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TC333LP32F200FAALXUMA1

Infineon Technologies

TC333LP32F200FAALXUMA1 by Infineon Technologies

Infineon's TC333LP32F200FAALXUMA1 is a 32-bit microcontroller with 160 MHz clock frequency, ADC and DMA channels. Ideal for applications requiring low profile design, it operates at 3.3V with flash ROM programmability and PWM channels for versatile usage in various electronic systems.

Median Price

$15.592

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 4,950 parts In-Stock

1+ parts

-

100+ parts

$17.325

1k+ parts

$15.500

10k+ parts

$14.588

4,950

-

$17.325

$15.500

$14.588

Rochester

USA . 4,950 parts In-Stock

1+ parts

-

100+ parts

$13.860

1k+ parts

$12.400

10k+ parts

$11.670

4,950

-

$13.860

$12.400

$11.670

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$21.733

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$21.733

-

-

-

Vyrian

USA . 3,836 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,836

-

-

-

-

NAC Semi

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$26.770

10k+ parts

-

1,000

-

-

$26.770

-

TME

Poland . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.110

10k+ parts

-

1,000

-

-

$5.110

-

Digiode

USA . 69 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

69

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 660 parts In-Stock

1+ parts

$20.440

100+ parts

-

1k+ parts

-

10k+ parts

-

660

$20.440

-

-

-

Bastille Electronics

Australia . 750 parts In-Stock

1+ parts

$21.730

100+ parts

$20.644

1k+ parts

-

10k+ parts

$19.340

750

$21.730

$20.644

-

$19.340

Ampacity Inc.

Singapore . 4,585 parts In-Stock

1+ parts

$29.000

100+ parts

-

1k+ parts

-

10k+ parts

-

4,585

$29.000

-

-

-

Microchip USA

USA . 2,336 parts In-Stock

1+ parts

$50.115

100+ parts

-

1k+ parts

-

10k+ parts

-

2,336

$50.115

-

-

-

Modulus Dynamics

Lithuania . 4,183 parts In-Stock

1+ parts

$51.303

100+ parts

$49.251

1k+ parts

$47.199

10k+ parts

-

4,183

$51.303

$49.251

$47.199

-

Component Stockers USA

USA . 203 parts In-Stock

1+ parts

$217.420

100+ parts

-

1k+ parts

-

10k+ parts

-

203

$217.420

-

-

-

Glotronic Ltd.

UK . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

800

-

-

-

-

Corphita

USA . 550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

550

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the TC333LP32F200FAALXUMA1 microcontroller by Infineon Technologies. Designed with precision and reliability in mind, this versatile device offers unmatched performance for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers exceptional speed, efficiency, and flexibility. Experience seamless integration and superior functionality with this innovative product that is sure to exceed your expectations. Elevate your projects to new heights with the TC333LP32F200FAALXUMA1 from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and compact PCB assembly, saving space in the design.

Maximum Supply Voltage: 3.63 V

High maximum supply voltage allows for flexibility in power supply options.

Package Shape: SQUARE

Square package shape facilitates easier integration into the PCB layout.

Bit Size: 32

32-bit architecture enables powerful processing capabilities and efficient operation.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for external peripherals and interfaces.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact form factor, making it suitable for space-constrained designs.

Minimum Supply Voltage: 2.97 V

Low minimum supply voltage helps in optimizing power consumption and extending battery life.

Terminal Finish: NICKEL GOLD PALLADIUM SILVER

Terminal finish with multiple metals ensures good electrical contact and resistance to corrosion.

ADC Channels: YES

Built-in Analog-to-Digital Converter (ADC) channels enable the microcontroller to interface with analog sensors.

DMA Channels: YES

Direct Memory Access (DMA) channels enhance data transfer efficiency and reduce CPU overhead.

Terminal Position: QUAD

Quad terminal position provides improved mechanical stability for reliable connections.

Maximum Seated Height: 1.6 mm

Low maximum seated height helps in achieving a slim profile for the overall product design.

Width: 14 mm

Compact width dimension contributes to a space-saving layout on the PCB.

Maximum Clock Frequency: 160 MHz

High maximum clock frequency supports fast processing speeds and responsive performance.

Length: 14 mm

With a small length dimension, the microcontroller can fit snugly in tight spaces.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product includes integrated peripherals for versatile functionality.

Technology: CMOS

CMOS technology offers a balance between power efficiency and high performance.

Terminal Form: GULL WING

Gull wing terminal form simplifies the soldering process during assembly.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and reliable operation.

PWM Channels: YES

Pulse Width Modulation (PWM) channels support precise control of analog outputs.

ROM Programmability: FLASH

Flash ROM programmability enables easy firmware updates and modifications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the PCB and saves board space.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product has moderate moisture sensitivity, suitable for typical environments.

Speed: 200 rpm

Speed of 200 rpm ensures efficient data processing and system responsiveness.

On Chip Program ROM Width: 8

Having an on-chip program ROM width of 8 bits allows for storing and executing program instructions efficiently.

Technical Specifications

Microcontrollers TC333LP32F200FAALXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

ALSO AVAILABLE WITH 5 V NOMINAL

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

160 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

On Chip Program ROM Width:

8

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TC333LP32F200FAALXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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