Loading...

70V657S10DRG8

Integrated Device Technology

70V657S10DRG8 by Integrated Device Technology

MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 996 parts In-Stock

1+ parts

$47.580

100+ parts

-

1k+ parts

-

10k+ parts

$45.677

996

$47.580

-

-

$45.677

Northwest PG Solutions

USA . 2,317 parts In-Stock

1+ parts

$52.338

100+ parts

-

1k+ parts

-

10k+ parts

-

2,317

$52.338

-

-

-

Component Stockers USA

USA . 66 parts In-Stock

1+ parts

$1,541.100

100+ parts

-

1k+ parts

-

10k+ parts

-

66

$1,541.100

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 4,469 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,469

-

-

-

-

Microchip USA

USA . 188 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

188

-

-

-

-

Technical Specifications

SRAM 70V657S10DRG8 attributes and parameters. Explore more SRAM devices from Integrated Device Technology

Specs

Maximum Access Time:

10 ns

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e3

Length:

28 mm

Memory Density:

1179648 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

208

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32KX36

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

4.1 mm

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

28 mm

Trade Compliance

70V657S10DRG8 Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.