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S71KL512SC0BHV000

Infineon Technologies

S71KL512SC0BHV000 by Infineon Technologies

S71KL512SC0BHV000 by Infineon Technologies is a 64MX8 memory IC with CMOS technology. It operates synchronously at 3V, has a memory density of 536Mbit, and features a grid array package style. Ideal for industrial applications requiring high memory capacity in a compact form factor.

Median Price

$16.063

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 15 parts In-Stock

1+ parts

$16.770

100+ parts

$12.850

1k+ parts

-

10k+ parts

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15

$16.770

$12.850

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Flip Electronics (Authorized)

USA . 3,002 parts In-Stock

1+ parts

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3,002

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Rochester

USA . 549 parts In-Stock

1+ parts

-

100+ parts

$12.850

1k+ parts

$11.500

10k+ parts

$10.820

549

-

$12.850

$11.500

$10.820

Verical

USA . 549 parts In-Stock

1+ parts

-

100+ parts

$16.063

1k+ parts

$14.375

10k+ parts

$13.525

549

-

$16.063

$14.375

$13.525

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 28 parts In-Stock

1+ parts

$13.566

100+ parts

-

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28

$13.566

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Vyrian

USA . 986 parts In-Stock

1+ parts

$14.280

100+ parts

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986

$14.280

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Flip Electronics

USA . 11,492 parts In-Stock

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11,492

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Sunrise Surplus Inc.

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 479 parts In-Stock

1+ parts

$12.852

100+ parts

-

1k+ parts

-

10k+ parts

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479

$12.852

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Component Stockers USA

USA . 1,285 parts In-Stock

1+ parts

$14.810

100+ parts

$13.920

1k+ parts

-

10k+ parts

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1,285

$14.810

$13.920

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Modulus Dynamics

Lithuania . 4,065 parts In-Stock

1+ parts

$16.705

100+ parts

$16.037

1k+ parts

$15.369

10k+ parts

-

4,065

$16.705

$16.037

$15.369

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Microchip USA

USA . 2,260 parts In-Stock

1+ parts

$49.059

100+ parts

-

1k+ parts

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2,260

$49.059

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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2,000

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Overview

Unlock the power of seamless data storage and retrieval with the S71KL512SC0BHV000 by Infineon Technologies. Crafted with precision and expertise, this memory IC offers unparalleled reliability and efficiency for a wide range of applications. Whether you're in need of high-performance memory solutions for industrial automation or IoT devices, this cutting-edge technology delivers exceptional value and performance. Elevate your projects with the quality and innovation that only Infineon Technologies can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the memory IC, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during the assembly process.

Operating Mode: SYNCHRONOUS

Enables the memory IC to synchronize data transfers with the system clock, improving overall performance and efficiency.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard voltage level, making it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, making it suitable for industrial environments where heat generation is a concern.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation, making it a cost-effective and efficient choice.

Memory Density: 536870912 bit

Offers a high memory density, allowing for the storage of a large amount of data in a compact form factor.

Technical Specifications

Other Function Memory ICs S71KL512SC0BHV000 attributes and parameters. Explore more Other Function Memory ICs devices from Infineon Technologies

Specs

Additional Features:

HYPER RAM IS ORGANISED AS 8MX8

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

536870912 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

S71KL512SC0BHV000 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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