Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
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Modulus Dynamics
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Other Function Interface ICs TLE8264EXUMA1 attributes and parameters. Explore more Other Function Interface ICs devices from Infineon Technologies
Interface IC Type:
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TLE8264EXUMA1 Interface ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Mult Dev Label Chgs 11/Jan/2018
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
SS14
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 40; Minimum DS Breakdown Voltage: 60 V;
MBR0520LT1
Onsemi
MBR0520LT1 by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring low power consumption in compact electronic devices. This single-configured diode is surface mountable and has a max repetitive peak reverse voltage of 20V, ideal for small outline package designs.
1N4148WT
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Zowie Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
ESD5Z5.0T1G
ESD5Z5.0T1G by Onsemi is a unidirectional Trans Voltage Suppressor Diode with 5V reverse test voltage and 174W peak power dissipation. It is used for transient suppression in electronic circuits, meeting IEC-61000-4-2, 4-4 standards and UL recognized for reliability.
LD1117S33TR
STMicroelectronics
LD1117S33TR by STMicroelectronics is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 1.3A. It has a small outline package style, operates at an adjustable temperature range from 0 to 125°C, and is ideal for applications requiring stable voltage regulation in compact electronic devices.
Taiwan Semiconductor
2N2222A
General Diode
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
FDLL4148
National Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
OPA2277UA/2K5
Texas Instruments
OPA2277UA/2K5 by Texas Instruments is a dual operational amplifier with low offset voltage of 100 uV and micropower consumption of 0.004 uA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1 MHz. With a compact rectangular package style, it is suitable for surface mount designs in various electronic systems.
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
LL4148
Goodwork Semiconductor
BSS138
Vishay Intertechnology
Vishay Intertechnology's BSS138 is a N-CHANNEL FET with SINGLE configuration and ENHANCEMENT MODE operation. It features 0.35W power dissipation, METAL-OXIDE SEMICONDUCTOR tech, and 150°C max temp. Ideal for surface mount applications in various electronic circuits requiring efficient power management.
CRG0805F10R
TE Connectivity
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
Toshiba
DS18B20Z/T&R
Maxim Integrated
DS18B20Z/T&R by Maxim Integrated is a 12-bit digital temperature sensor with a max supply voltage of 5.5V and an accuracy of 0.50°C. It features a 1-Wire interface, operates b/w -55°C to 125°C, and is ideal for applications requiring precise temperature monitoring in compact spaces.
SI8641EC-B-IS1R
Skyworks Solutions
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm;
MAX253CSA+T
INTERFACE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
MAX13035EETE+T
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
PTN5110HQZ
NXP Semiconductors
PTN5110HQZ by NXP Semiconductors is a 16-terminal interface IC with a supply voltage range of 2.7V to 5.5V, operating temperature from -40°C to 85°C. It features a square package style and is suitable for applications requiring other function interface ICs in compact designs.
LTC6820IMS#TRPBF
Linear Technology
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
TXS0108ENMER
TXS0108ENMER by Texas Instruments is an 8-bit interface IC with a supply voltage range of 1.4V to 3.6V and operating temperature from -40°C to 85°C. It features a 3-STATE output characteristic, very thin profile package style, and a grid array package shape. Ideal for industrial applications requiring precise signal interfacing in compact spaces.
ISO7240CFDWRG4
ISO7240CFDWRG4 by Texas Instruments is a digital isolator with 4 functions, operating at -40 to 125 °C. It has a supply voltage range of 3.15-3.6 V and is suitable for automotive applications due to its nickel palladium gold finish and small outline package style.
TXB0108DQSR
TXB0108DQSR by Texas Instruments is an 8-bit interface IC with a max supply voltage of 3.6V and operating temperature range of -40 to 85°C. It features a small outline package style, surface mount capability, and 3-state output characteristics. Ideal for industrial applications requiring reliable signal interfacing in compact designs.
SI8641BB-B-IS1R
Silicon Labs
SI8641BB-B-IS1R by Silicon Labs is a 16-terminal digital isolator with 4 functions. It operates b/w -40 to 125°C, with supply voltage ranging from 2.375V to 5.5V. Ideal for applications requiring small outline packages and surface mount technology.
CLT3-4BT6
CLT3-4BT6 by STMicroelectronics is a 4-function interface IC with 20 terminals, operating at 24V. It features a small outline package with nickel palladium gold terminal finish. Ideal for applications requiring an interface circuit in temperature range of -25 to 85°C.
NVT2002DP,118
NXP Semiconductors' NVT2002DP,118 is an 8-terminal interface IC with a max supply voltage of 5.5V and operating temperature range of -40 to 85°C. Its small outline package makes it suitable for industrial applications requiring precise signal interfacing in compact spaces.
ADUM1401CRWZ-RL
Analog Devices
ADUM1401CRWZ-RL by Analog Devices is a 16-terminal IC with 4 functions, operating b/w -40 to 105°C. It supports EIA-232, EIA-422, and EIA-485 interfaces at supply voltages ranging from 2.7V to 5.5V. Ideal for industrial applications requiring small outline packages with dual terminal positions.
SI8662BC-B-IS1R
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G16;
SN6505AQDBVRQ1
SN6505AQDBVRQ1 by Texas Instruments is a small outline interface IC with 6 terminals, operating at -40 to 125 °C. It has a max output current of 1.5 A and supports supply voltage from 2.25 V to 5.5 V, making it ideal for automotive applications requiring low profile components in harsh environments.
ADUM1411BRWZ
ADUM1411BRWZ by Analog Devices is a small outline interface IC with 16 terminals. It operates b/w -40 to 105°C, suitable for industrial applications. With a supply voltage range of 2.7V to 5.5V, it features CMOS technology and matte tin terminal finish for robust performance.
ADUM5241ARZ-RL7
ADUM5241ARZ-RL7 by Analog Devices is a small outline interface IC with 8 terminals. It operates in an industrial temperature range of -40 to 105°C and has a max supply voltage of 5.5V. This IC is commonly used for other function interface applications.
AY0438I/P
General Semiconductor
AY0438I/P by General Semiconductor is a 40-terminal CMOS IC with 32 segments, operating at 5V. It features a rectangular package style, PLASTIC/EPOXY body material, and Tin/Lead terminal finish. Ideal for applications requiring segment display mode in temperatures ranging from 0 to 85°C.
PCA9306DP1,125
PCA9306DP1,125 by NXP Semiconductors is a dual-function interface IC with 8 terminals. It operates b/w 1V to 5.5V supply voltage range and supports industrial temperature grade applications. The small outline package has a thin profile and shrink pitch, making it suitable for various electronic devices requiring voltage level translation.
NLSV2T244MUTAG
NLSV2T244MUTAG by Onsemi is an interface IC with a max supply voltage of 4.5V and min operating temperature of -40°C, suitable for industrial applications. It features a small outline package style, dual terminal position, and nickel palladium gold finish, making it ideal for compact electronic devices requiring reliable connectivity at varying temperatures.
ISO7220ADR
ISO7220ADR by Texas Instruments is a dual-channel interface IC with CMOS technology. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 3.3V to 5V, it comes in a small outline package ideal for surface mount assembly.
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TLE82632EXUMA2
Infineon Technologies
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH;
TLE82622EXUMA2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G36;
TLE8261E
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Maximum Supply Voltage: 28 V;
TLE8263-2E
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
TLE8262EXT
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR; Nominal Supply Voltage: 13.5 V;
TLE8262-2E
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Nominal Supply Voltage: 13.5 V;
TLE8263E
TLE82612EXT
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR; Width: 7.6 mm;
TLE8262E
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
TLE8261EXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
TLE8262EXUMA3
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
TLE8262EXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
TLE8261EXUMA3
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
TLE82632EXUMA1
TLE82612EXUMA2
TLE82622EXUMA1
TLE8261-2E
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Terminal Pitch: .65 mm;
TLE82612EXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): NOT SPECIFIED;
TLE8261EXUMA2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Width: 7.6 mm;
TLE8262EXUMA2
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