Loading...

TLE8102SGAUMA1

Infineon Technologies

TLE8102SGAUMA1 by Infineon Technologies

TLE8102SGAUMA1 by Infineon Technologies is a peripheral driver with 2 functions, operating at 4.5-5.5V, suitable for automotive applications. It offers built-in transient and thermal protections, with a max output peak current limit of 6.5A and turn-on/off time of 50us, in a small outline package measuring 7.5mm x 6.4mm x 2.6mm.

Median Price

$3.610

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 798 parts In-Stock

1+ parts

$4.900

100+ parts

$3.100

1k+ parts

$2.630

10k+ parts

-

798

$4.900

$3.100

$2.630

-

Rochester

USA . 11 parts In-Stock

1+ parts

-

100+ parts

$2.320

1k+ parts

$2.070

10k+ parts

$1.950

11

-

$2.320

$2.070

$1.950

Avnet

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$1.718

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$1.718

-

-

-

Digiode

USA . 245 parts In-Stock

1+ parts

$2.460

100+ parts

-

1k+ parts

-

10k+ parts

-

245

$2.460

-

-

-

Vyrian

USA . 4,130 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,130

-

-

-

-

Bristol Electronics

USA . 547 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

547

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$1.684

100+ parts

-

1k+ parts

$1.616

10k+ parts

-

1,000

$1.684

-

$1.616

-

Ampacity Inc.

Singapore . 11 parts In-Stock

1+ parts

$2.200

100+ parts

-

1k+ parts

-

10k+ parts

-

11

$2.200

-

-

-

Corphita

USA . 988 parts In-Stock

1+ parts

$2.331

100+ parts

-

1k+ parts

-

10k+ parts

-

988

$2.331

-

-

-

Modulus Dynamics

Lithuania . 3,110 parts In-Stock

1+ parts

$4.305

100+ parts

$4.133

1k+ parts

$3.961

10k+ parts

-

3,110

$4.305

$4.133

$3.961

-

AZTECH Wire

Italy . 846 parts In-Stock

1+ parts

$5.612

100+ parts

-

1k+ parts

-

10k+ parts

-

846

$5.612

-

-

-

Component Stockers USA

USA . 366 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

366

$99.990

-

-

-

RC Electronics

USA . 39,510 parts In-Stock

1+ parts

-

100+ parts

$1.750

1k+ parts

$1.600

10k+ parts

$1.550

39,510

-

$1.750

$1.600

$1.550

A-Z Elektronik GmbH

Germany . 4,877 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,877

-

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Microchip USA

USA . 497 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

497

-

-

-

-

Perfect Parts

USA . 112 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

112

-

-

-

-

Overview

Unleash the power of Infineon Technologies with the TLE8102SGAUMA1, a cutting-edge peripheral driver that offers unrivaled quality and performance. With built-in transient and thermal protections, this product ensures reliable operation in automotive applications. Its compact design and dual terminal position make it versatile for various projects. Invest in the TLE8102SGAUMA1 for seamless integration and optimal functionality, delivering exceptional value and benefits to customers looking for top-tier solutions. Elevate your projects with Infineon Technologies today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight construction, making it ideal for various applications.

Surface Mount: YES

With surface mount capability, this peripheral driver offers easy installation and space-saving benefits in circuit designs.

Maximum Supply Voltage: 5.5 V

Operating at a maximum supply voltage of 5.5V, this peripheral driver is suitable for a wide range of electronic devices.

No. of Functions: 2

Featuring two functions in one device, this peripheral driver offers versatility and efficiency in circuit design.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact form factor, allowing for easy integration into electronic systems.

Built-in Protections: TRANSIENT; THERMAL

With built-in transient and thermal protections, this peripheral driver ensures reliability and safety during operation.

No. of Terminals: 12

Equipped with 12 terminals, this peripheral driver offers multiple connection points for enhanced circuit flexibility.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The small outline, heat sink/slug, and shrink pitch package style provides efficient heat dissipation and space-saving design.

Minimum Supply Voltage: 4.5 V

Operating at a minimum supply voltage of 4.5V, this peripheral driver ensures reliable performance even under low voltage conditions.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this peripheral driver can withstand high heat environments without compromising functionality.

Minimum Operating Temperature: -40 °C

Operating reliably at temperatures as low as -40°C, this peripheral driver is suitable for use in various environmental conditions.

Terminal Finish: TIN

The use of tin terminal finish provides corrosion resistance and improved solderability, enhancing the longevity of the peripheral driver.

Terminal Position: DUAL

Featuring dual terminal positions, this peripheral driver offers versatile mounting options for different circuit configurations.

Technical Specifications

Peripheral Drivers TLE8102SGAUMA1 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; THERMAL

JESD-30 Code:

R-PDSO-G12

JESD-609 Code:

e3

Length:

7.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

12

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

6.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

2.6 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Turn-off Time:

50 us

Turn-on Time:

50 us

Width:

6.4 mm

Trade Compliance

TLE8102SGAUMA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19