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XMC4700F144F2048AAXQMA1

Infineon Technologies

XMC4700F144F2048AAXQMA1 by Infineon Technologies

Infineon XMC4700F144F2048AAXQMA1 is a 32-bit microcontroller with 2-Ch 12-Bit DAC and 32-Ch 12-Bit ADC. It features 117 I/O lines, operates at up to 40 MHz, and has CAN, Ethernet, I2C, SPI(2), UART connectivity. Ideal for industrial applications requiring high-speed data processing and multiple communication interfaces.

Median Price

$19.826

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RS (Exports)

UK . 310 parts In-Stock

1+ parts

$14.104

100+ parts

$11.814

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-

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310

$14.104

$11.814

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Chip1Stop

Japan . 360 parts In-Stock

1+ parts

$19.600

100+ parts

$12.800

1k+ parts

$12.400

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360

$19.600

$12.800

$12.400

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Mouser Electronics

USA . 471 parts In-Stock

1+ parts

$19.660

100+ parts

$13.490

1k+ parts

$12.730

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-

471

$19.660

$13.490

$12.730

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DigiKey

USA . 230 parts In-Stock

1+ parts

$19.660

100+ parts

$13.950

1k+ parts

$12.730

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-

230

$19.660

$13.950

$12.730

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Verical

USA . 86 parts In-Stock

1+ parts

$19.993

100+ parts

$13.566

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$13.029

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86

$19.993

$13.566

$13.029

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Newark

USA . 130 parts In-Stock

1+ parts

$20.250

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$13.890

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$13.380

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130

$20.250

$13.890

$13.380

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Farnell

UK . 667 parts In-Stock

1+ parts

$20.365

100+ parts

$15.014

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-

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667

$20.365

$15.014

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Element14

Singapore . 667 parts In-Stock

1+ parts

$21.136

100+ parts

$15.599

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-

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667

$21.136

$15.599

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 847 parts In-Stock

1+ parts

$9.814

100+ parts

-

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847

$9.814

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Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$16.214

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-

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870

$16.214

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Vyrian

USA . 358 parts In-Stock

1+ parts

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358

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 441 parts In-Stock

1+ parts

$8.990

100+ parts

$8.765

1k+ parts

$8.720

10k+ parts

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441

$8.990

$8.765

$8.720

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Ampacity Inc.

Singapore . 323 parts In-Stock

1+ parts

$8.990

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323

$8.990

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Corphita

USA . 538 parts In-Stock

1+ parts

$9.297

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538

$9.297

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Allen Electronics Distributors

USA . 350 parts In-Stock

1+ parts

$11.150

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350

$11.150

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Corohmni

South Africa . 199 parts In-Stock

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$15.194

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199

$15.194

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$16.214

100+ parts

$15.889

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-

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1,000

$16.214

$15.889

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Continental Prestige Electronics

USA . 886 parts In-Stock

1+ parts

$16.550

100+ parts

$12.210

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886

$16.550

$12.210

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Aztec Data Supply Inc.

USA . 4,827 parts In-Stock

1+ parts

$18.840

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4,827

$18.840

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Modulus Dynamics

Lithuania . 2,903 parts In-Stock

1+ parts

$41.219

100+ parts

$39.570

1k+ parts

$37.921

10k+ parts

-

2,903

$41.219

$39.570

$37.921

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Microchip USA

USA . 2,544 parts In-Stock

1+ parts

$46.990

100+ parts

$46.170

1k+ parts

$45.760

10k+ parts

$45.350

2,544

$46.990

$46.170

$45.760

$45.350

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$59.224

100+ parts

$56.263

1k+ parts

$56.263

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2,500

$59.224

$56.263

$56.263

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Argo Parts USA

USA . 1,765 parts In-Stock

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1,765

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Perfect Parts

USA . 560 parts In-Stock

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560

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Eastek

USA . 360 parts In-Stock

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360

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Overview

Experience the power and precision of the XMC4700F144F2048AAXQMA1 microcontroller by Infineon Technologies. Unleash endless possibilities with its cutting-edge technology and robust design. From industrial automation to automotive applications, this versatile device offers unmatched performance and reliability. Say goodbye to limitations and hello to innovation with the XMC4700F144F2048AAXQMA1 - where quality meets excellence. Elevate your projects and exceed expectations with this game-changing microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic body material provides durability and protection for the microcontroller, making it reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.63 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with various applications.

Package Shape: SQUARE

Square package shape facilitates uniform and efficient PCB layout design, optimizing space usage and signal routing.

Bit Size: 32

32-bit architecture enables high processing capabilities and performance for complex tasks and applications.

DAC Channels: YES

On-board DAC channels enable the microcontroller to generate analog outputs, expanding its functionality for diverse applications.

No. of Terminals: 144

Having 144 terminals provides ample connectivity options for interfacing with external devices and peripherals, enhancing versatility.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient data processing and execution, leading to high performance and responsiveness of the microcontroller.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance allows the microcontroller to withstand harsh environmental conditions, ensuring reliable operation in demanding settings.

Connectivity: CAN(6), ETHERNET, I2C, I2S, LIN, MMC, SD, SPI(2), UART, USB, USIC(6)

Wide range of connectivity options enables seamless integration with various communication protocols and peripherals, making it suitable for diverse applications.

Technical Specifications

Microcontrollers XMC4700F144F2048AAXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

117

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

360448

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

144 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6), ETHERNET, I2C, I2S, LIN, MMC, SD, SPI(2), UART, USB, USIC(6)

Peripherals:

CCU4(4), CCU8(2), DMA(2), DTS, EBU, LED, POSIF(2) ,SCU, RTC, WDT

Analog To Digital Convertors:

32-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

XMC4700F144F2048AAXQMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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