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PZT3904

Infineon Technologies

PZT3904 by Infineon Technologies

NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): 1.5 W; Maximum Collector Current (IC): .2 A;

Median Price

$0.099

Lifecycle Status

Suppliers In-Stock

30

In-Stock Inventory

1k+

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Adafruit Industries

USA . 40 parts In-Stock

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$0.099

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$0.099

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40

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Digiode

USA . 6,774 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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Mobius Materials

USA . 3,947 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Component Sense

UK . 2,954 parts In-Stock

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Electronic Expediters

USA . 2,931 parts In-Stock

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Bristol Electronics

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Contempo Components LLC

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Dan-Mar Components

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LIBRA Elektronik GmbH

Germany . 1,489 parts In-Stock

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QIE Inc.

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Euro-Tech

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PC Components Company LLC

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Inventory MP

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Sogenti Electronics

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Mil-Aero Solutions, Inc.

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Goldney Electronics S.L.

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Atlantic Semiconductor

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Sweden . 71 parts In-Stock

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Prism Electronics

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LittleDiode

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Semicontronic

India . 40 parts In-Stock

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40

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Corphita

USA . 5,823 parts In-Stock

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Corohmni

South Africa . 261 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Argo Parts USA

USA . 1,984 parts In-Stock

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Continental Prestige Electronics

USA . 1,827 parts In-Stock

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Advanced Electronics

New Zealand . 40 parts In-Stock

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Aztec Data Supply Inc.

USA . 331 parts In-Stock

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IDEA Electronic Components Group

UK . 220 parts In-Stock

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Modulus Dynamics

Lithuania . 21,419 parts In-Stock

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$1.188

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$1.139

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MKK Technologies

India . 700 parts In-Stock

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DigiPath Technology Company

USA . 700 parts In-Stock

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AZTECH Wire

Italy . 236 parts In-Stock

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Perfect Parts

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UK . 39,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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UNI Independent Distributors

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Latvia . 7,027 parts In-Stock

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GreenTree Electronics

Israel . 6,710 parts In-Stock

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Glotronic Ltd.

UK . 6,400 parts In-Stock

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SupplyDigital Components

Austria . 5,448 parts In-Stock

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Problanco Electronics

Mexico . 4,176 parts In-Stock

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Infinite Electronics LLP (Excess)

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Assy Fe

Spain . 1,153 parts In-Stock

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Kulean Microsystems

USA . 653 parts In-Stock

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UHIMA Technologies

Türkiye . 589 parts In-Stock

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Parana Technologies

USA . 19 parts In-Stock

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Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) PZT3904 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

40 V

Configuration:

Minimum DC Current Gain (hFE):

30

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Maximum Turn Off Time (toff):

250 ns

Maximum Turn On Time (ton):

70 ns

Trade Compliance

PZT3904 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-440-7474, 5961014407474

NIIN

014407474

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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