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IRFH5025TRPBF

Infineon Technologies

IRFH5025TRPBF by Infineon Technologies

IRFH5025TRPBF by Infineon is a N-CHANNEL FET with 250V DS Breakdown Voltage, ideal for SWITCHING applications. It features 46A IDM and 320mJ EAS, operating in ENHANCEMENT MODE at up to 150°C. With a 0.1 ohm RDS(on), this PLASTIC/EPOXY transistor is suitable for high-power circuit designs.

Median Price

$2.203

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Nova Conductors

Japan . 750 parts In-Stock

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$2.165

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Chip Stock

USA . 5,800 parts In-Stock

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Vyrian

USA . 960 parts In-Stock

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Digiode

USA . 712 parts In-Stock

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Prism Electronics

USA . 75 parts In-Stock

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Bristol Electronics

USA . 20 parts In-Stock

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$2.240

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 13,250 parts In-Stock

1+ parts

$1.020

100+ parts

$0.979

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$0.938

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-

13,250

$1.020

$0.979

$0.938

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Aztec Data Supply Inc.

USA . 4,662 parts In-Stock

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$1.069

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4,662

$1.069

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Corohmni

South Africa . 399 parts In-Stock

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$1.661

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$1.661

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Advanced Electronics

New Zealand . 82 parts In-Stock

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$2.024

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$2.024

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$2.024

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82

$2.024

$2.024

$2.024

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Bastille Electronics

Australia . 120 parts In-Stock

1+ parts

$2.165

100+ parts

$2.057

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$1.954

10k+ parts

$1.927

120

$2.165

$2.057

$1.954

$1.927

Continental Prestige Electronics

USA . 4,221 parts In-Stock

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$2.165

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$2.122

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Argo Parts USA

USA . 3,822 parts In-Stock

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$2.165

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Component Stockers USA

USA . 3,728 parts In-Stock

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$2.590

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$2.460

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$2.380

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3,728

$2.590

$2.460

$2.380

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AZTECH Wire

Italy . 620 parts In-Stock

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$8.669

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$8.669

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Semicontronic

India . 1,102 parts In-Stock

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$27.050

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$26.374

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$26.238

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Ampacity Inc.

Singapore . 356 parts In-Stock

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$28.050

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QUARKTWIN TECHNOLOGY LTD

USA . 18,774 parts In-Stock

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Authorized Procurement Solutions

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Lixinc

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Perfect Parts

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Metaverse IC Inc.

Canada . 7,310 parts In-Stock

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Microchip USA

USA . 2,528 parts In-Stock

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Glotronic Ltd.

UK . 1,965 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,148 parts In-Stock

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GreenTree Electronics

Israel . 497 parts In-Stock

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Corphita

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Overview

Unlock the power of your electronic devices with the IRFH5025TRPBF by Infineon Technologies. Manufactured with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers enhanced switching capabilities for a wide range of applications. The high-quality construction and innovative design ensure reliable performance and efficiency. Experience seamless operation and improved functionality with this cutting-edge component. Elevate your projects with the IRFH5025TRPBF and discover the difference it can make in your electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and heat resistance, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and faster switching speeds, ideal for high-performance circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current flow protection, enhancing the reliability of the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance in such scenarios.

Surface Mount: YES

Surface mount capability enables easy and convenient installation on PCBs, saving space and simplifying the assembly process.

Minimum DS Breakdown Voltage: 250 V

The high breakdown voltage allows for operation in high-voltage circuits, providing an added level of safety.

Package Shape: RECTANGULAR

Rectangular shape provides a compact footprint, ideal for applications with limited space availability.

Avalanche Energy Rating (EAS): 320 mJ

High EAS rating makes this FET suitable for handling high-energy transient events, protecting the circuit from damage.

Maximum Drain Current (Abs) (ID): 32 A

High maximum drain current rating ensures the FET can handle heavy loads without overheating or failing.

Terminal Form: NO LEAD

No-lead terminals offer improved thermal performance and reliability compared to leaded packages.

Maximum Power Dissipation (Abs): 8.3 W

The high power dissipation rating allows the FET to operate at high power levels without thermal runaway.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can be used in a variety of harsh environments without performance degradation.

Transistor Element Material: SILICON

Silicon material ensures high reliability, stability, and performance over a wide range of operating conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring reliable electrical connections.

Maximum Drain-Source On Resistance: 0.1 ohm

Low ON resistance reduces power losses and improves efficiency in high current applications.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit design and layout, enabling various connection options.

Case Connection: DRAIN

Drain connection design simplifies circuit layout and enhances thermal management for improved performance.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time ensures proper soldering and prevents thermal damage to the FET during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability enables reliable soldering in lead-free processes, ensuring robust connections.

Technical Specifications

Power Field Effect Transistors (FET) IRFH5025TRPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

320 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (Abs) (ID):

32 A

Maximum Drain Current (ID):

3.8 A

Maximum Drain-Source On Resistance:

.1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

46 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRFH5025TRPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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