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SPP21N50C3HKSA1

Infineon Technologies

SPP21N50C3HKSA1 by Infineon Technologies

SPP21N50C3HKSA1 by Infineon is a N-CHANNEL FET with 500V DS breakdown voltage, ideal for switching applications. It features 63A max pulsed drain current and 0.19 ohm max drain-source resistance. This MOSFET operates in enhancement mode at up to 150°C, making it suitable for high-power applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,109 parts In-Stock

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Digiode

USA . 607 parts In-Stock

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607

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Modulus Dynamics

Lithuania . 19,312 parts In-Stock

1+ parts

$0.432

100+ parts

$0.415

1k+ parts

$0.397

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19,312

$0.432

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$0.397

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Corohmni

South Africa . 167 parts In-Stock

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$0.809

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$0.809

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Aztec Data Supply Inc.

USA . 3,177 parts In-Stock

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$1.470

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$1.470

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$2.272

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$2.068

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$1.863

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500

$2.272

$2.068

$1.863

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AZTECH Wire

Italy . 568 parts In-Stock

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$14.117

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568

$14.117

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Andel Nordic

Denmark . 5,932 parts In-Stock

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$25.650

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$17.957

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$17.957

5,932

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$17.957

Semicontronic

India . 1,166 parts In-Stock

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$30.050

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$29.299

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$29.148

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Ampacity Inc.

Singapore . 1,175 parts In-Stock

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$65.050

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Continental Prestige Electronics

USA . 3,138 parts In-Stock

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Argo Parts USA

USA . 2,065 parts In-Stock

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Corphita

USA . 772 parts In-Stock

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Bastille Electronics

Australia . 51 parts In-Stock

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Perfect Parts

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Overview

Unleash the power of innovation with the SPP21N50C3HKSA1 by Infineon Technologies. Crafted with precision and expertise, this Power Field Effect Transistor (FET) is designed to revolutionize switching applications. With a single built-in diode and N-CHANNEL polarity, this transistor offers unrivaled performance and reliability. Experience enhanced efficiency and functionality with a minimum DS breakdown voltage of 500V and maximum drain current of 21A. Elevate your projects to new heights with the cutting-edge technology of the SPP21N50C3HKSA1 - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making it suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer higher electron mobility and lower resistance, making them efficient for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against reverse voltage, enhancing reliability in circuit design.

Transistor Application: SWITCHING

Designed for switching applications, offering fast switching speeds and low power consumption for efficient operation.

Minimum DS Breakdown Voltage: 500 V

With a high breakdown voltage, this FET can handle high voltage applications safely and reliably.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and installation in a variety of circuit layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections for stability and reliability in circuit applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy control and high efficiency in applications requiring variable signal control.

Maximum Pulsed Drain Current (IDM): 63 A

With a high pulsed drain current rating, this FET can handle short-term peak currents, improving overall performance.

Avalanche Energy Rating (EAS): 690 mJ

The high avalanche energy rating ensures reliable operation and protection against voltage spikes in demanding conditions.

No. of Terminals: 3

With three terminals, this FET offers flexibility in circuit design and connection options for various applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure mounting and heat dissipation in high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high speed and low power consumption, making this FET suitable for modern electronic designs.

Maximum Operating Temperature: 150 °C

With a high operating temperature rating, this FET can withstand high heat environments, ensuring reliability under harsh conditions.

Transistor Element Material: SILICON

Silicon material provides high performance and durability, making this FET a reliable choice for various applications.

Maximum Drain Current (ID): 21 A

With a high drain current rating, this FET can handle high current loads, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.19 ohm

The low on-resistance reduces power loss and heat generation, improving efficiency and performance.

Terminal Position: SINGLE

The single terminal position simplifies circuit design and installation, making it user-friendly for a variety of applications.

Technical Specifications

Power Field Effect Transistors (FET) SPP21N50C3HKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

690 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (ID):

21 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

63 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPP21N50C3HKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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