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XMC4700F100K2048AAXQMA1

Infineon Technologies

XMC4700F100K2048AAXQMA1 by Infineon Technologies

XMC4700F100K2048AAXQMA1 by Infineon Technologies is a 32-bit microcontroller with a max clock frequency of 40 MHz. It features 2-channel 12-bit DAC and 24-channel 12-bit ADC, making it suitable for applications requiring analog-to-digital conversion. With its connectivity options including CAN, Ethernet, I2C, SPI, UART, USB, and more, it is ideal for automotive and industrial applications.

Median Price

$18.940

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 777 parts In-Stock

1+ parts

$16.790

100+ parts

$11.320

1k+ parts

-

10k+ parts

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777

$16.790

$11.320

-

-

Newark

USA . 34 parts In-Stock

1+ parts

$21.090

100+ parts

$14.700

1k+ parts

$14.240

10k+ parts

-

34

$21.090

$14.700

$14.240

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Element14

Singapore . 1,035 parts In-Stock

1+ parts

$22.101

100+ parts

$17.140

1k+ parts

-

10k+ parts

-

1,035

$22.101

$17.140

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-

Mouser Electronics

USA . 836 parts In-Stock

1+ parts

$24.070

100+ parts

$15.950

1k+ parts

$13.300

10k+ parts

-

836

$24.070

$15.950

$13.300

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Arrow

USA . 540 parts In-Stock

1+ parts

$1,054.790

100+ parts

-

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-

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540

$1,054.790

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Future Electronics

Canada . 540 parts In-Stock

1+ parts

-

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$11.400

10k+ parts

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540

-

-

$11.400

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Verical

USA . 140 parts In-Stock

1+ parts

-

100+ parts

$15.137

1k+ parts

$13.550

10k+ parts

$12.750

140

-

$15.137

$13.550

$12.750

Rochester

USA . 140 parts In-Stock

1+ parts

-

100+ parts

$12.110

1k+ parts

$10.840

10k+ parts

$10.200

140

-

$12.110

$10.840

$10.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 256 parts In-Stock

1+ parts

$16.122

100+ parts

-

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-

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256

$16.122

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-

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Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$17.425

100+ parts

-

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600

$17.425

-

-

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Component Electronics Inc.

Canada . 1,440 parts In-Stock

1+ parts

$19.230

100+ parts

$14.420

1k+ parts

$12.500

10k+ parts

-

1,440

$19.230

$14.420

$12.500

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Chip Stock

USA . 6,000 parts In-Stock

1+ parts

-

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6,000

-

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NAC Semi

USA . 1,620 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

$30.730

10k+ parts

$27.650

1,620

-

-

$30.730

$27.650

Vyrian

USA . 917 parts In-Stock

1+ parts

-

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917

-

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Rutronik

Germany . 870 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$13.460

10k+ parts

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870

-

-

$13.460

-

IBS Electronics

USA . 540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$15.989

10k+ parts

-

540

-

-

$15.989

-

TME

Poland . 254 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$16.440

10k+ parts

-

254

-

-

$16.440

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NexGen Digital

USA . 9 parts In-Stock

1+ parts

-

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9

-

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Whistler Technology

UK . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,208 parts In-Stock

1+ parts

$10.500

100+ parts

$10.238

1k+ parts

$10.185

10k+ parts

-

1,208

$10.500

$10.238

$10.185

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Ampacity Inc.

Singapore . 1,581 parts In-Stock

1+ parts

$10.780

100+ parts

-

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1,581

$10.780

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Corphita

USA . 670 parts In-Stock

1+ parts

$15.273

100+ parts

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670

$15.273

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-

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Continental Prestige Electronics

USA . 511 parts In-Stock

1+ parts

$17.730

100+ parts

$13.780

1k+ parts

-

10k+ parts

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511

$17.730

$13.780

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Modulus Dynamics

Lithuania . 4,494 parts In-Stock

1+ parts

$22.613

100+ parts

$21.708

1k+ parts

$20.804

10k+ parts

-

4,494

$22.613

$21.708

$20.804

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$24.637

100+ parts

$23.405

1k+ parts

$23.405

10k+ parts

-

3,000

$24.637

$23.405

$23.405

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Microchip USA

USA . 2,832 parts In-Stock

1+ parts

$49.130

100+ parts

$48.270

1k+ parts

$47.850

10k+ parts

$47.420

2,832

$49.130

$48.270

$47.850

$47.420

Corohmni

South Africa . 148 parts In-Stock

1+ parts

$52.431

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-

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148

$52.431

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Aztec Data Supply Inc.

USA . 19,196 parts In-Stock

1+ parts

$83.957

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-

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19,196

$83.957

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Robosynatics

Brazil . 3,623 parts In-Stock

1+ parts

-

100+ parts

$17.449

1k+ parts

$17.093

10k+ parts

$17.093

3,623

-

$17.449

$17.093

$17.093

Lucentia Tech

USA . 3,623 parts In-Stock

1+ parts

-

100+ parts

$17.449

1k+ parts

$17.093

10k+ parts

$17.093

3,623

-

$17.449

$17.093

$17.093

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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2,500

-

-

-

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Perfect Parts

USA . 605 parts In-Stock

1+ parts

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605

-

-

-

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Futuretech Components

Singapore . 576 parts In-Stock

1+ parts

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576

-

-

-

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GreenTree Electronics

Israel . 370 parts In-Stock

1+ parts

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100+ parts

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370

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Argo Parts USA

USA . 71 parts In-Stock

1+ parts

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71

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Eastek

USA . 19 parts In-Stock

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19

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Overview

Experience the power of the XMC4700F100K2048AAXQMA1 microcontroller by Infineon Technologies. As a leader in the industry, Infineon is known for its exceptional quality and reliability. The XMC4700F100K2048AAXQMA1 offers a wide range of applications, making it ideal for various fields. But what sets this product apart is its unbeatable value and incredible benefits. With advanced features like powerful DAC and ADC channels, robust DMA functionality, and extensive connectivity options, this microcontroller provides endless possibilities for your projects. Whether you're designing automotive systems, industrial automation, or consumer electronics, the XMC4700F100K2048AAXQMA1 will exceed your expectations. Trust Infineon to deliver cutting-edge technology that empowers innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various environments and applications.

Surface Mount: YES

The surface mount feature enables easy installation and space-saving on electronic PCBs, making it convenient for compact designs.

Maximum Supply Voltage: 3.63 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power sources, increasing its versatility.

Package Shape: SQUARE

The square shape allows for efficient use of board space and simplifies design layouts, contributing to compact and optimized circuit designs.

Bit Size: 32

The 32-bit architecture provides enhanced processing power, enabling the microcontroller to handle complex tasks and applications.

DAC Channels: YES

The presence of DAC (Digital-to-Analog Converter) channels allows for precise conversion of digital signals to analog, making it suitable for applications that require accurate analog output.

No. of Terminals: 100

With a high number of terminals, this microcontroller offers ample connectivity options, accommodating various peripherals and components.

Package Style: FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

This versatile package style provides flexibility in mounting and cooling options, making it ideal for different form factors and thermal requirements.

Minimum Supply Voltage: 3.13 V

The low minimum supply voltage ensures compatibility with lower power sources, making it suitable for energy-efficient devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the microcontroller to withstand harsh environments and temperature fluctuations, ensuring reliable performance in demanding conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in cold environments, expanding the range of applications for this microcontroller.

Terminal Finish: TIN

The tin terminal finish provides corrosion resistance, ensuring long-term reliability and maintaining electrical performance.

ADC Channels: YES

The availability of ADC (Analog-to-Digital Converter) channels allows for precise conversion of analog signals to digital, making it suitable for applications that require accurate analog input.

DMA Channels: YES

The presence of DMA (Direct Memory Access) channels enables efficient data transfer between peripherals and memory, reducing the workload on the microcontroller and enhancing overall system performance.

Terminal Position: QUAD

The quad terminal position offers easy access and soldering of components, simplifying the assembly process and reducing manufacturing time.

ROM Words: 2097152

With a large amount of ROM (Read-Only Memory) words, this microcontroller can store substantial amounts of program code, allowing for complex and feature-rich applications.

Maximum Seated Height: 1.6 mm

The low maximum seated height facilitates the integration of the microcontroller in slim and space-constrained designs, enabling compact and sleek electronic devices.

Digital To Analog Convertors: 2-Ch 12-Bit

The presence of two 12-bit digital-to-analog converters enables accurate and precise analog output generation, making it suitable for applications requiring high-resolution analog signals.

Width: 14 mm

The compact width dimension allows for space-efficient placement on PCBs, contributing to streamlined designs and optimal utilization of available space.

Peripherals: CCU4(4), CCU8(2), DMA(2), DTS, EBU, LED, POSIF(2), SCU, RTC, WDT

The extensive range of peripherals offers versatile functionality, enhancing the microcontroller's capabilities and enabling the implementation of various features.

Maximum Clock Frequency: 40 MHz

With a high maximum clock frequency, this microcontroller can process instructions and data at a rapid rate, allowing for responsive and efficient operation.

Length: 14 mm

The compact length dimension simplifies the placement of the microcontroller on PCBs, providing flexibility in circuit design and accommodating space limitations.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that the microcontroller can operate reliably under the temperature conditions typically encountered in automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller's RISC (Reduced Instruction Set Computing) architecture offers efficient and streamlined execution of instructions, contributing to high-performance computing capabilities.

RAM Bytes: 360448

With a substantial amount of RAM (Random-Access Memory), this microcontroller can efficiently store and access data during program execution, facilitating the implementation of complex algorithms and data-intensive tasks.

Technology: CMOS

Built with CMOS technology, this microcontroller offers low power consumption, making it suitable for battery-powered and energy-efficient applications.

Terminal Form: GULL WING

The gull-wing terminal form simplifies surface mount soldering, ensuring reliable electrical connections and enabling automated assembly processes.

Analog To Digital Convertors: 24-Ch 12-Bit

The presence of twenty-four 12-bit analog-to-digital converters enables precise and simultaneous conversion of multiple analog signals, making it ideal for applications with multiple analog input requirements.

Nominal Supply Voltage: 3.3 V

The 3.3 V nominal supply voltage ensures compatibility with standard voltage levels, facilitating seamless integration with other components and power sources.

Connectivity: CAN(6), ETHERNET, I2C, I2S, LIN, MMC, SD, SPI(2), UART, USB, USIC(6)

The broad range of connectivity options allows for easy integration into various communication protocols and networks, enhancing the microcontroller's versatility and compatibility.

ROM Programmability: FLASH

The use of flash memory for ROM programmability enables easy and efficient firmware updates or modifications, facilitating iterative development and system improvements.

Terminal Pitch: 0.5 mm

The small terminal pitch simplifies board layout and routing, allowing for a higher number of interfaces or peripheral connections within limited board space.

Moisture Sensitivity Level (MSL): 3

With an MSL level of 3, this microcontroller has moderate sensitivity to moisture, requiring appropriate handling and storage to prevent potential damage.

Speed: 144 rpm

The high speed capability of 144 rpm allows for fast and responsive data processing, meeting the demands of real-time applications and high-performance computing tasks.

On Chip Program ROM Width: 8

With an on-chip program ROM width of 8, this microcontroller can efficiently store and execute instructions, contributing to optimized program execution and efficient memory utilization.

No. of I/O Lines: 73

The abundance of 73 I/O (Input/Output) lines provides ample connectivity for interfacing with external components, facilitating versatile and expandable system designs.

Technical Specifications

Microcontrollers XMC4700F100K2048AAXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

73

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

360448

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

144 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6), ETHERNET, I2C, I2S, LIN, MMC, SD, SPI(2), UART, USB, USIC(6)

Peripherals:

CCU4(4), CCU8(2), DMA(2), DTS, EBU, LED, POSIF(2) ,SCU, RTC, WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

XMC4700F100K2048AAXQMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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