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XMC4402F64K256BAXQMA1

Infineon Technologies

XMC4402F64K256BAXQMA1 by Infineon Technologies

Infineon XMC4402F64K256BAXQMA1 is a 32-bit microcontroller with 64 terminals, operating at up to 40 MHz. Ideal for automotive applications, it features DAC and ADC channels, along with various peripherals like LED and USB connectivity. With a temperature range of -40 to 125°C, this CMOS technology-based MCU offers high-speed performance in a compact package.

Median Price

$7.563

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 960 parts In-Stock

1+ parts

$10.880

100+ parts

$7.921

1k+ parts

$6.716

10k+ parts

$6.598

960

$10.880

$7.921

$6.716

$6.598

Rochester

USA . 480 parts In-Stock

1+ parts

-

100+ parts

$6.050

1k+ parts

$5.410

10k+ parts

$5.100

480

-

$6.050

$5.410

$5.100

Verical

USA . 480 parts In-Stock

1+ parts

-

100+ parts

$7.563

1k+ parts

$6.763

10k+ parts

$6.375

480

-

$7.563

$6.763

$6.375

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 766 parts In-Stock

1+ parts

$6.384

100+ parts

-

1k+ parts

-

10k+ parts

-

766

$6.384

-

-

-

Vyrian

USA . 4,837 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,837

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 24 parts In-Stock

1+ parts

$6.048

100+ parts

-

1k+ parts

-

10k+ parts

-

24

$6.048

-

-

-

Modulus Dynamics

Lithuania . 2,343 parts In-Stock

1+ parts

$8.251

100+ parts

$7.921

1k+ parts

$7.591

10k+ parts

-

2,343

$8.251

$7.921

$7.591

-

Microchip USA

USA . 2,679 parts In-Stock

1+ parts

$33.880

100+ parts

$33.400

1k+ parts

$33.150

10k+ parts

$32.910

2,679

$33.880

$33.400

$33.150

$32.910

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$33.888

100+ parts

$30.838

1k+ parts

$27.788

10k+ parts

-

2,000

$33.888

$30.838

$27.788

-

A-Z Elektronik GmbH

Germany . 13,275 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,275

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Futuretech Components

Singapore . 1,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,600

-

-

-

-

Perfect Parts

USA . 1,075 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,075

-

-

-

-

Lixinc

USA . 26 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26

-

-

-

-

Overview

Unleash the power of innovation with the XMC4402F64K256BAXQMA1 by Infineon Technologies. As a leader in microcontroller technology, Infineon delivers top-notch quality and reliability for a wide range of applications. Whether you're looking to enhance automotive systems or boost industrial automation, this microcontroller offers unmatched performance and efficiency. With advanced features like DAC and ADC channels, as well as multiple peripherals, this product provides exceptional value and benefits to customers seeking cutting-edge solutions. Take your projects to the next level with the XMC4402F64K256BAXQMA1 and experience the advantages of Infineon's expertise in microcontroller technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan for the product.

Maximum Supply Voltage: 3.63 V

Allows for a wide range of voltage inputs, increasing compatibility with different systems.

Bit Size: 32

Offers a high bit size for processing data, making the microcontroller suitable for complex applications.

RAM Bytes: 81920

Ample amount of RAM for storing and accessing data quickly, enhancing overall performance.

ADC Channels: YES

Enables analog-to-digital conversion, providing the ability to read external sensors and signals.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient instruction processing, improving overall performance.

Connectivity: CAN(2), ETHERNET, SIO(4), USB

Offers multiple connectivity options for seamless integration with different devices and networks.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for fast data processing and response times, ideal for real-time applications.

Technical Specifications

Microcontrollers XMC4402F64K256BAXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

40

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

81920

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, SIO(4), USB

Peripherals:

DMA(8), LED, POR, RTC, PWM, TIMER(5), WDT

Analog To Digital Convertors:

9-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

XMC4402F64K256BAXQMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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