Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
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Other Function Interface ICs TLE82612EXUMA2 attributes and parameters. Explore more Other Function Interface ICs devices from Infineon Technologies
Additional Features:
Interface IC Type:
JESD-30 Code:
Length:
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No. of Terminals:
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Package Code:
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Package Style (Meter):
Peak Reflow Temperature (C):
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TLE82612EXUMA2 Interface ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
LM358MX
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
BAV99
Zetex Plc
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SBAV99LT1G
Onsemi
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
LFXTAL025159REEL
Iqd Frequency Products
LFXTAL025159REEL by IQD Frequency Products is a 32.768 kHz crystal oscillator with 20 ppm frequency tolerance and 40,000 ohm series resistance. It is ideal for applications requiring precise timekeeping, such as real-time clocks in IoT devices or microcontrollers in wearables. The surface-mount design with a drive level of 1 uW makes it suitable for compact electronic systems.
LM555CN
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
1N4148
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 175 Cel; Maximum Reverse Recovery Time: .004 us; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V;
CRG0805F10R
TE Connectivity
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
MBRA340T3G
MBRA340T3G by Onsemi is a Schottky rectifier diode with 40V reverse test voltage and 3A max output current. Ideal for power applications, it operates b/w -55 to 150°C, features matte tin terminal finish, and comes in a small outline package.
Meritek Electronics
BSS123-7-F
Diodes Incorporated
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
SMBJ18CA
Thinking Electronic Industrial
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
BAT54SLT1G
BAT54SLT1G by Onsemi is a fast recovery Schottky diode with 2 elements in series connected configuration. It has a max reverse recovery time of 0.005 us and a max forward voltage of 0.8 V. Ideal for applications requiring high-speed rectification, it operates b/w -55 to 150 °C and can handle a max output current of 0.2 A.
LL4148
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Taitron Components
Fairchild Semiconductor
MBRS130LT3G
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Diotec Semiconductor Ag
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; Maximum Time At Peak Reflow Temperature (s): 10;
BSS138
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
ADUM3400CRWZ
Analog Devices
ADUM3400CRWZ by Analog Devices is a 16-terminal IC with CMOS technology. It features matte tin finish, small outline package style, and dual terminal position. Widely used in industrial applications for interface circuits due to its compact size and surface-mount capability.
ADUM1301ARWZ
ADUM1301ARWZ by Analog Devices is a 16-terminal IC with 3 functions, operating b/w -40 to 105°C. It supports EIA-232, EIA-422, and EIA-485 interfaces at supply voltages ranging from 2.7V to 5.5V. Ideal for industrial applications requiring small outline packages with gull wing terminals.
XISO7041DBQR
Texas Instruments
XISO7041DBQR by Texas Instruments is a 16-terminal interface IC with 4 functions. It operates b/w -40 to 125 °C and supports supply voltage range of 2.25-3.6 V, making it ideal for automotive applications requiring small outline package with gull wing terminals.
SI8631BB-B-IS1
Silicon Labs
SI8631BB-B-IS1 by Silicon Labs is a digital isolator with 16 terminals, operating voltage range of 2.5V to 5.5V, and AEC-Q100 screening for automotive applications. It features CMOS technology, GULL WING terminal form, and small outline package style suitable for various interface functions in automotive electronics.
254
Micronetics
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; Package Code: DFP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel;
ISO7841DWR
ISO7841DWR by Texas Instruments is a digital isolator with 4 channels, operating at -55 to 125 °C. It has a supply voltage range of 2.25-5.5 V and comes in a small outline package suitable for military-grade applications. The IC features CMOS technology, Gull Wing terminals, and is surface mountable with moisture sensitivity level of 2.
ISO7721DWVR
ISO7721DWVR by Texas Instruments is a dual-function interface IC with 2 channels. It operates b/w -55 to 125°C, suitable for military-grade applications. With a compact rectangular package style and surface-mount capability, it offers high reliability in various electronic systems.
ADUM1402CRWZ-RL
ADUM1402CRWZ-RL by Analog Devices is a 16-terminal IC with 4 functions, operating b/w -40 to 105°C. It supports EIA-232, EIA-422, and EIA-485 interfaces at 3V nominal voltage for industrial applications. The small outline package measures 10.3mm x 7.5mm with a max seated height of 2.65mm, making it suitable for compact designs requiring reliable signal interfacing.
SI8641BB-B-IS1
Skyworks Solutions
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
PCA9517ADP-T
NXP Semiconductors
PCA9517ADP-T by NXP Semiconductors is an 8-terminal interface IC with a supply voltage range of 0.9V to 5.5V, suitable for industrial applications. It features a small outline package style, operates b/w -40°C to 85°C, and has a terminal pitch of 0.65mm for surface mount assembly.
ADUM141E1BRWZ-RL
ADUM141E1BRWZ-RL by Analog Devices is a 4-function digital isolator with a supply voltage range of 1.7V to 5.5V, ideal for automotive applications. It features a small outline package style, dual terminal position, and operates in temperatures ranging from -40°C to 125°C.
ISO7220AD
ISO7220AD by Texas Instruments is a dual-channel interface IC with CMOS technology. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 3.3V to 5V and compact dimensions of 4.905mm x 3.895mm, it offers reliable signal isolation in small outline packages.
MAX12931BASA+T
MAX12931BASA+T by Analog Devices is a digital isolator with 8 terminals, operating from -40 to 125°C. It has a supply voltage range of 1.71V to 5.5V and uses BICMOS technology. This small outline IC is ideal for applications requiring surface mount packages in various electronic devices.
PCA9511ADP,118
PCA9511ADP,118 by NXP Semiconductors is an 8-terminal interface IC with a supply voltage range of 2.7V to 5.5V and max current of 6mA. It operates in industrial temperatures (-40°C to 85°C) and is suitable for applications requiring thin profile, surface-mountable ICs like signal buffering or level shifting in electronic devices.
TXS0104EPWRG4
TXS0104EPWRG4 by Texas Instruments is a 4-bit interface IC with max supply voltage of 5.5V and min operating temp of -40°C. It's used in industrial applications for signal interfacing due to its small outline package and 3-state output characteristics.
MAX253ESA+T
MAX253ESA+T by Analog Devices is an 8-terminal IC with a supply voltage range of 4.5V to 5.5V, operating temperature from -40°C to 85°C, and peak reflow temperature of 260°C. It is a CMOS technology interface circuit in a small outline package suitable for industrial applications requiring precise signal interfacing and control within tight space constraints.
ISO7721FDWVR
ISO7721FDWVR by Texas Instruments is a dual-function interface IC with 2 channels. It operates b/w -55 to 125 °C and supports supply voltage from 2.25V to 5.5V. With a small outline package style, it's ideal for military-grade applications requiring high-temperature resistance and reliability.
LT4430ES6#TRMPBF
Linear Technology
INTERFACE CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: VSSOP; Package Shape: RECTANGULAR;
ISO7720DR
ISO7720DR by Texas Instruments is a dual-function interface IC with 2 channels. It operates b/w -55 to 125°C, suitable for military-grade applications. With a small outline package and surface-mount capability, it has a terminal pitch of 1.27mm and supports CMOS technology.
SI8645BA-B-IU
SI8645BA-B-IU by Silicon Labs is a digital isolator with 4 functions, operating voltage range of 2.375V to 5.5V, and temperature range from -40°C to 125°C. It comes in a small outline package suitable for surface mount applications in various electronic devices.
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TLE82632EXUMA2
Infineon Technologies
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH;
TLE82622EXUMA2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G36;
TLE8261E
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Maximum Supply Voltage: 28 V;
TLE8263-2E
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
TLE8262EXT
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR; Nominal Supply Voltage: 13.5 V;
TLE8262-2E
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Nominal Supply Voltage: 13.5 V;
TLE8263E
TLE82612EXT
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR; Width: 7.6 mm;
TLE8262E
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
TLE8261EXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
TLE8262EXUMA3
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
TLE8262EXUMA1
TLE8261EXUMA3
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
TLE82632EXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
TLE82622EXUMA1
TLE8261-2E
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Terminal Pitch: .65 mm;
TLE82612EXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): NOT SPECIFIED;
TLE8261EXUMA2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Width: 7.6 mm;
TLE8262EXUMA2
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