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XMC4200F64K256ABXQSA1

Infineon Technologies

XMC4200F64K256ABXQSA1 by Infineon Technologies

Infineon XMC4200F64K256ABXQSA1 is a 32-bit microcontroller with 10-Ch 12-Bit ADC, 2-Ch 12-Bit DAC, and Flash ROM. Ideal for automotive applications with CAN(2) and USB connectivity, operating at up to 40 MHz clock frequency. Features include DMA(8), PWM channels, and RISC technology in a compact square package.

Median Price

$6.570

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$6.570

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500

$6.570

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Vyrian

USA . 10,197 parts In-Stock

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10,197

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Digiode

USA . 972 parts In-Stock

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972

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$6.439

100+ parts

-

1k+ parts

$6.181

10k+ parts

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1,000

$6.439

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$6.181

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Continental Prestige Electronics

USA . 6,366 parts In-Stock

1+ parts

$6.570

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$6.439

6,366

$6.570

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$6.439

Ampacity Inc.

Singapore . 1,566 parts In-Stock

1+ parts

$11.000

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1,566

$11.000

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AZTECH Wire

Italy . 327 parts In-Stock

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$12.778

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327

$12.778

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Modulus Dynamics

Lithuania . 3,527 parts In-Stock

1+ parts

$47.830

100+ parts

$45.917

1k+ parts

$44.004

10k+ parts

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3,527

$47.830

$45.917

$44.004

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Argo Parts USA

USA . 4,056 parts In-Stock

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Corphita

USA . 902 parts In-Stock

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Microchip USA

USA . 286 parts In-Stock

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286

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Overview

Discover unparalleled quality and innovation with the Infineon Technologies XMC4200F64K256ABXQSA1 microcontroller. Designed to exceed expectations, this cutting-edge device offers superior performance and reliability in a compact package. Ideal for a wide range of applications, from automotive systems to industrial automation, this microcontroller delivers unmatched value and benefits to customers seeking advanced solutions. Trust in Infineon Technologies to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy installation on circuit boards, making it convenient for manufacturers.

Maximum Supply Voltage: 3.63 V

Provides a safe operating range for the microcontroller, preventing damage from overvoltage.

Bit Size: 32

32-bit architecture allows for higher processing power and performance compared to lower bit sizes.

DAC Channels: YES

Allows for digital-to-analog conversion, making it suitable for applications requiring analog output.

No. of Terminals: 64

Provides ample connectivity options for interfacing with other components or peripherals.

Minimum Operating Temperature: -40 °C

Capable of operating in harsh environments with low temperatures, making it suitable for a variety of applications.

ADC Channels: YES

Analog-to-digital conversion capability allows for processing of analog signals, increasing versatility.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and performance.

ROM Words: 262144

Large ROM capacity allows for storing a substantial amount of program data or instructions.

Maximum Clock Frequency: 40 MHz

High clock frequency enables fast data processing and execution speed.

RAM Bytes: 40960

Sufficient RAM capacity for temporary data storage and processing, ensuring smooth operation of the microcontroller.

Analog To Digital Convertors: 10-Ch 12-Bit

Multiple analog-to-digital converters provide flexibility for handling multiple analog inputs.

Connectivity: CAN(2), USB, USIC(4)

Offers a variety of communication interfaces for connecting to external devices or networks.

Technical Specifications

Microcontrollers XMC4200F64K256ABXQSA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

44

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

40960

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), USB, USIC(4)

Peripherals:

DMA(8), DTS, LEDTS, POR, PWM, RTC, TIMER(3), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

XMC4200F64K256ABXQSA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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