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BTS409L1E3062A

Infineon Technologies

BTS409L1E3062A by Infineon Technologies

BTS409L1E3062A by Infineon Technologies is a peripheral driver with built-in protections for transient, over current, over voltage, thermal, and under voltage. It operates at a supply voltage range of 5V to 34V and has a nominal output peak current limit of 7.5A. This MOS technology-based device is commonly used as a buffer or inverter based peripheral driver in various applications requiring source output current flow direction.

Median Price

$1.810

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

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ComSIT Distribution GmbH

Germany . 5,606 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

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Pegasus Components GmbH

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

France . 1,000 parts In-Stock

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Rutronik

Germany . 1,000 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 979 parts In-Stock

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Vyrian

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Rebound Electronics

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J2 Sourcing AB

Sweden . 227 parts In-Stock

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Digiode

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Zilex Electronics Inc.

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Fibra_Brandt Electronic GMBH

Germany . 113 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Greenchips

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SIE Connect GmbH - GreenChips

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Huijzer Components

Netherlands . 20 parts In-Stock

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AZTECH Wire

Italy . 869 parts In-Stock

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Modulus Dynamics

Lithuania . 2,621 parts In-Stock

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$13.993

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$13.433

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$12.874

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Andel Nordic

Denmark . 2,281 parts In-Stock

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$17.700

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$12.393

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Ampacity Inc.

Singapore . 783 parts In-Stock

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$18.500

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Microchip USA

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Continental Prestige Electronics

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Glotronic Ltd.

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Metaverse IC Inc.

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Argo Parts USA

USA . 885 parts In-Stock

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Corphita

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 80 parts In-Stock

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Spain . 16 parts In-Stock

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Bastille Electronics

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Overview

Unlock the potential of your electronic devices with the BTS409L1E3062A by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies ensures top-quality products that provide reliable performance and durability. This peripheral driver offers built-in protections against transient, over current, over voltage, thermal, and under voltage, giving you peace of mind while powering your devices. With a wide range of applications, from automotive to industrial, this product delivers value, efficiency, and superior functionality. Upgrade your electronics with the BTS409L1E3062A and experience the benefits firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for long-lasting performance.

Surface Mount: YES

Easy to install and saves space on the PCB.

Maximum Supply Voltage: 34 V

Suitable for a wide range of applications requiring higher voltages.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Ensures safety and reliability of connected devices.

Power Supplies (V): 5/34

Compatible with both 5V and 34V power supplies.

No. of Terminals: 6

Simplified connectivity with six terminals.

Package Style (Meter): SMALL OUTLINE

Compact design for efficient use of space on the PCB.

Nominal Output Peak Current Limit: 7.5 A

Capable of handling high current loads for demanding applications.

Turn-on Time: 400 us

Quick response time for immediate activation when needed.

Technical Specifications

Peripheral Drivers BTS409L1E3062A attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PSSO-G6

JESD-609 Code:

e3

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

6

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

7.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP5H,.6,67TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

220

Power Supplies (V):

5/34

Qualification:

Not Qualified

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

34 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

SINGLE

Turn-off Time:

400 us

Turn-on Time:

400 us

Width:

9.2 mm

Trade Compliance

BTS409L1E3062A Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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