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TLE9844QXXUMA1

Infineon Technologies

TLE9844QXXUMA1 by Infineon Technologies

TLE9844QXXUMA1 by Infineon Technologies is an 8-bit microcontroller with DAC and ADC channels, suitable for applications requiring a max clock frequency of 6 MHz. This square-shaped chip carrier features 48 terminals with a terminal pitch of 0.5 mm, making it ideal for use in high-speed control systems. With a nominal voltage of 1.5 V and PWM channels available, this microcontroller offers precise control and efficient performance in various electronic devices.

Median Price

$2.538

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,500 parts In-Stock

1+ parts

$5.420

100+ parts

$3.428

1k+ parts

$3.068

10k+ parts

-

2,500

$5.420

$3.428

$3.068

-

Rochester

USA . 10,154 parts In-Stock

1+ parts

-

100+ parts

$2.270

1k+ parts

$2.030

10k+ parts

$1.910

10,154

-

$2.270

$2.030

$1.910

Verical

USA . 8,155 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.538

10k+ parts

$2.388

8,155

-

-

$2.538

$2.388

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 661 parts In-Stock

1+ parts

$2.394

100+ parts

-

1k+ parts

-

10k+ parts

-

661

$2.394

-

-

-

Vyrian

USA . 936 parts In-Stock

1+ parts

$2.520

100+ parts

-

1k+ parts

-

10k+ parts

-

936

$2.520

-

-

-

Bristol Electronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

-

-

-

-

Nova Conductors

Japan . 60 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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60

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,816 parts In-Stock

1+ parts

$2.140

100+ parts

$2.086

1k+ parts

$2.076

10k+ parts

-

1,816

$2.140

$2.086

$2.076

-

Ampacity Inc.

Singapore . 1,614 parts In-Stock

1+ parts

$2.140

100+ parts

-

1k+ parts

-

10k+ parts

-

1,614

$2.140

-

-

-

Corphita

USA . 113 parts In-Stock

1+ parts

$2.268

100+ parts

-

1k+ parts

-

10k+ parts

-

113

$2.268

-

-

-

Modulus Dynamics

Lithuania . 785 parts In-Stock

1+ parts

$2.700

100+ parts

$2.592

1k+ parts

$2.484

10k+ parts

-

785

$2.700

$2.592

$2.484

-

Corohmni

South Africa . 157 parts In-Stock

1+ parts

$2.700

100+ parts

-

1k+ parts

-

10k+ parts

-

157

$2.700

-

-

-

Continental Prestige Electronics

USA . 2,500 parts In-Stock

1+ parts

$3.510

100+ parts

$2.280

1k+ parts

$1.520

10k+ parts

-

2,500

$3.510

$2.280

$1.520

-

Component Stockers USA

USA . 1,669 parts In-Stock

1+ parts

$5.000

100+ parts

$3.680

1k+ parts

$2.640

10k+ parts

-

1,669

$5.000

$3.680

$2.640

-

Microchip USA

USA . 1,068 parts In-Stock

1+ parts

$15.428

100+ parts

-

1k+ parts

-

10k+ parts

-

1,068

$15.428

-

-

-

A-Z Elektronik GmbH

Germany . 4,907 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,907

-

-

-

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

-

-

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Kepictronics

USA . 1,440 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,440

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-

-

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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50

-

-

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Overview

Unlock the potential of your next project with the TLE9844QXXUMA1 by Infineon Technologies. As a leading manufacturer of high-quality microcontrollers, Infineon delivers unmatched performance and reliability. Ideal for a wide range of applications, this product offers customers exceptional value, benefits, and advantages. From its advanced features to its innovative design, the TLE9844QXXUMA1 is the perfect solution for all your microcontroller needs. Experience the difference with Infineon today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and simplifying assembly processes.

Package Shape: SQUARE

The square package shape is commonly used for microcontrollers, providing a compact and efficient design for integration into various electronic devices.

Bit Size: 8

8-bit architecture allows for efficient data processing and control, suitable for a wide range of applications including embedded systems and IoT devices.

DAC Channels: YES

Digital-to-analog converter channels enable accurate conversion of digital signals to analog outputs, essential for applications requiring precise control of analog components.

No. of Terminals: 48

Having 48 terminals provides sufficient connectivity options for interfacing with external peripherals and sensors, making the microcontroller versatile and capable of handling complex tasks.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offer heat dissipation efficiency and space-saving features, enhancing the performance and reliability of the microcontroller.

Terminal Finish: TIN

Tin terminal finish ensures good conductivity and durability, improving the overall functionality and lifespan of the microcontroller.

ADC Channels: YES

Analog-to-digital converter channels enable precise measurement and conversion of analog signals into digital data, essential for sensor interfacing and data acquisition applications.

Terminal Position: QUAD

Quad terminal positions provide multiple options for connecting external devices and peripherals, offering flexibility in design and integration.

Width: 7 mm

With a compact width of 7mm, the microcontroller can fit into tight spaces and compact designs, making it suitable for small form-factor applications.

Maximum Clock Frequency: 6 MHz

A maximum clock frequency of 6 MHz ensures fast and efficient data processing, enabling real-time control and operation of connected devices.

Length: 7 mm

The length of 7mm complements the compact width of the microcontroller, providing a square form factor that is ideal for space-constrained applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller enhances processing speed and efficiency, making it suitable for applications that require high performance and low power consumption.

Terminal Form: NO LEAD

No-lead terminal form simplifies the assembly process and reduces the risk of soldering issues, ensuring reliable and consistent connections for the microcontroller.

Nominal Supply Voltage: 1.5 V

With a low nominal supply voltage of 1.5V, the microcontroller is energy-efficient and suitable for battery-powered applications, extending the operating life of the device.

PWM Channels: YES

Pulse-width modulation channels enable precise control of output signals, making the microcontroller suitable for applications that require accurate voltage and frequency control.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5mm provides fine spacing for soldering connections, enhancing the overall reliability and durability of the microcontroller in various operating conditions.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring proper handling and storage to prevent damage, ensuring the reliability and performance of the microcontroller.

Speed: 25 rpm

A speed of 25 revolutions per minute indicates the rotation speed of a component or motor that can be controlled by the microcontroller, offering precise speed control for various applications.

No. of I/O Lines: 10

Having 10 input/output lines provides sufficient flexibility for connecting external devices and peripherals, enabling efficient data exchange and communication with the microcontroller.

Technical Specifications

Microcontrollers TLE9844QXXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

6 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

10

No. of Terminals:

48

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Speed:

25 rpm

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

TLE9844QXXUMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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