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IRL6342PBF

Infineon Technologies

IRL6342PBF by Infineon Technologies

IRL6342PBF by Infineon Technologies is a N-CHANNEL Power FET with 30V DS Breakdown Voltage and 0.0146 ohm RDS(ON). Ideal for SWITCHING applications, it features 79A IDM and 9.9A ID, in a PLASTIC/EPOXY package with GULL WING terminals.

Median Price

$0.215

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$0.215

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100

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Chip Stock

USA . 19,700 parts In-Stock

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19,700

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Vyrian

USA . 919 parts In-Stock

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Digiode

USA . 683 parts In-Stock

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683

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LIBRA Elektronik GmbH

Germany . 437 parts In-Stock

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437

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Pegasus Components GmbH

Germany . 76 parts In-Stock

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76

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Sensible Micro Corp

USA . 20 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 3,707 parts In-Stock

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$0.215

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$0.211

3,707

$0.215

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Argo Parts USA

USA . 2,384 parts In-Stock

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$0.215

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$0.209

2,384

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Netroflash

USA . 100 parts In-Stock

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$0.215

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$0.211

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100

$0.215

$0.211

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Modulus Dynamics

Lithuania . 8,785 parts In-Stock

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$1.199

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$1.151

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$1.103

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8,785

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$1.234

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$1.123

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$1.012

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350

$1.234

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AZTECH Wire

Italy . 675 parts In-Stock

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$4.885

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Ampacity Inc.

Singapore . 1,113 parts In-Stock

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$42.050

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Metaverse IC Inc.

Canada . 99,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 25,149 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,928 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,285 parts In-Stock

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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2,700

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Glotronic Ltd.

UK . 1,965 parts In-Stock

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Corphita

USA . 288 parts In-Stock

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Overview

Looking for a reliable power field effect transistor for your switching applications? Look no further than the IRL6342PBF by Infineon Technologies. With a high-quality design and a maximum pulsing drain current of 79A, this N-channel transistor offers exceptional performance and durability. Whether you're working on industrial equipment or automotive systems, this single configuration FET with a built-in diode is sure to meet your needs. Trust in Infineon Technologies for top-notch components that deliver value and efficiency. Upgrade your projects with the IRL6342PBF today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product durable and resistant to environmental factors.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON resistance and higher efficiency, making them a popular choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures efficient and reliable performance.

Surface Mount: YES

Being surface mountable makes the installation process easy and allows for compact designs in electronic circuits.

Minimum DS Breakdown Voltage: 30 V

With a high breakdown voltage, this FET can handle higher voltage levels without breakdown.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and efficient use of board space.

Terminal Form: GULL WING

Gull wing terminals provide a reliable connection and allow for easy soldering onto circuit boards.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy control over the switching operation and high efficiency.

Maximum Pulsed Drain Current (IDM): 79 A

The high pulsed drain current rating allows for reliable operation under peak load conditions.

Maximum Drain Current (Abs) (ID): 9.9 A

With a high drain current rating, this FET can handle high current applications with ease.

No. of Terminals: 8

The 8 terminals provide flexibility in circuit connections and enable the FET to be used in a variety of configurations.

Maximum Power Dissipation (Abs): 2.5 W

The high power dissipation rating ensures reliable operation under continuous load conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and allows for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high speed switching and low power consumption, ideal for modern electronic devices.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can withstand elevated temperatures without performance degradation.

Transistor Element Material: SILICON

Silicon-based transistors are reliable and widely used in electronic applications due to their performance and durability.

Maximum Drain-Source On Resistance: 0.0146 ohm

The low ON resistance minimizes power loss and ensures efficient operation in both switching and conduction states.

Terminal Position: DUAL

Dual terminal positions allow for versatile mounting options and enable the FET to be used in different circuit configurations.

Technical Specifications

Power Field Effect Transistors (FET) IRL6342PBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

HIGH RELIABILITY

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

9.9 A

Maximum Drain Current (ID):

9.9 A

Maximum Drain-Source On Resistance:

.0146 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

MS-012AA

JESD-30 Code:

R-PDSO-G8

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

79 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRL6342PBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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