solution

IS34ML04G081-TLI by Integrated Silicon Solution

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

Median Price

$9.395

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 96 parts In-Stock

1+ parts

$6.090

100+ parts

$6.090

1k+ parts

$5.980

10k+ parts

-

96

$6.090

$6.090

$5.980

-

Farnell

UK . 89 parts In-Stock

1+ parts

$7.960

100+ parts

$6.080

1k+ parts

$5.850

10k+ parts

-

89

$7.960

$6.080

$5.850

-

Mouser Electronics

USA . 813 parts In-Stock

1+ parts

$9.250

100+ parts

$7.200

1k+ parts

$6.510

10k+ parts

$6.500

813

$9.250

$7.200

$6.510

$6.500

DigiKey

USA . 6,286 parts In-Stock

1+ parts

$9.540

100+ parts

$7.684

1k+ parts

$6.839

10k+ parts

$6.839

6,286

$9.540

$7.684

$6.839

$6.839

Element14

Singapore . 89 parts In-Stock

1+ parts

$12.570

100+ parts

$11.470

1k+ parts

-

10k+ parts

-

89

$12.570

$11.470

-

-

EBV Elektronik

Germany . 96 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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96

-

-

-

-

Verical

USA . 6 parts In-Stock

1+ parts

-

100+ parts

$12.872

1k+ parts

$12.872

10k+ parts

$12.872

6

-

$12.872

$12.872

$12.872

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kepictronics

USA . 187 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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187

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Technical Specifications

Flash Memory IS34ML04G081-TLI attributes and parameters. Explore more Flash Memory devices from Integrated Silicon Solution

Specs

JESD-30 Code:

R-PDSO-G48

Length:

18.4 mm

Memory Density:

4294967296 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

48

No. of Words:

536870912 words

No. of Words Code:

512M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Programming Voltage (V):

3.3

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Type:

SLC NAND TYPE

Width:

12 mm

Trade Compliance

IS34ML04G081-TLI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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