Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Maximum Supply Voltage: 28 V;
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Other Function Interface ICs TLE8263E attributes and parameters. Explore more Other Function Interface ICs devices from Infineon Technologies
Interface IC Type:
JESD-30 Code:
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TLE8263E Interface ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
SS14
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
NC7WZ17P6X
Onsemi
The Onsemi NC7WZ17P6X is a logic gate with 2 functions, featuring a propagation delay of 13.1 ns at 1.8V supply voltage. Ideal for industrial applications, it operates b/w -40 to 85°C and has a max power supply current of 100mA. With Schmitt Trigger technology and small outline packaging, it suits compact electronic designs requiring fast signal processing.
Hitano Enterprise
SMBJ18CA
Protek Devices
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32H750VBT6
STMicroelectronics
STM32H750VBT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20 timers and 16 DMA channels. It features 2 DAC and 16 ADC channels, suitable for industrial applications requiring high-speed processing up to 48 MHz. With extensive connectivity options like FDCAN, Ethernet, and USB, it provides versatile solutions in a compact package.
Meritek Electronics
TM4C1294NCPDTI3
Texas Instruments
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
BAV99
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Continental Device India
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M24308/2-1F
Esterline Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Option-1: HOLE .115-.125; Mounting Type: CABLE AND PANEL; Mating Contact Finish: NOT SPECIFIED;
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
Weitronic Enterprise
2N7002
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JEDEC-95 Code: TO-236AB; Qualification: Not Qualified; Package Style (Meter): SMALL OUTLINE;
Frontier Electronics
LM555CM
Renesas Electronics
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
KSZ9031RNXIC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
Terry Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V;
MAX7301AAX+T
Analog Devices
MAX7301AAX+T by Analog Devices is a CMOS interface IC with 36 terminals, operating from -40 to 125 °C. It has a supply voltage range of 2.5V to 5.5V and is ideal for automotive applications due to its small outline package and matte tin finish.
TFBS4711-TT1
Vishay Intertechnology
TFBS4711-TT1 by Vishay Intertechnology is a CMOS interface IC with 6 terminals. It operates b/w -25°C to 85°C, with supply voltage ranging from 2.4V to 5.5V. This MICROELECTRONIC ASSEMBLY is ideal for applications requiring INTERFACE CIRCUIT technology in compact spaces.
SI8641ED-B-IS2
Silicon Labs
SI8641ED-B-IS2 by Silicon Labs is a 16-terminal digital isolator with 4 functions. It operates b/w -40 to 125°C, with supply voltage range of 2.375-5.5V. Ideal for applications requiring small outline surface mount ICs in plastic/epoxy packages.
ISOW7741FBDFMR
ISOW7741FBDFMR by Texas Instruments is a 20-terminal IC with 4 functions, operating b/w -40 to 125°C. It has a supply voltage range of 2.97-3.63V and features GULL WING terminals for interface circuits in various applications. The package style is small outline with heat sink, making it suitable for compact designs requiring reliable signal isolation.
SI8600AC-B-ISR
SI8600AC-B-ISR by Silicon Labs is an 8-terminal interface IC with a supply voltage range of 3V to 5.5V, operating b/w -40°C to 125°C. Its small outline package and gull wing terminals make it suitable for various applications requiring precise interface circuitry in compact spaces.
ADUM5401CRWZ
ADUM5401CRWZ by Analog Devices is a 16-terminal interface IC with supply voltage range of 3V to 5.5V, operating temperature from -40°C to 105°C. It is used in industrial applications requiring small outline package and dual terminal position for reliable performance.
SI8642BB-B-IS1
Skyworks Solutions
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm;
SN6505DQDBVTQ1
SN6505DQDBVTQ1 by Texas Instruments is a small outline, low profile interface IC with 6 terminals and 1.5A output current. Operating b/w -40 to 125°C, it's AEC-Q100 compliant for automotive applications. With a supply voltage range of 2.25V to 5.5V, it's ideal for various function interface requirements in automotive electronics.
PCA9306DC1,125
NXP Semiconductors
PCA9306DC1,125 by NXP Semiconductors is an interface IC with 8 terminals and a supply voltage range of 1.1V to 5.5V. It operates in industrial temperatures (-40°C to 85°C) and has a small outline package style for applications requiring level shifting or bus buffering in various electronic devices.
ISO7821FDWWR
The Texas Instruments ISO7821FDWWR is a CMOS interface IC with 2 functions, suitable for military-grade applications. It operates b/w -55 to 125 °C and supports a supply voltage range of 2.25-5.5 V. With a small outline package style, it features dual terminals with nickel palladium gold finish for robust connectivity.
ISO7762DW
ISO7762DW by Texas Instruments is a 16-terminal IC with 6 functions, operating b/w -55 to 125 °C. It has a supply voltage range of 2.25-5.5 V and uses CMOS technology. This interface circuit in a small outline package is ideal for military-grade applications requiring high reliability and dual terminal positions.
PCA9511AD,112
PCA9511AD,112 by NXP Semiconductors is an 8-terminal IC with a supply voltage range of 2.7V to 5.5V and max current of 6mA. It operates in industrial temperatures (-40°C to 85°C) and has a compact rectangular package ideal for interface circuit applications.
TXB0104PWR
TXB0104PWR by Texas Instruments is a 14-terminal IC with 4 bits, operating at -40 to 85°C. It has a max supply voltage of 5.5V and output polarity is TRUE. Ideal for industrial applications requiring a small outline package with surface mount capabilities and low power consumption of 0.01mA.
TXB0102DCUTG4
TXB0102DCUTG4 by Texas Instruments is an 8-terminal interface IC with a max supply voltage of 5.5V and operating temperature range of -40 to 85°C. It features a small outline package style, 3-state output characteristics, and dual terminal position. Ideal for industrial applications requiring precise signal interfacing in compact electronic devices.
PI4IOE5V6416ZDEX
PI4IOE5V6416ZDEX by Diodes Incorporated is a 24-terminal interface IC with a supply voltage range of 1.65V to 5.5V and operating temperature from -40°C to 85°C. This chip carrier package has a square shape, 0.9mm seated height, and 0.5mm terminal pitch, making it suitable for various other function interface applications.
6ES7132-6BH01-0BA0
Siemens
Digital O/P Module;
SI8641ED-B-IS
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage: 5 V;
XISO6742DWR
XISO6742DWR by Texas Instruments is a small outline interface IC with 16 terminals. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 1.71V to 5.5V, it features nickel palladium gold terminal finish and gull wing form factor for surface mount assembly.
ISO7741FEDWRQ1
ISO7741FEDWRQ1 by Texas Instruments is a 16-terminal IC with 4 functions, operating at -50 to 150°C. It has a supply voltage range of 2.25-5.5V and is AEC-Q100 compliant for automotive applications. The CMOS technology interface circuit is surface-mountable and features Gull Wing terminals, making it suitable for various automotive electronic systems.
TXS0104ERGYR
TXS0104ERGYR by Texas Instruments is a 4-bit interface IC with max supply voltage of 3.6V and operating temp range of -40 to 85 °C. It's used in industrial applications, featuring surface mount package style and quad terminal position for versatile integration.
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TLE82632EXUMA2
Infineon Technologies
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH;
TLE82622EXUMA2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G36;
TLE8261E
TLE8263-2E
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
TLE8262EXT
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR; Nominal Supply Voltage: 13.5 V;
TLE8262-2E
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Nominal Supply Voltage: 13.5 V;
TLE82612EXT
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR; Width: 7.6 mm;
TLE8262E
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
TLE8261EXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
TLE8262EXUMA3
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
TLE8262EXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
TLE8261EXUMA3
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
TLE82632EXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
TLE82612EXUMA2
TLE82622EXUMA1
TLE8261-2E
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Terminal Pitch: .65 mm;
TLE82612EXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): NOT SPECIFIED;
TLE8261EXUMA2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Width: 7.6 mm;
TLE8262EXUMA2
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