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TC333LP32F300FAAKXUMA1

Infineon Technologies

TC333LP32F300FAAKXUMA1 by Infineon Technologies

Infineon's TC333LP32F300FAAKXUMA1 microcontroller features 32-bit size, 160 MHz clock frequency, and automotive-grade temperature range. Ideal for applications requiring ADC and DMA channels, with ROM programmability and PWM support. Package style is flatpack with low profile, suitable for space-constrained designs in automotive electronics.

Median Price

$25.570

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,482 parts In-Stock

1+ parts

$25.570

100+ parts

$17.942

1k+ parts

$16.568

10k+ parts

-

1,482

$25.570

$17.942

$16.568

-

EBV Elektronik

Germany . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 503 parts In-Stock

1+ parts

$28.718

100+ parts

-

1k+ parts

-

10k+ parts

-

503

$28.718

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$90.480

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$90.480

-

-

-

Vyrian

USA . 7,933 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,933

-

-

-

-

TME

Poland . 6,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$21.370

10k+ parts

-

6,800

-

-

$21.370

-

NAC Semi

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$38.960

10k+ parts

$35.070

5,000

-

-

$38.960

$35.070

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 145 parts In-Stock

1+ parts

$22.393

100+ parts

-

1k+ parts

-

10k+ parts

-

145

$22.393

-

-

-

Ampacity Inc.

Singapore . 3,738 parts In-Stock

1+ parts

$25.700

100+ parts

-

1k+ parts

-

10k+ parts

-

3,738

$25.700

-

-

-

Corphita

USA . 456 parts In-Stock

1+ parts

$27.207

100+ parts

-

1k+ parts

-

10k+ parts

-

456

$27.207

-

-

-

Aztec Data Supply Inc.

USA . 3,977 parts In-Stock

1+ parts

$56.220

100+ parts

-

1k+ parts

-

10k+ parts

-

3,977

$56.220

-

-

-

Modulus Dynamics

Lithuania . 1,666 parts In-Stock

1+ parts

$82.678

100+ parts

$79.371

1k+ parts

$76.064

10k+ parts

-

1,666

$82.678

$79.371

$76.064

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$88.670

100+ parts

-

1k+ parts

$85.124

10k+ parts

-

2,000

$88.670

-

$85.124

-

Continental Prestige Electronics

USA . 1,925 parts In-Stock

1+ parts

$90.480

100+ parts

-

1k+ parts

-

10k+ parts

$88.670

1,925

$90.480

-

-

$88.670

Microchip USA

USA . 1,954 parts In-Stock

1+ parts

$186.631

100+ parts

-

1k+ parts

-

10k+ parts

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1,954

$186.631

-

-

-

Argo Parts USA

USA . 2,802 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,802

-

-

-

-

Robosynatics

Brazil . 1,713 parts In-Stock

1+ parts

-

100+ parts

$75.675

1k+ parts

$74.130

10k+ parts

$74.130

1,713

-

$75.675

$74.130

$74.130

Lucentia Tech

USA . 1,713 parts In-Stock

1+ parts

-

100+ parts

$75.675

1k+ parts

$74.130

10k+ parts

$74.130

1,713

-

$75.675

$74.130

$74.130

Overview

Infineon Technologies presents the TC333LP32F300FAAKXUMA1 microcontroller, a high-quality and reliable solution for various applications. With Infineon's reputation for excellence in manufacturing, this microcontroller offers unmatched performance and efficiency. Ideal for automotive use, this product provides customers with advanced features such as ADC and DMA channels, PWM capabilities, and ROM programmability. Experience seamless operation and superior functionality with the TC333LP32F300FAAKXUMA1, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body, ensuring the product is robust and easy to handle.

Surface Mount: YES

Ease of mounting on circuit boards, making it convenient for assembly and installation.

Maximum Supply Voltage: 3.63 V

Provides a high supply voltage capability, allowing for a wide range of applications.

Package Shape: SQUARE

Compact and space-efficient design, ideal for constrained electronic devices.

Bit Size: 32

High bit size for efficient processing and handling of complex computations.

No. of Terminals: 100

Sufficient number of terminals for connecting various external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch design offer compatibility with modern circuit board layouts and space-saving benefits.

Minimum Supply Voltage: 2.97 V

Low minimum supply voltage requirement for energy efficiency and compatibility with different power sources.

Maximum Operating Temperature: 125 °C

Wide operating temperature range suitable for various environments and applications.

Minimum Operating Temperature: -40 °C

Extended minimum operating temperature range for reliable performance in extreme conditions.

Terminal Finish: NICKEL GOLD PALLADIUM SILVER

High-quality terminal finish for excellent conductivity and durability, ensuring long-term reliability.

ADC Channels: YES

Built-in ADC channels for analog signal processing and conversion, enhancing the versatility of the microcontroller.

DMA Channels: YES

Support for Direct Memory Access (DMA) channels for efficient data transfer and processing.

Terminal Position: QUAD

Quad terminal position for easy connectivity and reduced signal interference.

Maximum Seated Height: 1.6 mm

Low seated height for space-saving installation and compatibility with compact designs.

Width: 14 mm

Compact width for fitting into tight spaces and small form factor devices.

Maximum Clock Frequency: 160 MHz

High maximum clock frequency for fast processing and responsive performance.

Length: 14 mm

Short length for efficient placement on circuit boards and reduced footprint.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance for reliable operation in automotive applications.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller, offering dedicated processing and control capabilities.

Technology: CMOS

CMOS technology for low power consumption and efficient operation.

Terminal Form: GULL WING

Gull wing terminal form for secure soldering and reliable electrical connections.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance and compatibility with standard power sources.

PWM Channels: YES

Support for Pulse Width Modulation (PWM) channels for precise control and modulation of signals.

ROM Programmability: FLASH

Flash ROM programmability for flexible and updatable firmware storage.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact layout and high-density integration.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 for enhanced protection against moisture and environmental factors.

Speed: 300 rpm

High speed capability for efficient processing of data and instructions.

On Chip Program ROM Width: 8

On-chip program ROM width of 8 for storing and executing instructions efficiently.

Technical Specifications

Microcontrollers TC333LP32F300FAAKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

ALSO AVAILABLE WITH 5 V NOMINAL

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

160 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

300 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TC333LP32F300FAAKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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