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TC334LP32F200FAAKXUMA1

Infineon Technologies

TC334LP32F200FAAKXUMA1 by Infineon Technologies

Infineon's TC334LP32F200FAAKXUMA1 is a 32-bit microcontroller with 144 terminals, operating at up to 160 MHz. Ideal for automotive applications, it features ADC and DMA channels, flash ROM programmability, and operates in temperatures ranging from -40 to 125°C.

Median Price

$14.919

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 787 parts In-Stock

1+ parts

$15.110

100+ parts

$14.800

1k+ parts

$14.590

10k+ parts

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787

$15.110

$14.800

$14.590

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DigiKey

USA . 722 parts In-Stock

1+ parts

$22.430

100+ parts

$15.623

1k+ parts

$14.398

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722

$22.430

$15.623

$14.398

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Verical

USA . 60,000 parts In-Stock

1+ parts

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$14.728

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60,000

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$14.728

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Rochester

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$13.380

1k+ parts

$11.970

10k+ parts

$11.260

4,000

-

$13.380

$11.970

$11.260

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 330 parts In-Stock

1+ parts

$18.468

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330

$18.468

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Maritex

Poland . 2,000 parts In-Stock

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$33.071

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2,000

$33.071

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TME

Poland . 60,000 parts In-Stock

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$5.040

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60,000

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-

$5.040

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Vyrian

USA . 3,444 parts In-Stock

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3,444

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Corphita

USA . 93 parts In-Stock

1+ parts

$17.496

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93

$17.496

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Microchip USA

USA . 1,235 parts In-Stock

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$48.349

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1,235

$48.349

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Corohmni

South Africa . 567 parts In-Stock

1+ parts

$68.429

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567

$68.429

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Modulus Dynamics

Lithuania . 4,309 parts In-Stock

1+ parts

$69.955

100+ parts

$67.157

1k+ parts

$64.359

10k+ parts

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4,309

$69.955

$67.157

$64.359

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QUARKTWIN TECHNOLOGY LTD

USA . 27,261 parts In-Stock

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Argo Parts USA

USA . 5,203 parts In-Stock

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Continental Prestige Electronics

USA . 1,698 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TC334LP32F200FAAKXUMA1 microcontroller by Infineon Technologies. Designed with precision and reliability in mind, this automotive-grade device offers unparalleled performance and versatility for a wide range of applications. From ADC channels to PWM channels, this microcontroller is equipped with all the features you need to bring your projects to life efficiently. Experience seamless integration and superior functionality with the TC334LP32F200FAAKXUMA1, setting new standards in the world of microcontrollers. Elevate your projects and exceed expectations with this exceptional product from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.63 V

High maximum supply voltage provides flexibility in power requirements and compatibility with a variety of systems.

Package Shape: SQUARE

Square package shape facilitates compact design and efficient use of space on the circuit board.

Bit Size: 32

32-bit architecture offers high performance and processing power for complex applications.

No. of Terminals: 144

Large number of terminals allow for multiple connections and interfaces, enabling versatile functionality.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Multiple package styles provide options catering to different design requirements and thermal considerations.

Minimum Supply Voltage: 2.97 V

Low minimum supply voltage ensures efficient power usage and compatibility with low-power applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range allows for reliable performance in harsh environments or under heavy load.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables use in extreme conditions, making it suitable for various industrial applications.

Terminal Finish: NICKEL GOLD PALLADIUM SILVER

Terminal finish options provide corrosion resistance and reliable electrical connections for long-term performance.

ADC Channels: YES

Built-in ADC channels enable analog-to-digital conversion, allowing the microcontroller to interface with analog sensors and signals.

DMA Channels: YES

DMA channels support direct memory access, improving data transfer efficiency and reducing CPU load for enhanced performance.

Terminal Position: QUAD

Quad terminal position offers stable and secure connections, enhancing reliability and signal integrity.

Maximum Seated Height: 1.2 mm

Low seated height allows for slim and compact design, ideal for space-constrained applications or designs with height restrictions.

Width: 16 mm

Compact width dimension enables space-saving integration and efficient layout on the circuit board.

Maximum Clock Frequency: 160 MHz

High clock frequency capability provides fast processing speed and responsiveness for demanding applications.

Length: 16 mm

Balanced length dimension complements the width for a square package shape, ensuring optimal use of board space.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures reliable operation in automotive applications where temperature variations are common.

Peripheral IC Type: MICROCONTROLLER

Specifically designed as a microcontroller, offering dedicated processing capabilities for embedded control and computing tasks.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing energy efficiency and signal integrity.

Terminal Form: GULL WING

Gull wing terminal form offers secure mechanical support and easy soldering for reliable connections and assembly.

Nominal Supply Voltage: 3.3 V

Stable and common nominal supply voltage simplifies power requirements and compatibility with standard power sources.

PWM Channels: YES

PWM channels support pulse-width modulation, enabling precise control of power output and motor speed for various applications.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible and reprogrammable memory storage, facilitating software updates and customization.

Terminal Pitch: 0.4 mm

Fine terminal pitch provides high-density connections and compact layout, suitable for miniaturized designs and advanced applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, ensuring safe handling and storage to prevent damage during assembly or reflow processes.

Speed: 200 rpm

High speed capability supports fast data processing and response times, essential for real-time control and communication applications.

On Chip Program ROM Width: 8

8-bit width for on-chip program ROM allows for efficient memory access and execution of program instructions, enhancing overall performance.

Technical Specifications

Microcontrollers TC334LP32F200FAAKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

ALSO AVAILABLE WITH 5 V NOMINAL

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

160 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

200 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TC334LP32F200FAAKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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