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S25FL064LABMFV010

Infineon Technologies

S25FL064LABMFV010 by Infineon Technologies

S25FL064LABMFV010 by Infineon Technologies is a 16MX4 flash memory with 108 MHz clock frequency, suitable for industrial applications. It operates at 3V with synchronous mode and has a memory density of 67108864 bits. The small outline package is square-shaped, surface mountable, and has dual terminals.

Median Price

$1.770

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 321 parts In-Stock

1+ parts

$1.110

100+ parts

$1.040

1k+ parts

$0.944

10k+ parts

-

321

$1.110

$1.040

$0.944

-

Chip1Stop

Japan . 1,381 parts In-Stock

1+ parts

$1.690

100+ parts

-

1k+ parts

-

10k+ parts

-

1,381

$1.690

-

-

-

Newark

USA . 1,286 parts In-Stock

1+ parts

$1.750

100+ parts

$1.530

1k+ parts

$1.440

10k+ parts

$1.030

1,286

$1.750

$1.530

$1.440

$1.030

Mouser Electronics

USA . 11,965 parts In-Stock

1+ parts

$1.790

100+ parts

$1.550

1k+ parts

$1.340

10k+ parts

$1.280

11,965

$1.790

$1.550

$1.340

$1.280

Arrow

USA . 200 parts In-Stock

1+ parts

$1.794

100+ parts

$1.507

1k+ parts

-

10k+ parts

-

200

$1.794

$1.507

-

-

Element14

Singapore . 607 parts In-Stock

1+ parts

$1.810

100+ parts

$1.060

1k+ parts

$1.050

10k+ parts

$1.050

607

$1.810

$1.060

$1.050

$1.050

Farnell

UK . 69 parts In-Stock

1+ parts

$2.404

100+ parts

$2.160

1k+ parts

$1.980

10k+ parts

-

69

$2.404

$2.160

$1.980

-

Flip Electronics (Authorized)

USA . 50,494 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50,494

-

-

-

-

Verical

USA . 6,900 parts In-Stock

1+ parts

-

100+ parts

$1.350

1k+ parts

$1.244

10k+ parts

$1.036

6,900

-

$1.350

$1.244

$1.036

DigiKey

USA . 2,988 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.070

2,988

-

-

-

$1.070

RS (Exports)

UK . 1 parts In-Stock

1+ parts

-

100+ parts

$2.901

1k+ parts

$2.451

10k+ parts

-

1

-

$2.901

$2.451

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 544 parts In-Stock

1+ parts

$1.054

100+ parts

-

1k+ parts

-

10k+ parts

-

544

$1.054

-

-

-

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$2.455

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$2.455

-

-

-

Flip Electronics

USA . 33,687 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

33,687

-

-

-

-

Vyrian

USA . 8,455 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,455

-

-

-

-

DigiKey Marketplace

USA . 7,401 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,401

-

-

-

-

Chip Stock

USA . 3,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,600

-

-

-

-

Semtec, LLC

USA . 3,475 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,475

-

-

-

-

ComSIT Distribution GmbH

Germany . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 7,773 parts In-Stock

1+ parts

$0.940

100+ parts

-

1k+ parts

-

10k+ parts

-

7,773

$0.940

-

-

-

Semicontronic

India . 7,773 parts In-Stock

1+ parts

$0.940

100+ parts

$0.916

1k+ parts

$0.912

10k+ parts

-

7,773

$0.940

$0.916

$0.912

-

Corphita

USA . 619 parts In-Stock

1+ parts

$0.999

100+ parts

-

1k+ parts

-

10k+ parts

-

619

$0.999

-

-

-

Corohmni

South Africa . 71 parts In-Stock

1+ parts

$2.249

100+ parts

-

1k+ parts

-

10k+ parts

-

71

$2.249

-

-

-

Argo Parts USA

USA . 2,679 parts In-Stock

1+ parts

$2.455

100+ parts

-

1k+ parts

-

10k+ parts

-

2,679

$2.455

-

-

-

Component Stockers USA

USA . 25,010 parts In-Stock

1+ parts

$2.820

100+ parts

$2.070

1k+ parts

$1.990

10k+ parts

$1.940

25,010

$2.820

$2.070

$1.990

$1.940

Continental Prestige Electronics

USA . 1,234 parts In-Stock

1+ parts

$3.030

100+ parts

$2.130

1k+ parts

$1.910

10k+ parts

-

1,234

$3.030

$2.130

$1.910

-

Modulus Dynamics

Lithuania . 5,374 parts In-Stock

1+ parts

$3.632

100+ parts

$3.487

1k+ parts

$3.341

10k+ parts

-

5,374

$3.632

$3.487

$3.341

-

Aztec Data Supply Inc.

USA . 517 parts In-Stock

1+ parts

$4.893

100+ parts

-

1k+ parts

-

10k+ parts

-

517

$4.893

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Futuretech Components

Singapore . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$2.406

1k+ parts

$2.332

10k+ parts

$2.283

500

-

$2.406

$2.332

$2.283

Overview

Unlock the power of reliable data storage with the S25FL064LABMFV010 by Infineon Technologies. As a leading manufacturer in flash memory technology, Infineon brings you a high-quality product that offers seamless integration and superior performance. Ideal for a wide range of applications, this flash memory device provides customers with value, efficiency, and peace of mind. Trust Infineon to deliver the best in class products that meet your needs and exceed your expectations. Elevate your projects with the S25FL064LABMFV010 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/epoxy material provides durability and protection to the memory chip, making it suitable for various environments and usage conditions.

Surface Mount: YES

Surface mount capability makes it easier to integrate the memory chip into circuit boards, saving space and simplifying the manufacturing process.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster and more efficient data transfer, improving overall performance of the memory chip.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard voltage level of 3V, ensuring compatibility with a wide range of devices and systems.

Maximum Operating Temperature: 105 °C

High maximum operating temperature allows the memory chip to function reliably in harsh or elevated temperature environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the memory chip can operate in cold or freezing conditions without any issues.

Maximum Clock Frequency (fCLK): 108 MHz

High clock frequency enables faster data access and processing speeds, making the memory chip suitable for demanding applications.

Memory Density: 67108864 bit

High memory density allows the chip to store a large amount of data in a compact form factor, making it ideal for storage-intensive tasks.

Technical Specifications

Flash Memory S25FL064LABMFV010 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Additional Features:

IT ALSO HAVE X1 MEMORY WIDTH

Alternate Memory Width:

2

Maximum Clock Frequency (fCLK):

108 MHz

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

5.28 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Programming Voltage (V):

3

Maximum Seated Height:

2.16 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.28 mm

Trade Compliance

S25FL064LABMFV010 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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