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TC332LP32F300FAAKXUMA1

Infineon Technologies

TC332LP32F300FAAKXUMA1 by Infineon Technologies

Infineon's TC332LP32F300FAAKXUMA1 is a 32-bit microcontroller with 80 terminals, operating at up to 160 MHz clock frequency. Ideal for automotive applications, it features ADC and DMA channels, Flash ROM programmability, and operates in a temperature range of -40 to 125°C.

Median Price

$23.010

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 3,575 parts In-Stock

1+ parts

$23.010

100+ parts

$14.550

1k+ parts

-

10k+ parts

-

3,575

$23.010

$14.550

-

-

Newark

USA . 3,527 parts In-Stock

1+ parts

$25.370

100+ parts

$17.770

1k+ parts

$16.720

10k+ parts

-

3,527

$25.370

$17.770

$16.720

-

Element14

Singapore . 3,595 parts In-Stock

1+ parts

$7,232.700

100+ parts

$6,360.460

1k+ parts

-

10k+ parts

-

3,595

$7,232.700

$6,360.460

-

-

Rochester

USA . 5,400 parts In-Stock

1+ parts

-

100+ parts

$14.810

1k+ parts

$13.250

10k+ parts

$12.470

5,400

-

$14.810

$13.250

$12.470

Verical

USA . 5,400 parts In-Stock

1+ parts

-

100+ parts

$18.512

1k+ parts

$16.563

10k+ parts

$15.588

5,400

-

$18.512

$16.563

$15.588

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 632 parts In-Stock

1+ parts

$52.222

100+ parts

-

1k+ parts

-

10k+ parts

-

632

$52.222

-

-

-

Nova Conductors

Japan . 16 parts In-Stock

1+ parts

$97.020

100+ parts

-

1k+ parts

-

10k+ parts

-

16

$97.020

-

-

-

Vyrian

USA . 3,734 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,734

-

-

-

-

NAC Semi

USA . 3,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$25.190

3,600

-

-

-

$25.190

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,941 parts In-Stock

1+ parts

$46.720

100+ parts

-

1k+ parts

-

10k+ parts

-

3,941

$46.720

-

-

-

Semicontronic

India . 3,864 parts In-Stock

1+ parts

$46.720

100+ parts

$45.552

1k+ parts

$45.318

10k+ parts

-

3,864

$46.720

$45.552

$45.318

-

Corphita

USA . 877 parts In-Stock

1+ parts

$49.473

100+ parts

-

1k+ parts

-

10k+ parts

-

877

$49.473

-

-

-

Aztec Data Supply Inc.

USA . 2,640 parts In-Stock

1+ parts

$53.760

100+ parts

-

1k+ parts

-

10k+ parts

-

2,640

$53.760

-

-

-

Corohmni

South Africa . 814 parts In-Stock

1+ parts

$74.588

100+ parts

-

1k+ parts

-

10k+ parts

-

814

$74.588

-

-

-

Modulus Dynamics

Lithuania . 37 parts In-Stock

1+ parts

$84.754

100+ parts

$81.364

1k+ parts

$77.974

10k+ parts

-

37

$84.754

$81.364

$77.974

-

Microchip USA

USA . 1,683 parts In-Stock

1+ parts

$178.517

100+ parts

-

1k+ parts

-

10k+ parts

-

1,683

$178.517

-

-

-

iodParts Technologies Inc.

India . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Continental Prestige Electronics

USA . 3,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,600

-

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$95.080

1k+ parts

$92.169

10k+ parts

$90.229

2,000

-

$95.080

$92.169

$90.229

Argo Parts USA

USA . 674 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

674

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the TC332LP32F300FAAKXUMA1 by Infineon Technologies. This high-quality microcontroller offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. From automotive to industrial, this versatile device delivers exceptional value and benefits to customers. Trust in Infineon's expertise and innovation to take your projects to the next level with the TC332LP32F300FAAKXUMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan and reliability.

Surface Mount: YES

Allows for easy integration onto printed circuit boards, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 3.63 V

Provides flexibility in power supply options while staying within safe operating limits.

Package Shape: SQUARE

Optimizes space utilization on PCBs and allows for efficient layout designs.

Bit Size: 32

Provides sufficient processing power and capability for a wide range of applications.

No. of Terminals: 80

Offers ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Provides versatility in mounting and cooling options to suit different application requirements.

Minimum Supply Voltage: 2.97 V

Allows for operation in low power scenarios while maintaining stable performance.

Maximum Operating Temperature: 125 °C

Ensures reliable operation even in high-temperature environments such as automotive applications.

Minimum Operating Temperature: -40 °C

Designed to withstand extreme cold temperatures, making it suitable for a variety of operating environments.

Terminal Finish: NICKEL GOLD PALLADIUM SILVER

Provides corrosion resistance and excellent electrical conductivity for reliable connections.

ADC Channels: YES

Enables analog-to-digital conversion for interfacing with sensors and other analog devices.

DMA Channels: YES

Facilitates efficient data transfer and processing, improving overall system performance.

Terminal Position: QUAD

Offers a compact and standardized footprint for easy integration into various PCB layouts.

Maximum Seated Height: 1.2 mm

Allows for low-profile designs, ideal for space-constrained applications.

Width: 10 mm

Compact size facilitates easy integration into small form factor devices.

Maximum Clock Frequency: 160 MHz

Provides high-speed processing capability for demanding real-time applications.

Length: 10 mm

Compact size ensures space-efficient placement on PCBs.

Temperature Grade: AUTOMOTIVE

Certified for automotive applications, ensuring reliability in challenging operating conditions.

Peripheral IC Type: MICROCONTROLLER

Tailored for embedded control applications, offering versatile functionality and processing capabilities.

Technology: CMOS

Low power consumption and high noise immunity, suitable for battery-operated and noise-sensitive applications.

Terminal Form: GULL WING

Facilitates easy soldering and robust mechanical connections for reliable operation.

Nominal Supply Voltage: 3.3 V

Standard voltage level for compatibility with a wide range of power sources and peripherals.

PWM Channels: YES

Enables pulse-width modulation for precise control of motor speeds and analog output signals.

ROM Programmability: FLASH

Allows for easy reprogramming of firmware, essential for iterative development and updates.

Terminal Pitch: 0.4 mm

Fine pitch spacing enables high-density PCB designs, saving space and reducing signal interference.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes and offers moderate resistance to moisture-induced damage.

Speed: 300 rpm

Provides rapid data processing and response times for real-time control applications.

On Chip Program ROM Width: 8

Sufficient memory capacity for storing program instructions and data, supporting complex applications.

Technical Specifications

Microcontrollers TC332LP32F300FAAKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

ALSO AVAILABLE WITH 5 V NOMINAL

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

160 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

300 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TC332LP32F300FAAKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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