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TLE9873QXW40XUMA1

Infineon Technologies

TLE9873QXW40XUMA1 by Infineon Technologies

TLE9873QXW40XUMA1 by Infineon: 32-bit CORTEX-M3 microcontroller with 48 terminals, 24 MHz clock frequency, and LIN/SSC/UART connectivity. Ideal for automotive applications due to AEC-Q100 screening, low power mode, and 5-Ch 10-Bit ADC channels.

Median Price

$3.769

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 2,490 parts In-Stock

1+ parts

$3.000

100+ parts

$2.640

1k+ parts

$2.620

10k+ parts

-

2,490

$3.000

$2.640

$2.620

-

DigiKey

USA . 1,982 parts In-Stock

1+ parts

$4.650

100+ parts

-

1k+ parts

-

10k+ parts

-

1,982

$4.650

-

-

-

Rochester

USA . 2,992 parts In-Stock

1+ parts

-

100+ parts

$3.350

1k+ parts

$3.000

10k+ parts

$2.820

2,992

-

$3.350

$3.000

$2.820

Verical

USA . 2,068 parts In-Stock

1+ parts

-

100+ parts

$4.188

1k+ parts

$3.750

10k+ parts

$3.525

2,068

-

$4.188

$3.750

$3.525

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 23 parts In-Stock

1+ parts

$3.572

100+ parts

-

1k+ parts

-

10k+ parts

-

23

$3.572

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$4.300

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$4.300

-

-

-

Vyrian

USA . 691 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

691

-

-

-

-

Bristol Electronics

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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250

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,490 parts In-Stock

1+ parts

$3.000

100+ parts

$2.640

1k+ parts

-

10k+ parts

-

2,490

$3.000

$2.640

-

-

Semicontronic

India . 1,433 parts In-Stock

1+ parts

$3.170

100+ parts

$3.091

1k+ parts

$3.075

10k+ parts

-

1,433

$3.170

$3.091

$3.075

-

Ampacity Inc.

Singapore . 941 parts In-Stock

1+ parts

$3.170

100+ parts

-

1k+ parts

-

10k+ parts

-

941

$3.170

-

-

-

Corphita

USA . 551 parts In-Stock

1+ parts

$3.384

100+ parts

-

1k+ parts

-

10k+ parts

-

551

$3.384

-

-

-

Component Stockers USA

USA . 4,093 parts In-Stock

1+ parts

$3.760

100+ parts

$3.760

1k+ parts

$3.760

10k+ parts

-

4,093

$3.760

$3.760

$3.760

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$4.300

100+ parts

-

1k+ parts

$4.085

10k+ parts

$3.999

2,000

$4.300

-

$4.085

$3.999

Modulus Dynamics

Lithuania . 1,504 parts In-Stock

1+ parts

$4.560

100+ parts

$4.378

1k+ parts

$4.195

10k+ parts

-

1,504

$4.560

$4.378

$4.195

-

Corohmni

South Africa . 758 parts In-Stock

1+ parts

$4.560

100+ parts

-

1k+ parts

-

10k+ parts

-

758

$4.560

-

-

-

Microchip USA

USA . 2,512 parts In-Stock

1+ parts

$22.710

100+ parts

$22.570

1k+ parts

$22.500

10k+ parts

$22.430

2,512

$22.710

$22.570

$22.500

$22.430

QUARKTWIN TECHNOLOGY LTD

USA . 18,579 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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18,579

-

-

-

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Argo Parts USA

USA . 5,085 parts In-Stock

1+ parts

-

100+ parts

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5,085

-

-

-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,000

-

-

-

-

Overview

Unlock limitless possibilities with the TLE9873QXW40XUMA1 from Infineon Technologies. This high-quality microcontroller offers unparalleled value with its advanced features and reliable performance. Ideal for a wide range of applications, this product stands out for its versatility, efficiency, and innovation. Experience seamless connectivity, optimized power consumption, and superior functionality. Elevate your projects with the TLE9873QXW40XUMA1 and unleash the full potential of your designs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and compact PCB assembly, making this microcontroller suitable for small and space-constrained designs.

Maximum Supply Voltage: 28 V

Support for a high maximum supply voltage enables compatibility with a wide range of power sources and applications.

On Chip Data RAM Width: 8

Having an 8-bit data RAM width allows for efficient data processing and manipulation within the microcontroller.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality of the microcontroller, making it suitable for automotive applications where robustness is critical.

Package Shape: SQUARE

Square package shape provides a balanced layout and ease of mounting, contributing to a simpler PCB design.

Bit Size: 32

The 32-bit architecture enables powerful computing capabilities and higher precision in data processing tasks.

No. of Terminals: 48

Having 48 terminals offers flexibility in interfacing with external components and peripherals, enhancing the microcontroller's versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles allows for efficient heat dissipation and space-saving design.

Minimum Supply Voltage: 5.5 V

Support for a low minimum supply voltage ensures compatibility with a variety of power sources while maintaining energy efficiency.

Maximum Operating Temperature: 175 °C

High maximum operating temperature tolerance makes this microcontroller suitable for demanding environments and extended operating conditions.

CPU Family: CORTEX-M3

The ARM Cortex-M3 architecture offers excellent performance, energy efficiency, and a wide range of development tools and support for software development.

No. of External Interrupts: 3

Supporting 3 external interrupts allows the microcontroller to respond quickly to external events and signals, enhancing real-time responsiveness.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature tolerance makes this microcontroller suitable for harsh and cold environments without compromising performance.

Terminal Finish: TIN

Tin terminal finish provides good solderability and conductivity, ensuring reliable connections and ease of assembly during manufacturing.

Technical Specifications

Microcontrollers TLE9873QXW40XUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

13

No. of External Interrupts:

3

No. of I/O Lines:

15

No. of Serial I/Os:

3

No. of Terminals:

48

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

3072

ROM Words:

49152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Speed:

40 rpm

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

4K

Connectivity:

LIN, SSC(2), UART(2)

Peripherals:

DMA(13), POR, TIMER(4), WDT

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

TLE9873QXW40XUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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