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IRL530NSTRRPBF

Infineon Technologies

IRL530NSTRRPBF by Infineon Technologies

Infineon Technologies' IRL530NSTRRPBF is a N-CHANNEL FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 17A Max ID, 0.12 ohm RDS(on), and 60A IDM. With ENHANCEMENT MODE operation and PLASTIC/EPOXY package, it offers high performance in various electronic systems.

Median Price

$0.726

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 800 parts In-Stock

1+ parts

$0.865

100+ parts

$0.593

1k+ parts

$0.500

10k+ parts

$0.461

800

$0.865

$0.593

$0.500

$0.461

Rochester

USA . 3,952 parts In-Stock

1+ parts

-

100+ parts

$0.726

1k+ parts

$0.602

10k+ parts

$0.537

3,952

-

$0.726

$0.602

$0.537

Verical

USA . 2,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.753

10k+ parts

$0.671

2,400

-

-

$0.753

$0.671

Mouser Electronics

USA . 940 parts In-Stock

1+ parts

-

100+ parts

-

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$0.611

10k+ parts

$0.563

940

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-

$0.611

$0.563

Chip1Stop

Japan . 800 parts In-Stock

1+ parts

-

100+ parts

-

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$0.479

10k+ parts

-

800

-

-

$0.479

-

Distributors (In-Stock)

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Digiode

USA . 613 parts In-Stock

1+ parts

$0.565

100+ parts

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613

$0.565

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Vyrian

USA . 1,924 parts In-Stock

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1,924

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Nova Conductors

Japan . 43 parts In-Stock

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43

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,251 parts In-Stock

1+ parts

$0.407

100+ parts

-

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2,251

$0.407

-

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Corphita

USA . 168 parts In-Stock

1+ parts

$0.536

100+ parts

-

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168

$0.536

-

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Modulus Dynamics

Lithuania . 10,323 parts In-Stock

1+ parts

$1.148

100+ parts

$1.102

1k+ parts

$1.056

10k+ parts

-

10,323

$1.148

$1.102

$1.056

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Infinite Electronics LLP (Excess)

. 22,410 parts In-Stock

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22,410

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Glotronic Ltd.

UK . 3,200 parts In-Stock

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3,200

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Perfect Parts

USA . 1,792 parts In-Stock

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1,792

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Microchip USA

USA . 1,368 parts In-Stock

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1,368

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Overview

Unleash the power of innovation with the IRL530NSTRRPBF by Infineon Technologies. Crafted with precision and expertise, this Power Field Effect Transistor (FET) offers unparalleled performance in switching applications. With a maximum DS Breakdown Voltage of 100V and a Maximum Drain Current of 17A, this N-CHANNEL transistor ensures efficient operation and reliability. Say goodbye to limitations and hello to endless possibilities with the IRL530NSTRRPBF - where quality meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the transistor lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance characteristics, making this transistor a reliable choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow, enhancing the efficiency and reliability of the system.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers high efficiency and fast switching speeds.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and labor costs.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this transistor can handle higher voltages without breakdown, ensuring reliable operation.

Maximum Pulsed Drain Current (IDM): 60 A

The high pulsed drain current rating allows for handling of peak currents, making this transistor suitable for high-power applications.

Maximum Power Dissipation (Abs): 79 W

With a high power dissipation capability, this transistor can handle significant power loads without overheating.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature makes this transistor suitable for use in environments with elevated temperatures.

Technical Specifications

Power Field Effect Transistors (FET) IRL530NSTRRPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, HIGH RELIABILITY

Avalanche Energy Rating (EAS):

150 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

17 A

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.12 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

60 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRL530NSTRRPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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