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TLE9879QXA40XUMA3

Infineon Technologies

TLE9879QXA40XUMA3 by Infineon Technologies

TLE9879QXA40XUMA3 by Infineon: 32-bit CORTEX-M3 MCU with 48 terminals, 25 MHz clock, and 5-Ch 10-Bit ADC. Ideal for automotive applications due to AEC-Q100 screening, LIN connectivity, and low power mode support.

Median Price

$3.728

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,219 parts In-Stock

1+ parts

$3.680

100+ parts

-

1k+ parts

$3.510

10k+ parts

$3.360

1,219

$3.680

-

$3.510

$3.360

DigiKey

USA . 1,803 parts In-Stock

1+ parts

$4.180

100+ parts

-

1k+ parts

-

10k+ parts

-

1,803

$4.180

-

-

-

Future Electronics

Canada . 20 parts In-Stock

1+ parts

$5.980

100+ parts

$5.020

1k+ parts

$4.750

10k+ parts

$4.390

20

$5.980

$5.020

$4.750

$4.390

Rochester

USA . 6,392 parts In-Stock

1+ parts

-

100+ parts

$3.020

1k+ parts

$2.700

10k+ parts

$2.540

6,392

-

$3.020

$2.700

$2.540

Verical

USA . 3,757 parts In-Stock

1+ parts

-

100+ parts

$3.775

1k+ parts

$3.375

10k+ parts

$3.175

3,757

-

$3.775

$3.375

$3.175

Avnet

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.750

2,500

-

-

-

$2.750

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 999 parts In-Stock

1+ parts

$3.401

100+ parts

-

1k+ parts

-

10k+ parts

-

999

$3.401

-

-

-

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$3.700

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$3.700

-

-

-

Chip Stock

USA . 11,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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11,500

-

-

-

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Vyrian

USA . 1,590 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,590

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,921 parts In-Stock

1+ parts

$2.680

100+ parts

-

1k+ parts

-

10k+ parts

-

1,921

$2.680

-

-

-

Semicontronic

India . 1,890 parts In-Stock

1+ parts

$2.680

100+ parts

$2.613

1k+ parts

$2.600

10k+ parts

-

1,890

$2.680

$2.613

$2.600

-

Corphita

USA . 237 parts In-Stock

1+ parts

$3.222

100+ parts

-

1k+ parts

-

10k+ parts

-

237

$3.222

-

-

-

Aranea Global

USA . 500 parts In-Stock

1+ parts

$3.626

100+ parts

-

1k+ parts

$3.481

10k+ parts

-

500

$3.626

-

$3.481

-

Continental Prestige Electronics

USA . 4,515 parts In-Stock

1+ parts

$3.700

100+ parts

-

1k+ parts

-

10k+ parts

$3.626

4,515

$3.700

-

-

$3.626

Argo Parts USA

USA . 1,654 parts In-Stock

1+ parts

$3.700

100+ parts

-

1k+ parts

-

10k+ parts

-

1,654

$3.700

-

-

-

Microchip USA

USA . 4,013 parts In-Stock

1+ parts

$22.230

100+ parts

$22.090

1k+ parts

$22.020

10k+ parts

$21.950

4,013

$22.230

$22.090

$22.020

$21.950

Corohmni

South Africa . 198 parts In-Stock

1+ parts

$36.250

100+ parts

-

1k+ parts

-

10k+ parts

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198

$36.250

-

-

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Modulus Dynamics

Lithuania . 3,780 parts In-Stock

1+ parts

$51.109

100+ parts

$49.065

1k+ parts

$47.020

10k+ parts

-

3,780

$51.109

$49.065

$47.020

-

Aztec Data Supply Inc.

USA . 271 parts In-Stock

1+ parts

$69.640

100+ parts

-

1k+ parts

-

10k+ parts

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271

$69.640

-

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Overview

Unleash the power of innovation with the TLE9879QXA40XUMA3 microcontroller from Infineon Technologies. Designed with cutting-edge technology and precision engineering, this microcontroller offers unmatched quality and reliability. Ideal for a wide range of applications, this product provides seamless connectivity and efficient performance. Experience the value and benefits of Infineon's expertise in microcontrollers with the TLE9879QXA40XUMA3, where quality meets functionality for unparalleled results.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact and efficient mounting on circuit boards, making the product suitable for space-constrained applications.

Maximum Supply Voltage: 28 V

Ability to operate at a higher voltage range provides flexibility in different power supply configurations.

On Chip Data RAM Width: 8

Wide data RAM width enables fast and efficient data processing capabilities within the microcontroller.

Screening Level: AEC-Q100

Compliance with AEC-Q100 automotive reliability standards ensures high quality and durability, ideal for automotive applications.

Package Shape: SQUARE

Square package shape allows for easy integration and placement within the circuit design.

Bit Size: 32

32-bit architecture provides enhanced processing power and performance for complex applications.

No. of Terminals: 48

Sufficient number of terminals for versatile connectivity options and interfaces.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles offer flexibility in thermal management and space-saving designs.

Minimum Supply Voltage: 5.5 V

Low minimum supply voltage allows for energy-efficient operation and extends battery life in portable devices.

Maximum Operating Temperature: 150 °C

High operating temperature range ensures reliability and performance in extreme environmental conditions.

CPU Family: CORTEX-M3

Based on the ARM Cortex-M3 architecture, offering efficient processing capabilities and industry-standard performance.

No. of External Interrupts: 2

External interrupt support enables efficient handling of external events and real-time responsiveness.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in harsh cold environments without compromising performance.

ADC Channels: YES

Built-in analog-to-digital converters enable precise and accurate conversion of analog signals for sensor interfacing.

DMA Channels: YES

Direct Memory Access channels enhance data transfer speeds and offload the CPU for efficient multitasking capabilities.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and connection arrangements for easier integration.

ROM Words: 131072

Large ROM capacity allows for storing and executing a wide range of program codes and applications.

Maximum Seated Height: 0.9 mm

Ultra-thin profile with low seated height enables compact and slim product designs.

Width: 7 mm

Compact width size facilitates easy placement and integration within limited space constraints.

Data EEPROM Size: 4K

Sufficient EEPROM storage for data retention and non-volatile memory requirements.

Peripherals: BOR, POR, SCU, TIMER(4), WDT(2)

Variety of essential peripherals such as Brown-Out Reset, Power-On Reset, Timer, and Watchdog Timer enhance system reliability and functionality.

Maximum Clock Frequency: 25 MHz

High clock frequency supports fast processing speeds and real-time operations for demanding applications.

Length: 7 mm

Compact length size for space-saving designs and easy PCB layout arrangements.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture offers efficient and streamlined processing capabilities for optimized performance.

No. of Timers: 4

Multiple timers allow for precise timing control and event scheduling in complex applications.

RAM Bytes: 6144

Sufficient RAM capacity for temporary data storage and efficient program execution.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation for energy-efficient performance.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures eco-friendly product design.

Analog To Digital Convertors: 5-Ch 10-Bit

Multiple analog-to-digital converters with 10-bit resolution enable accurate and simultaneous conversion of analog signals for diverse sensor inputs.

Maximum Supply Current: 40 mA

Low supply current consumption for efficient power usage and extended battery life in portable devices.

Nominal Supply Voltage: 13.5 V

Stable and reliable nominal supply voltage ensures consistent performance and operation of the microcontroller.

No. of DMA Channels: 13

Abundance of DMA channels for high-speed data transfer and efficient memory management.

No. of Serial I/Os: 2

Multiple serial I/O interfaces for communication with external devices and peripherals.

PWM Channels: YES

Support for Pulse-Width Modulation channels enables precise control of analog signals and motor speed regulations.

Connectivity: LIN, SSC(2), UART(2)

Diverse connectivity options including LIN, SSC, and UART interfaces for seamless communication and network integration.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick firmware updates and modifications for enhanced flexibility.

Terminal Pitch: 0.5 mm

Fine terminal pitch size for high-density mounting and compact PCB designs.

Format: FIXED POINT

Fixed-point data format simplifies mathematical calculations and enhances computational efficiency.

Speed: 40 rpm

Robust speed capability of 40 revolutions per minute for motor control and motion applications.

Low Power Mode: YES

Built-in low power mode for energy-saving operation and extended battery life in power-sensitive applications.

On Chip Program ROM Width: 8

Wide program ROM width for storing and executing program code efficiently within the microcontroller.

No. of I/O Lines: 10

Adequate number of I/O lines for versatile inputs and outputs, enabling flexible interfacing with external components.

Technical Specifications

Microcontrollers TLE9879QXA40XUMA3 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

13

No. of External Interrupts:

2

No. of I/O Lines:

10

No. of Serial I/Os:

2

No. of Terminals:

48

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

6144

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Speed:

40 rpm

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

4K

Connectivity:

LIN, SSC(2), UART(2)

Peripherals:

BOR, POR, SCU, TIMER(4), WDT(2)

Analog To Digital Convertors:

5-Ch 10-Bit

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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