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80HCPS1848CRMI

Integrated Device Technology

80HCPS1848CRMI by Integrated Device Technology

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

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Technical Specifications

Other Function Telecom Interface ICs 80HCPS1848CRMI attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Integrated Device Technology

Specs

JESD-30 Code:

S-PBGA-B784

JESD-609 Code:

e1

Length:

29 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

784

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA784,28X28,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Power Supplies (V):

1,2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.83 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

7940 mA

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

29 mm

Trade Compliance

80HCPS1848CRMI Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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