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70V3599S166DRG

Integrated Device Technology

70V3599S166DRG by Integrated Device Technology

MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Surface Mount: YES;

Median Price

-

Lifecycle Status

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0

In-Stock Inventory

< 1k

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QUARKTWIN TECHNOLOGY LTD

USA . 21,646 parts In-Stock

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USA . 2,000 parts In-Stock

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2,000

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Native Components

USA . 688 parts In-Stock

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688

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Northwest PG Solutions

USA . 576 parts In-Stock

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576

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USA . 400 parts In-Stock

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400

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Technical Specifications

SRAM 70V3599S166DRG attributes and parameters. Explore more SRAM devices from Integrated Device Technology

Specs

Maximum Access Time:

12 ns

Additional Features:

PIPELINED OR FLOW-THROUGH ARCHITECTURE

Maximum Clock Frequency (fCLK):

166 MHz

Input/Output Type:

COMMON

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e3

Length:

28 mm

Memory Density:

4718592 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

208

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128KX36

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3,3.3

Qualification:

Not Qualified

Maximum Seated Height:

4.1 mm

Maximum Standby Current:

.03 Amp

Minimum Standby Voltage:

3.15 V

Sub-Category:

SRAMs

Maximum Supply Current:

500 mA

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

28 mm

Trade Compliance

70V3599S166DRG Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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