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SPP20N60C3XK

Infineon Technologies

SPP20N60C3XK by Infineon Technologies

SPP20N60C3XK by Infineon Technologies is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. It features a max IDM of 62.1A and 0.19 ohm RDS(ON). Ideal for SWITCHING applications, this transistor operates in ENHANCEMENT MODE with a built-in DIODE, making it suitable for high-power tasks.

Median Price

$1.094

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 26,426 parts In-Stock

1+ parts

$1.094

100+ parts

$1.029

1k+ parts

-

10k+ parts

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26,426

$1.094

$1.029

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 643 parts In-Stock

1+ parts

$1.825

100+ parts

-

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643

$1.825

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Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$2.999

100+ parts

-

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600

$2.999

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Vyrian

USA . 26,056 parts In-Stock

1+ parts

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26,056

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 1,838 parts In-Stock

1+ parts

$0.608

100+ parts

$0.584

1k+ parts

$0.559

10k+ parts

-

1,838

$0.608

$0.584

$0.559

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Aztec Data Supply Inc.

USA . 2,256 parts In-Stock

1+ parts

$0.710

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-

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2,256

$0.710

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$0.830

100+ parts

$0.789

1k+ parts

$0.789

10k+ parts

-

2,500

$0.830

$0.789

$0.789

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Corohmni

South Africa . 848 parts In-Stock

1+ parts

$0.901

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-

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848

$0.901

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Semicontronic

India . 26,333 parts In-Stock

1+ parts

$1.000

100+ parts

$0.975

1k+ parts

$0.970

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-

26,333

$1.000

$0.975

$0.970

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Ampacity Inc.

Singapore . 26,030 parts In-Stock

1+ parts

$1.630

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26,030

$1.630

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Corphita

USA . 357 parts In-Stock

1+ parts

$1.729

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357

$1.729

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Continental Prestige Electronics

USA . 4,796 parts In-Stock

1+ parts

$2.999

100+ parts

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$2.939

4,796

$2.999

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$2.939

Argo Parts USA

USA . 1,732 parts In-Stock

1+ parts

$2.999

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1,732

$2.999

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Overview

Unleash the power of innovation with the SPP20N60C3XK by Infineon Technologies. As a leading manufacturer in the field of Power FETs, Infineon delivers top-quality products that exceed industry standards. Ideal for switching applications, this N-CHANNEL transistor offers a breakthrough in performance and reliability. With a high DS breakdown voltage of 600V and a maximum drain current of 20.7A, this transistor ensures optimal efficiency and durability. Experience seamless operation and unmatched value with the SPP20N60C3XK – the ultimate choice for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the FET, ensuring reliable performance over time.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance characteristics compared to P-channel FETs, making them a preferred choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can provide additional protection against reverse voltage conditions, making the FET easier to use in various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low ON-resistance, making it suitable for efficient power management in electronic devices.

Minimum DS Breakdown Voltage: 600 V

With a high minimum breakdown voltage of 600V, this FET can handle high voltage applications with ease, ensuring reliability and safety in demanding environments.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into existing circuit designs, providing flexibility and convenience for installation and maintenance.

Terminal Form: THROUGH-HOLE

The through-hole terminal form makes it easy to solder and secure the FET to circuit boards, offering a reliable connection for consistent performance in various electronic devices.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer precise control over the switching operation, allowing for efficient power management and improved performance in a wide range of applications.

Maximum Pulsed Drain Current (IDM): 62.1 A

The high maximum pulsed drain current capacity of 62.1A ensures that the FET can handle sudden surges in power demand without overheating or failing, making it suitable for high-performance applications.

Avalanche Energy Rating (EAS): 690 mJ

With a high avalanche energy rating of 690mJ, this FET can withstand transient voltage spikes and operate reliably in harsh electrical environments, ensuring long-term durability and protection against damage.

No. of Terminals: 3

The three terminals provide easy connections for input, output, and control signals, making it versatile for a variety of circuit configurations and applications.

Package Style (Meter): FLANGE MOUNT

The flange mount style allows for secure and stable mounting of the FET, reducing the risk of mechanical failure or disconnection in high-vibration or high-temperature environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology used in this FET offers high efficiency, low power consumption, and fast switching speeds, making it ideal for modern electronic devices requiring efficient power management.

Transistor Element Material: SILICON

Silicon is a commonly used semiconductor material known for its reliability, stability, and high-performance characteristics, making it an excellent choice for the construction of durable and efficient FETs.

Maximum Drain Current (ID): 20.7 A

With a maximum drain current capacity of 20.7A, this FET can handle high power loads with efficiency and precision, making it suitable for a wide range of applications requiring reliable power management.

Maximum Drain-Source On Resistance: 0.19 ohm

The low maximum drain-source ON-resistance of 0.19 ohm minimizes power losses and heat generation in the FET, ensuring high efficiency and optimal performance in various circuit configurations.

Terminal Position: SINGLE

The single terminal position simplifies the connection of the FET to other components in the circuit, reducing wiring complexity and improving the overall reliability and efficiency of the electronic system.

Technical Specifications

Power Field Effect Transistors (FET) SPP20N60C3XK attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, HIGH RELIABILITY

Avalanche Energy Rating (EAS):

690 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

20.7 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

62.1 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPP20N60C3XK Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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