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TLE8110EEXUMA2

Infineon Technologies

TLE8110EEXUMA2 by Infineon Technologies

TLE8110EEXUMA2 by Infineon is a peripheral driver with 36 terminals, built-in protections for transient, over current, and over voltage. It operates at supply voltages b/w 3-5.5V and has a turn-on/off time of 10us. Ideal for applications requiring a buffer or inverter based peripheral driver with sink output current flow direction.

Median Price

$7.010

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 970 parts In-Stock

1+ parts

$9.850

100+ parts

$6.300

1k+ parts

$4.940

10k+ parts

-

970

$9.850

$6.300

$4.940

-

Rochester

USA . 24 parts In-Stock

1+ parts

-

100+ parts

$4.170

1k+ parts

$3.730

10k+ parts

$3.510

24

-

$4.170

$3.730

$3.510

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 34 parts In-Stock

1+ parts

$5.120

100+ parts

-

1k+ parts

-

10k+ parts

-

34

$5.120

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$5.528

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$5.528

-

-

-

ComSIT Distribution GmbH

Germany . 19,730 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,730

-

-

-

-

Chip Stock

USA . 9,660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,660

-

-

-

-

Vyrian

USA . 6,083 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,083

-

-

-

-

Sensible Micro Corp

USA . 1,359 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,359

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 326 parts In-Stock

1+ parts

$4.580

100+ parts

-

1k+ parts

-

10k+ parts

-

326

$4.580

-

-

-

Corphita

USA . 668 parts In-Stock

1+ parts

$4.851

100+ parts

-

1k+ parts

-

10k+ parts

-

668

$4.851

-

-

-

Continental Prestige Electronics

USA . 4,950 parts In-Stock

1+ parts

$5.290

100+ parts

-

1k+ parts

-

10k+ parts

$5.184

4,950

$5.290

-

-

$5.184

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$5.528

100+ parts

-

1k+ parts

$5.252

10k+ parts

$5.141

2,000

$5.528

-

$5.252

$5.141

Modulus Dynamics

Lithuania . 3,039 parts In-Stock

1+ parts

$6.754

100+ parts

$6.484

1k+ parts

$6.214

10k+ parts

-

3,039

$6.754

$6.484

$6.214

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QUARKTWIN TECHNOLOGY LTD

USA . 8,438 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,438

-

-

-

-

Microchip USA

USA . 3,460 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,460

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Argo Parts USA

USA . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2

-

-

-

-

Overview

Discover the TLE8110EEXUMA2 by Infineon Technologies, a top-tier manufacturer known for its superior quality and innovative solutions in the Peripheral Drivers category. This versatile product offers built-in protections against various electrical faults, ensuring reliable performance in diverse applications. With a wide voltage range and quick response time, this small yet powerful device delivers exceptional value and benefits to customers seeking efficient and durable solutions for their electronic systems. Experience the advantage of Infineon's expertise with the TLE8110EEXUMA2 - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to external elements, ensuring a longer lifespan for the product.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety of the connected devices by preventing damage from various electrical faults or fluctuations.

Nominal Output Peak Current Limit: 1.7 A

With a high nominal output peak current limit of 1.7 A, this peripheral driver can efficiently handle current demands of connected peripherals.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type of buffer or inverter based peripheral driver allows for seamless communication between the driver and the connected peripherals.

Technical Specifications

Peripheral Drivers TLE8110EEXUMA2 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Additional Features:

ALSO OPERATES VDD: FROM 4.5 TO 5.5V

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

1.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

2.55 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Turn-off Time:

10 us

Turn-on Time:

10 us

Width:

7.6 mm

Trade Compliance

TLE8110EEXUMA2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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