Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Maximum Supply Voltage: 28 V;
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Other Function Interface ICs TLE8263E attributes and parameters. Explore more Other Function Interface ICs devices from Infineon Technologies
Interface IC Type:
JESD-30 Code:
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TLE8263E Interface ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
BAV99
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Uniohm
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58-360
Molex
CONNECTOR ACCESSORY; Alternate Contact Sources: MILITARY; Removal Tool Sources: MILITARY; Material: COPPER ALLOY; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354;
Vishay Intertechnology
Vishay Intertechnology's SMBJ18CA is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with a max clamping voltage of 29.2 V and a breakdown voltage of 21.05 V. It is surface mountable and commonly used in transient suppression applications.
LM358ADR
Texas Instruments
LM358ADR by Texas Instruments is an operational amplifier with 2 functions, featuring a max input offset voltage of 5000 uV and nominal voltage of 5V. Widely used in applications requiring high voltage gain, it operates within a temperature range of 0-70°C and offers frequency compensation for stability.
2N2222A
Electronic Transistors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
CL31B104KBCNNNC
Samsung Electro-mechanics
Samsung Electro-mechanics CL31B104KBCNNNC is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It features X7R temperature characteristics, -55 to 125 °C operating range, and compact SMT package style. Ideal for applications requiring high reliability in compact electronic devices.
1N4148
Vicor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Hitano Enterprise
BSS138DW-7-F
Diodes Incorporated
BSS138DW-7-F by Diodes Incorporated is a N-channel small signal FET with a min DS breakdown voltage of 50V. It is used for switching applications and operates in enhancement mode. This surface mount transistor has a max drain current of 0.2A and a max power dissipation of 0.2W.
1N4148WT
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M/a-com Technology Solutions
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Terminal Position: BOTTOM; Package Style (Meter): CYLINDRICAL;
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): .715 V; Maximum Operating Temperature: 150 Cel; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .2 A;
1N4148WS-7-F
1N4148WS-7-F by Diodes Inc. is a single rectifier diode with max reverse recovery time of 0.004 us and max reverse current of 1 uA. It operates b/w -65 to 150 °C, ideal for applications requiring small outline surface mount diodes with a max output current of 0.15 A.
OPA2277UA/2K5
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
EPCS4SI8N
Intel
EPCS4SI8N by Intel is a small outline flash memory with 512Kx8 organization, operating at 3.3V. It features a max clock frequency of 40MHz and endurance of 100k write/erase cycles. Ideal for industrial applications requiring configuration memory with serial interface and low standby current consumption.
Dc Components
LM358D-T
NXP Semiconductors
LM358D-T by NXP Semiconductors is a dual operational amplifier with 70dB CMRR, 1000kHz unity gain bandwidth, and 9000uV max input offset voltage. Widely used in commercial applications due to its small outline package and low bias current of 0.5uA.
MAX7301ATL+TGH7
Maxim Integrated
MAX7301ATL+TGH7 by Maxim Integrated is a CMOS interface IC with 40 terminals, operating b/w -40 to 125 °C. It has a supply voltage range of 2.5V to 5.5V and is suitable for automotive applications due to its high-temperature grade. The package style is chip carrier with a very thin profile, making it ideal for space-constrained designs.
PCA9517DP,118
PCA9517DP,118 by NXP Semiconductors is a voltage level translator IC with 8 terminals and supply voltages of 3/3.3V. It operates b/w -40 to 85°C, suitable for industrial applications. The small outline package has a max seated height of 1.1mm, making it ideal for space-constrained designs.
ADUM1201ARZ
Analog Devices
ADUM1201ARZ by Analog Devices is a dual-function interface IC with 2 functions, operating at 2.7-5.5V, ideal for industrial applications. It comes in a small outline package with 8 terminals and CMOS technology, suitable for surface mount assembly up to 260°C peak reflow temperature.
ADUM1250SRZ
ADUM1250SRZ by Analog Devices is an 8-terminal interface IC with a supply voltage range of 3V to 5.5V. It operates in temperatures from -40°C to 125°C, making it suitable for automotive applications. The package style is small outline rectangular, with surface mount capability and Gull Wing terminal form.
SI8642BB-B-IS
Silicon Labs
SI8642BB-B-IS by Silicon Labs is a digital isolator with 4 functions. It operates at a voltage range of 2.375V to 5.5V and has a small outline package style. It is commonly used in applications requiring interface isolation, such as industrial automation and power systems.
MAX14933ASE+
MAX14933ASE+ by Analog Devices is a 16-terminal digital isolator with a supply voltage range of 2.25V to 5.5V. Operating temperature ranges from -40°C to 125°C, making it suitable for various industrial applications requiring reliable signal isolation in compact spaces. The package style is small outline rectangular, with gull wing terminals and matte tin finish for easy surface mounting.
ISO7742QDWQ1
ISO7742QDWQ1 by Texas Instruments is a 16-terminal IC with 4 functions, operating at -40 to 125 °C. It has a supply voltage range of 2.25V to 5.5V and is AEC-Q100 compliant for automotive applications. The package style is small outline, suitable for surface mount assembly in various interface circuits.
HMC677LP5ETR
HMC677LP5ETR by Analog Devices is a BICMOS interface IC with a package size of 5x5mm. It operates at temperatures ranging from -40 to 85°C and has a max supply voltage of 5.5V. This IC is commonly used in industrial applications requiring an interface circuit with very thin profile packaging.
MAX7301AAI
MAX7301AAI by Maxim Integrated is a CMOS interface IC with 28 terminals in a small outline package. It operates at temperatures ranging from -40 to 125 °C and has a max supply voltage of 5.5 V. This IC is commonly used in automotive applications for its compact size and reliable performance.
PCA9517ADP/DG,118
PCA9517ADP/DG,118 by NXP Semiconductors is an 8-terminal IC with a max supply voltage of 5.5V and min operating temp of -40°C. Ideal for industrial applications, it features a small outline package style and CMOS technology for interface circuits.
ISO7741QDBQQ1
ISO7741QDBQQ1 by Texas Instruments is a 4-channel interface IC with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 2.25-5.5 V, making it ideal for automotive applications requiring AEC-Q100 screening. The small outline package with dual terminals and nickel/palladium/gold finish ensures reliability in harsh environments.
ZIOL2401BI1W
Integrated Device Technology
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
CLT3-4BT6
STMicroelectronics
CLT3-4BT6 by STMicroelectronics is a 4-function interface IC with 20 terminals, operating at 24V. It features a small outline package with nickel palladium gold terminal finish. Ideal for applications requiring an interface circuit in temperature range of -25 to 85°C.
ISO7341CDWR
ISO7341CDWR by Texas Instruments is a 16-terminal IC with 4 functions, operating at -40 to 125°C. It has a supply voltage range of 3.3V to 5V and is suitable for automotive applications due to its small outline package and dual terminal position. The interface circuit supports up to 4 channels and features nickel palladium gold terminal finish.
MAX31911AUI+
Digital I/P Module; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: HTSSOP; Package Shape: RECTANGULAR;
ISO6721FBQDRQ1
ISO6721FBQDRQ1 by Texas Instruments is a dual-function interface IC with 2 channels. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 1.71V to 5.5V, it features a small outline package style and CMOS technology for robust performance in harsh environments.
ISO7841DWWR
ISO7841DWWR by Texas Instruments is a digital isolator with 4 channels, CMOS technology, and MILITARY temperature grade. It operates b/w -55 to 125 °C and has a supply voltage range of 2.25-5.5 V. Ideal for applications requiring high reliability in harsh environments.
MAX258ATA+T
Other Interface ICs; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: SON; Package Shape: RECTANGULAR;
PCA9548ADBR
PCA9548ADBR by Texas Instruments is an 8-channel interface IC with a supply voltage range of 2.3V to 5.5V. It operates in industrial temperature range (-40°C to 85°C) and has a small outline package style for surface mount applications. The terminal finish is Nickel/Palladium/Gold, making it suitable for various function interface circuits.
ADUM1411ARWZ
ADUM1411ARWZ by Analog Devices is a 16-terminal interface IC with CMOS technology. It operates b/w -40 to 105°C, with supply voltage range of 2.7-5.5V. Ideal for industrial applications requiring small outline package and dual terminal position.
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TLE82632EXUMA2
Infineon Technologies
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH;
TLE82622EXUMA2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G36;
TLE8261E
TLE8263-2E
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
TLE8262EXT
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR; Nominal Supply Voltage: 13.5 V;
TLE8262-2E
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Nominal Supply Voltage: 13.5 V;
TLE82612EXT
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR; Width: 7.6 mm;
TLE8262E
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
TLE8261EXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
TLE8262EXUMA3
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
TLE8262EXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
TLE8261EXUMA3
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
TLE82632EXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
TLE82612EXUMA2
TLE82622EXUMA1
TLE8261-2E
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Terminal Pitch: .65 mm;
TLE82612EXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): NOT SPECIFIED;
TLE8261EXUMA2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR; Width: 7.6 mm;
TLE8262EXUMA2
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