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IRLR7807ZPBF

Infineon Technologies

IRLR7807ZPBF by Infineon Technologies

IRLR7807ZPBF by Infineon is a N-CHANNEL FET with 30V DS breakdown voltage, ideal for switching applications. It features a max IDM of 170A and 0.0138 ohm RDS(on), suitable for high-power operations. With a small outline package style and matte tin finish, it operates at up to 175°C making it versatile in various electronic designs.

Median Price

$0.330

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,200 parts In-Stock

1+ parts

$0.330

100+ parts

$0.320

1k+ parts

$0.320

10k+ parts

-

1,200

$0.330

$0.320

$0.320

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Avnet

USA . 3,501 parts In-Stock

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3,501

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Distributors (In-Stock)

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Digiode

USA . 918 parts In-Stock

1+ parts

$0.314

100+ parts

-

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918

$0.314

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.486

100+ parts

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500

$0.486

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Vyrian

USA . 2,335 parts In-Stock

1+ parts

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2,335

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Electronic Expediters

USA . 1,200 parts In-Stock

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1,200

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Distributors (Availability)

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Argo Parts USA

USA . 2,331 parts In-Stock

1+ parts

$0.201

100+ parts

-

1k+ parts

-

10k+ parts

$0.195

2,331

$0.201

-

-

$0.195

Ampacity Inc.

Singapore . 2,473 parts In-Stock

1+ parts

$0.281

100+ parts

-

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2,473

$0.281

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Corphita

USA . 615 parts In-Stock

1+ parts

$0.297

100+ parts

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615

$0.297

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Aztec Data Supply Inc.

USA . 1,535 parts In-Stock

1+ parts

$0.446

100+ parts

-

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1,535

$0.446

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Bastille Electronics

Australia . 1,127 parts In-Stock

1+ parts

$0.486

100+ parts

$0.462

1k+ parts

$0.439

10k+ parts

$0.433

1,127

$0.486

$0.462

$0.439

$0.433

Semicontronic

India . 2,457 parts In-Stock

1+ parts

$0.610

100+ parts

$0.595

1k+ parts

$0.592

10k+ parts

-

2,457

$0.610

$0.595

$0.592

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Continental Prestige Electronics

USA . 545 parts In-Stock

1+ parts

$0.791

100+ parts

$0.451

1k+ parts

$0.316

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545

$0.791

$0.451

$0.316

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Allen Electronics Distributors

USA . 3,168 parts In-Stock

1+ parts

$0.820

100+ parts

$0.540

1k+ parts

$0.480

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3,168

$0.820

$0.540

$0.480

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Corohmni

South Africa . 19 parts In-Stock

1+ parts

$0.826

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19

$0.826

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Modulus Dynamics

Lithuania . 14,211 parts In-Stock

1+ parts

$1.824

100+ parts

$1.751

1k+ parts

$1.678

10k+ parts

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14,211

$1.824

$1.751

$1.678

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Perfect Parts

USA . 31,416 parts In-Stock

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31,416

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A-Z Elektronik GmbH

Germany . 6,477 parts In-Stock

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6,477

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Alle Elektronik GmbH

Germany . 4,318 parts In-Stock

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4,318

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Kepictronics

USA . 75 parts In-Stock

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75

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Overview

Experience the next level of power and efficiency with the IRLR7807ZPBF by Infineon Technologies. Crafted with precision and quality, this N-channel Power FET offers seamless switching capabilities for a variety of applications. With a built-in diode and high-performance features, this transistor delivers reliability and performance like no other. Upgrade your projects with the IRLR7807ZPBF and witness the difference in power management and control. Elevate your creations with the best from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel design allows for efficient current flow and switching capabilities.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode enhances the performance of the transistor in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Minimum DS Breakdown Voltage: 30 V

The minimum breakdown voltage of 30V provides safety margin and protection against voltage spikes.

Package Shape: RECTANGULAR

Rectangular shape helps in efficient packaging and space utilization in electronic devices.

Terminal Form: GULL WING

Gull wing terminals offer secure connection and easy soldering on PCBs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation ensures efficient switching and control of the transistor.

Maximum Pulsed Drain Current (IDM): 170 A

High maximum pulsed drain current allows for handling of heavy loads and transient currents.

Avalanche Energy Rating (EAS): 28 mJ

High avalanche energy rating provides protection against voltage spikes and improves reliability.

Maximum Drain Current (Abs) (ID): 43 A

High maximum drain current rating ensures stable performance under load conditions.

No. of Terminals: 2

Two terminals simplify the connection process and reduce complexity in circuit design.

Maximum Power Dissipation (Abs): 40 W

High power dissipation rating enables the transistor to handle high power levels without overheating.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and allows for compact design in electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability in various applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature ensures the transistor can withstand harsh environmental conditions.

Transistor Element Material: SILICON

Silicon material provides excellent electrical properties and reliability in electronic components.

Terminal Finish: MATTE TIN OVER NICKEL

Matte tin over nickel finish offers corrosion resistance and ensures long-term reliability of the terminals.

Maximum Drain Current (ID): 30 A

High maximum drain current rating allows for handling of heavy loads and continuous operation.

Maximum Drain-Source On Resistance: 0.0138 ohm

Low drain-source on resistance minimizes power loss and improves efficiency in the transistor.

Terminal Position: SINGLE

Single terminal position simplifies the installation process and ensures easy connectivity.

Case Connection: DRAIN

Drain case connection offers sturdy mounting and efficient heat dissipation in the device.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time at peak temperature ensures reliable soldering and prevents damage to the component.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for secure soldering and long-term stability of the component.

Technical Specifications

Power Field Effect Transistors (FET) IRLR7807ZPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

28 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

43 A

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.0138 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

170 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRLR7807ZPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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