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XMC4500F100K768ACXQMA1

Infineon Technologies

XMC4500F100K768ACXQMA1 by Infineon Technologies

XMC4500F100K768ACXQMA1 by Infineon is a 32-bit microcontroller with 100 terminals, DAC and ADC channels, and DMA support. Ideal for automotive applications, it operates b/w -40 to 125 °C with a clock frequency of up to 25 MHz. The package style is flatpack with low profile and gull wing terminal form.

Median Price

$5.710

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 508 parts In-Stock

1+ parts

$5.710

100+ parts

$5.600

1k+ parts

$5.480

10k+ parts

-

508

$5.710

$5.600

$5.480

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 889 parts In-Stock

1+ parts

$5.424

100+ parts

-

1k+ parts

-

10k+ parts

-

889

$5.424

-

-

-

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$11.151

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$11.151

-

-

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Vyrian

USA . 3,997 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,997

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 333 parts In-Stock

1+ parts

$4.850

100+ parts

$4.729

1k+ parts

$4.704

10k+ parts

-

333

$4.850

$4.729

$4.704

-

Ampacity Inc.

Singapore . 181 parts In-Stock

1+ parts

$4.850

100+ parts

-

1k+ parts

-

10k+ parts

-

181

$4.850

-

-

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Corphita

USA . 830 parts In-Stock

1+ parts

$5.139

100+ parts

-

1k+ parts

-

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830

$5.139

-

-

-

Continental Prestige Electronics

USA . 6,798 parts In-Stock

1+ parts

$11.151

100+ parts

-

1k+ parts

-

10k+ parts

$10.928

6,798

$11.151

-

-

$10.928

AZTECH Wire

Italy . 496 parts In-Stock

1+ parts

$17.760

100+ parts

-

1k+ parts

-

10k+ parts

-

496

$17.760

-

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$21.503

100+ parts

$20.428

1k+ parts

$20.428

10k+ parts

-

3,000

$21.503

$20.428

$20.428

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Microchip USA

USA . 1,023 parts In-Stock

1+ parts

$27.165

100+ parts

-

1k+ parts

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1,023

$27.165

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-

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Corohmni

South Africa . 427 parts In-Stock

1+ parts

$63.525

100+ parts

-

1k+ parts

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10k+ parts

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427

$63.525

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-

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Aztec Data Supply Inc.

USA . 1,658 parts In-Stock

1+ parts

$78.160

100+ parts

-

1k+ parts

-

10k+ parts

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1,658

$78.160

-

-

-

Modulus Dynamics

Lithuania . 3,354 parts In-Stock

1+ parts

$79.131

100+ parts

$75.966

1k+ parts

$72.801

10k+ parts

-

3,354

$79.131

$75.966

$72.801

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,000

-

-

-

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Argo Parts USA

USA . 3,912 parts In-Stock

1+ parts

-

100+ parts

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3,912

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-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$10.928

1k+ parts

$10.594

10k+ parts

$10.371

2,000

-

$10.928

$10.594

$10.371

Overview

Unlock the potential of your projects with the XMC4500F100K768ACXQMA1 by Infineon Technologies. As a leading manufacturer in the microcontroller category, Infineon delivers high-quality products that offer unparalleled value to customers. Whether you're working on automotive applications, industrial automation, or consumer electronics, this microcontroller provides the power and performance you need to bring your ideas to life. Experience the benefits of Infineon's reliable technology, seamless integration, and innovative solutions with the XMC4500F100K768ACXQMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the microcontroller lightweight and durable, suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and making production processes more streamlined.

Maximum Supply Voltage: 3.63 V

The high maximum supply voltage provides flexibility in power requirements for the microcontroller, allowing it to work with various power sources.

Package Shape: SQUARE

The square package shape ensures easy and secure placement on the PCB, optimizing space utilization in the design.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex computations and processing tasks efficiently, making it suitable for advanced applications.

DAC Channels: YES

The presence of DAC channels enables the microcontroller to generate analog signals accurately, expanding its capability to interface with external analog devices.

No. of Terminals: 100

Having 100 terminals allows for versatile connectivity options and interfaces, making the microcontroller compatible with a wide range of peripherals and sensors.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

The multiple package styles offer flexibility in mounting and cooling options, catering to different design requirements and environmental conditions.

Minimum Supply Voltage: 3.13 V

The low minimum supply voltage ensures efficient power consumption and compatibility with various power sources, enhancing the energy efficiency of the microcontroller.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the microcontroller can withstand harsh environmental conditions and operate reliably in elevated temperatures.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature allows the microcontroller to function in extreme cold conditions without risk of damage or malfunction.

Terminal Finish: TIN

The TIN terminal finish provides a reliable and corrosion-resistant contact surface, ensuring consistent connectivity and performance over time.

ADC Channels: YES

The inclusion of ADC channels enables the microcontroller to convert analog signals into digital data accurately, enhancing its ability to interface with external sensors and devices.

DMA Channels: YES

The availability of DMA channels allows for efficient data transfer and processing, reducing the workload on the CPU and improving overall system performance.

Terminal Position: QUAD

The quad terminal position offers a balanced layout for easy PCB design and assembly, ensuring neat and organized connections for the microcontroller.

Maximum Seated Height: 1.6 mm

The low maximum seated height ensures a compact form factor for the microcontroller, making it suitable for space-constrained applications and designs.

Width: 14 mm

The compact width of the microcontroller allows for efficient placement on the PCB, optimizing space utilization and enabling compact and slim device designs.

Maximum Clock Frequency: 25 MHz

With a high maximum clock frequency, the microcontroller can execute instructions at a fast pace, enabling quick response times and efficient processing of data.

Length: 14 mm

The short length of the microcontroller contributes to a compact overall footprint, making it suitable for small electronic devices and applications with limited space.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that the microcontroller can withstand the demanding temperature variations and conditions in automotive environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with RISC architecture offers fast and efficient processing capabilities, making it suitable for applications that require high performance and low power consumption.

Technology: CMOS

The CMOS technology used in the microcontroller provides low power consumption and high noise immunity, making it suitable for battery-powered devices and industrial applications.

Terminal Form: GULL WING

The gull wing terminal form offers secure and reliable connections on the PCB, ensuring stable operation and minimizing the risk of signal interference or loss.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V provides stable and consistent power for the microcontroller, ensuring reliable operation and preventing voltage fluctuations.

PWM Channels: YES

The presence of PWM channels allows the microcontroller to generate precise and variable pulse-width modulation signals, enabling control of motors, actuators, and other devices.

ROM Programmability: FLASH

The flash ROM programmability allows for quick and easy firmware updates and modifications, enhancing the flexibility and adaptability of the microcontroller.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables dense and compact layout designs on the PCB, saving space and allowing for more features and components in a limited area.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates that the microcontroller has moderate sensitivity to moisture, making it suitable for use in indoor and controlled environments with standard humidity levels.

Speed: 120 rpm

With a speed of 120 rpm, the microcontroller can process data and execute instructions at a fast rate, ensuring quick response times and efficient operation for various applications.

On Chip Program ROM Width: 8

The 8-bit width of the on-chip program ROM allows for efficient storage and retrieval of program instructions, enhancing the performance and responsiveness of the microcontroller.

No. of I/O Lines: 73

Having 73 I/O lines provides ample connectivity options for interfacing with external devices and peripherals, making the microcontroller versatile and adaptable to different system requirements.

Technical Specifications

Microcontrollers XMC4500F100K768ACXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

73

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

XMC4500F100K768ACXQMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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