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TLE9879QXA20XUMA1

Infineon Technologies

TLE9879QXA20XUMA1 by Infineon Technologies

TLE9879QXA20XUMA1 by Infineon is a 32-bit microcontroller with 48 terminals, PWM and ADC channels, and DMA support. Operating at up to 25 MHz clock frequency, it's ideal for applications requiring precise motor control like robotics or automotive systems. With a wide supply voltage range of 5.5V to 28V, it offers flexibility in various electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,310 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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Digiode

USA . 599 parts In-Stock

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Ampacity Inc.

Singapore . 1,607 parts In-Stock

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$3.000

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AZTECH Wire

Italy . 408 parts In-Stock

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Microchip USA

USA . 2,282 parts In-Stock

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$27.903

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Modulus Dynamics

Lithuania . 410 parts In-Stock

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$34.507

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$33.127

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$31.746

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410

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$31.746

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Continental Prestige Electronics

USA . 4,406 parts In-Stock

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Argo Parts USA

USA . 3,523 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

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Bastille Electronics

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Overview

Unlock the power of innovation with the TLE9879QXA20XUMA1 by Infineon Technologies. As a leader in microcontrollers, Infineon delivers top-tier quality and reliability. Ideal for a wide range of applications, this product offers unparalleled value with its advanced features and high performance. Whether you're looking to enhance your project with ADC and DMA channels or benefit from its 32-bit size, the TLE9879QXA20XUMA1 is the perfect choice for your next endeavor. Experience the difference with Infineon Technologies today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design makes it easy to integrate this microcontroller into compact electronic devices.

Maximum Supply Voltage: 28 V

Allows for a wide range of power supply options, making it versatile for different applications.

Package Shape: SQUARE

Square package shape allows for efficient use of PCB space and easy placement on the board.

Bit Size: 32

32-bit architecture provides high processing power for complex tasks and calculations.

No. of Terminals: 48

Ample number of terminals for connecting various external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles to choose from based on design requirements, offering flexibility in mounting and cooling options.

Minimum Supply Voltage: 5.5 V

Low minimum supply voltage allows for efficient power consumption and operation in battery-powered devices.

ADC Channels: YES

Built-in ADC channels enable analog signal processing without requiring additional external components.

DMA Channels: YES

DMA (Direct Memory Access) channels enhance data transfer speed and efficiency, improving overall system performance.

Terminal Position: QUAD

Quad terminal position ensures stable and secure connectivity to the PCB, reducing the risk of signal interference.

Width: 7 mm

Compact width dimension for easy integration into space-constrained electronic devices.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency offers fast processing speed, suitable for real-time applications and high-speed data processing.

Length: 7 mm

Short length dimension for efficient use of PCB space and compact design implementations.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture allows for efficient code execution and high performance in embedded systems.

Terminal Form: NO LEAD

No lead terminal form simplifies the soldering process and improves overall manufacturing efficiency.

Nominal Supply Voltage: 13.5 V

Stable nominal supply voltage ensures consistent operation and reliability of the microcontroller in various operating conditions.

PWM Channels: YES

Built-in PWM channels enable precise control of analog output signals, essential for motor control and power management applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting, allowing for more terminals in a limited space for enhanced connectivity options.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller is moisture-resistant, ensuring reliability in humid environments.

Speed: 24 rpm

Optimal speed capability for a wide range of applications, from low-speed to moderate-speed devices.

No. of I/O Lines: 10

Sufficient number of I/O lines for interfacing with external devices and sensors, enhancing the microcontroller's versatility in applications.

Technical Specifications

Microcontrollers TLE9879QXA20XUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

10

No. of Terminals:

48

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Speed:

24 rpm

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

TLE9879QXA20XUMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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